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7498062 |
Method and apparatus for applying a voltage to a substrate during plating
A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set...
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7435323 |
Method for controlling thickness uniformity of electroplated layers
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode...
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7404885 |
Plating method and electronic device
A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming,...
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7344630 |
Method and apparatus for electroplating small workpieces
A method for electroplating small workpieces includes the steps of: (A) providing a rotatable barrel which has an axis of rotation and a plurality of spaced-apart partition plates disposed one...
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7323095 |
Integrated multi-step gap fill and all feature planarization for conductive materials
A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc,...
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7306710 |
Apparatus and method for electroplating a metallic film on a rocket engine combustion chamber component
A tank is utilized for containing a plating solution. A rotatable support assembly rotatably supports a combustion chamber component relative to the tank for providing partial immersion of the...
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7288179 |
Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft...
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7217353 |
Method and apparatus for plating substrate
After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved...
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7208073 |
Media for use in plating electronic components
Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the...
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7204924 |
Method and apparatus to deposit layers with uniform properties
The present invention provides a method for forming a conductive film with uniform properties on a wafer surface that has features or cavities. During the process, the workpiece is rotated and...
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7166204 |
Plating apparatus and method
A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The...
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7112268 |
Plating device and plating method
A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated. The plating device includes: a plating...
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7045050 |
Method for producing electroconductive particles
The purpose of the invention is to provide a method for producing conductive fine particles having a plating layer of extremely uniform thickness and free from scratches without being accompanied...
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6942781 |
Method for electroplating a strip of foam
A method for electroplating a strip of foam having two opposite sides and an electrically conductive surface, including: (a) continuously applying the strip of foam onto a moving cathode immersed...
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6936153 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto...
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6923898 |
Electroplating device, and process for electroplating work using the device
An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis...
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6890412 |
Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles
A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through...
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6884335 |
Electroplating using DC current interruption and variable rotation rate
A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer...
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6855239 |
Plating method and apparatus using contactless electrode
A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an...
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6841191 |
Varistor and fabricating method of zinc phosphate insulation for the same
A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer...
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6827834 |
Non-cyanide copper plating process for zinc and zinc alloys
The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article...
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6776885 |
Integrated plating and planarization apparatus having a variable-diameter counterelectrode
An apparatus for plating and planarizing metal on a substrate includes a plurality of dispensing segments, each having at least one hole for dispensing electroplating solution onto the substrate....
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6773570 |
Integrated plating and planarization process and apparatus therefor
A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper)...
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6720084 |
Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image
A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in...
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6692630 |
Electroplated aluminum parts and process for production
The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the...
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6669834 |
Method for high deposition rate solder electroplating on a microelectronic workpiece
The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate...
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6663762 |
Plating system workpiece support having workpiece engaging electrode
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto...
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6652726 |
Method for reducing wafer edge defects in an electrodeposition process
A method for reducing or avoiding semiconductor wafer peripheral defects and contamination during and following electrodeposition including providing a wafer chuck assembly sealably attached to a...
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6652728 |
Cyanide-free aqueous alkaline bath used for the galvanic application of zinc or zinc-alloy coatings
An aqueous alkaline cyanide-free bath for the galvanic deposition of zinc or zinc alloy coatings on substrate surfaces is described, which contains in addition to a source of zinc ions and...
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6649038 |
Electroplating method
Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
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6599412 |
In-situ cleaning processes for semiconductor electroplating electrodes
Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring !the manual removal of the electrodes from the semiconductor...
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6562217 |
Method and device for manufacturing conductive particles
A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid....
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6558524 |
Barrel plating method and apparatus
A plating barrel includes a rotatable barrel of which the exterior shape is approximately a hexagonal column, cathode-lead connections which penetrate through end surfaces of the barrel generally...
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6551487 |
Methods and apparatus for controlled-angle wafer immersion
The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to...
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6544663 |
Electrodeposited copper foil
An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an...
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6506509 |
Selective codeposition of particulate matter and plated articles thereof
The present invention relates to composite electroless coatings with varying densities of codeposited particles in the plated layer along the surface of the substrate where said variation of...
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6500316 |
Apparatus for rotary cathode electroplating with wireless power transfer
An apparatus for rotary cathode electroplating having a head assembly, a substrate/thief assembly having a thieving ring which includes a number of individually chargeable segments, and a secondary...
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6461494 |
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated...
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6365030 |
Method of manufacturing R-Fe-B bond magnets of high corrosion resistance
A method of manufacturing R—Fe—B bonded magnets, capable of forming various corrosion resisting films on a R—Fe—B bonded magnet uniformly with a very high bonded strength so as to attain...
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6361676 |
Technique for manufacturing electronic parts
A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique...
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6322685 |
Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
A method using an electrically nonconductive cathode chamber with at least part of its wall area rendered permeable to ions and electrolytic solutions; premixing a predetermined quantity of an...
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6299750 |
Coating method for elongated metal blanks
A method based on superfinishing for coating elongated metal blanks. The blanks have at least two axially aligned portions with varying cross-sections, wherein particles of a hard substance...
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6287444 |
Method for producing very small metal ball
An efficient method for producing a high-precision, very small metal ball, such as a Cu ball having an outer diameter not greater than 1 mm, comprising the steps of: cutting metal wire having a...
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6228242 |
Process and plant for electrolytically coating surface of a roll, for the continuous casting of thin metal strip, with a metal laser
Both a process and plant are provided for electrolytically coating with a metal layer the casting surface of a roll for twin-roll or single-roll continuous casting of thin metal strip. The casting...
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6139712 |
Method of depositing metal layer
An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the...
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6126798 |
Electroplating anode including membrane partition system and method of preventing passivation of same
An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base...
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6103085 |
Electroplating uniformity by diffuser design
Workpieces, such as semiconductor wafers, are electroplated with improved thickness uniformity by providing a diffuser member intermediate the cathode and anode of a fountain-type electroplating...
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6090262 |
Barrel plating method
A barrel plating method wherein each box containing pieces to be plated is provided with a kanban corresponding to the pieces contained in the box. The kanban of each box is read by an apparatus...
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6083376 |
Rotating system for electrochemical treatment of semiconductor wafers
An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly...
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6077412 |
Rotating anode for a wafer processing chamber
A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is...
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