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7591937 |
Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof
The invention relates to a method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting. The invention also relates to the electricity...
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7566482 |
SOI by oxidation of porous silicon
A method in which a SOI substrate structure is fabricated by oxidation of graded porous Si is provided. The graded porous Si is formed by first implanting a dopant (p- or n-type) into a...
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7560016 |
Selectively accelerated plating of metal features
To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the...
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7550071 |
Electrochemical assembly of organic molecules by the reduction of iodonium salts
Methods are described for the electrochemical assembly of organic molecules on silicon, or other conducting or semiconducting substrates, using iodonium salt precursors. Iodonium molecules do not...
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7544281 |
Uniform current distribution for ECP loading of wafers
An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The...
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7540950 |
Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer
An electrically conductive body, which in particular includes a metal and/or an alloy and/or a semiconductor, includes an adhesion promoter layer provided on at least one surface of the...
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7497932 |
Electro-chemical deposition system
The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and...
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7479213 |
Plating method and plating apparatus
A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming...
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7435324 |
Noncontact localized electrochemical deposition of metal thin films
A method of selectively electroplating metal features on a semiconductor substrate having a conductive surface. An electrode assembly that includes a plurality of adjacent, mutually spaced and...
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7425256 |
Selective shield/material flow mechanism
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode...
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7388147 |
Metal contact structure for solar cell and method of manufacture
In a solar cell having p doped regions and n doped regions alternately formed in a surface of a semiconductor wafer in offset levels through use of masking and etching techniques, metal contacts...
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RE40218 |
Electro-chemical deposition system and method of electroplating on substrates
The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the...
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7338585 |
Electroplating chemistries and methods of forming interconnections
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an...
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7332066 |
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate...
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7323094 |
Process for depositing a layer of material on a substrate
An electroplating system ( 30 ) and process makes electrical current density across a semiconductor device substrate ( 20 ) surface more uniform during plating to allow for a more uniform or...
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7316783 |
Method of wiring formation and method for manufacturing electronic components
A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film...
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7314543 |
Tin deposition
A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The...
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7241372 |
Plating apparatus and plating liquid removing method
A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The...
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7229916 |
Method of manufacturing a semiconductor device
A method of manufacturing a semiconductor device is to be provided, which improves filling performance of a conductive layer to be formed by an electrolytic plating process in an interconnect...
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7223323 |
Multi-chemistry plating system
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing...
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7204918 |
High efficiency plating apparatus and method
An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray...
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7198705 |
Plating-rinse-plating process for fabricating copper interconnects
An improved copper ECD process. After the copper seed layer ( 116 ) is formed, a first portion of copper film ( 118 ) is plated onto the surface of the seed layer ( 116 ). The surface of the first...
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7179361 |
Method of forming a mass over a semiconductor substrate
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second...
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7169283 |
Anodization device and anodization method
In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be...
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7166204 |
Plating apparatus and method
A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The...
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7151049 |
Electroplating compositions and methods
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative,...
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7147827 |
Chemical mixing, replenishment, and waste management system
A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container...
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7144490 |
Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
A method for selective electroplating of a semiconductor input/output (I/O) pad includes forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer...
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7125458 |
Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer
A simple and direct method of forming a SiGe-on-insulator that relies on the oxidation of a porous silicon layer (or region) that is created beneath a Ge-containing layer is provided. The method...
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7108776 |
Plating apparatus and plating method
In the invention, there is provided a plating treatment technique which permits uniform plating treatment and easy replacement of articles to be plated without the effect of bubbles in a plating...
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7070686 |
Dynamically variable field shaping element
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a...
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7001471 |
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal...
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6974531 |
Method for electroplating on resistive substrates
A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the...
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6972081 |
Fabrication of embedded vertical spiral inductor for multichip module (MCM) package
A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a...
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6946065 |
Process for electroplating metal into microscopic recessed features
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is...
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6942780 |
Method and apparatus for processing a substrate with minimal edge exclusion
An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer...
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6936153 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto...
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6913681 |
Plating method and plating apparatus
A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to...
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6899796 |
Partially filling copper seed layer
A two-step method of filling copper into a high-aspect ratio via or dual-damascene structure. The first step sputters at a low temperature of no more than 100° C. and with at least portions of...
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6897152 |
Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated...
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6884335 |
Electroplating using DC current interruption and variable rotation rate
A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer...
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6867149 |
Growth of multi-component alloy films with controlled graded chemical composition on sub-nanometer scale
The chemical composition of thin films is modulated during their growth. A computer code has been developed to design specific processes for producing a desired chemical composition for various...
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6863795 |
Multi-step method for metal deposition
The invention is related to a method of plating of a metal layer on a substrate. The method is particularly preferred for the formation of metallization structures for integrated circuits.
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6863794 |
Method and apparatus for forming metal layers
A method of forming a metal layer on a substrate is disclosed. The metal layer is formed using a combined electrochemical plating/electrochemical mechanical polishing (ECP/EMP) process. In the...
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6852208 |
Method and apparatus for full surface electrotreating of a wafer
Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to...
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6849173 |
Technique to enhance the yield of copper interconnections
A method of forming an oxide free copper interconnect, comprising the following steps. A substrate is provided and a patterned dielectric layer is formed over the substrate. The patterned...
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6846578 |
Method of colloid crystal growth on patterned surfaces
Method of synthesis of confined colloidal crystals using electrodeposition. The present invention provides a method of growing confined colloidal crystal structures using electrodeposition of...
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6827835 |
Method for electroplated metal annealing process
A method for electroplated metal annealing process. First, a semiconductor structure is provided, wherein the semiconductor structure has a plurality of semiconductor components, such as a gate...
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6825512 |
Micromachined sensor with insulating protection of connections
An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically...
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6814849 |
Luminescence stabilization of anodically oxidized porous silicon layers
A porous silicon structure is stabilized by anodically oxidizing the structure and then subjecting it to chemical functionalization to protect non-oxidized surface regions, preferably in the...
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