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7585541 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7537663 |
Corrosion-inhibiting coating
A corrosion-inhibiting coating, process, and system that provides a tight, adherent zinc- or zinc-alloy coating that is directly deposited onto steel or cast iron surfaces for enhanced corrosion...
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7520054 |
Process of manufacturing high frequency device packages
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a...
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and...
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7370415 |
Manufacturing method of ink-jet head
A method for manufacturing an inkjet print head with ink channels formed on a member including a piezoelectric body, and where ink is jetted from each of the ink channels by applying a voltage to...
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7163835 |
Method for producing thin semiconductor films by deposition from solution
A method is described for producing thin semiconductor films on a substrate by contacting a substrate with a solution containing a metal salt, a source of a Group VIa element, and chelating agent,...
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7067172 |
Component formation via plating technology
Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic...
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6977130 |
Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and...
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6863936 |
Method of forming selective electroless plating on polymer surfaces
A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated...
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6821324 |
Cobalt tungsten phosphorus electroless deposition process and materials
Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten. ...
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6740425 |
Method for manufacturing copper-resin composite material
A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin...
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6740222 |
Method of manufacturing a printed wiring board having a discontinuous plating layer
The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core...
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6609297 |
Method of manufacturing multilayer printed wiring board
A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30 b and an opening 3 a through which a via hole is formed. A camera senses this register...
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6582581 |
Sequential build circuit board plating process
A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The...
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6569491 |
Platable dielectric materials for microvia technology
A dielectric coating for a circuit board which is adherent to electroless copper. The coating is an epoxy dielectric including an amount of a solubilized nitrile-free butadiene or isoprene agent...
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6560863 |
Method of producing wiring board
A method of producing a wiring board having a plurality of wiring layers each being located on an electrical insulation layer, in which an electrical insulation layer is formed on a substrate using...
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6524490 |
Method for electroless copper deposition using a hypophosphite reducing agent
A method for improving the electrical conductivity and appearance of copper films produced by reduction of copper ions using hypophosphite, comprising exposure of the as-deposited copper film to a...
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6517894 |
Method for plating a first layer on a substrate and a second layer on the first layer
A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material...
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6495019 |
Device comprising micromagnetic components for power applications and process for forming device
The process is provided involving formation of multilayer components in which a photoresist-type material is used not only as a conventional patterning material, but also as an insulating and/or...
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6472023 |
Seed layer of copper interconnection via displacement
A process for the fabrication of submicron copper interconnection useful on IC structures without deposition of copper seed is described. A dense metal layer can be deposited through contact...
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6461678 |
Process for metallization of a substrate by curing a catalyst applied thereto
An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the...
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6436803 |
Manufacturing computer systems with fine line circuitized substrates
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A...
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6405431 |
Method for manufacturing build-up multi-layer printed circuit board by using yag laser
A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such...
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6379871 |
Method for fabricating a mask for a LIGA process
In a method for manufacturing a LIGA process mask, a plating-resistant layer is caused to intervene between a plating seed layer and a resist layer and patterning is performed of the resist layer.
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6378201 |
Method for making a printed circuit board
A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of...
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6376049 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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6370768 |
Circuit board, a method for manufacturing same, and a method of electroless plating
A circuit board is provided, wherein electroless plating to fill via-holes can be controlled uniformly with desirable reproducibility, and via-hole portions can be identified from the surface of...
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6300244 |
Semiconductor device and method of manufacturing the same
When a wiring conductor is formed on a semiconductor substrate, a via-hole or a trench is formed by directly performing electroless plating on a barrier layer containing a very small depressed...
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6254758 |
Method of forming conductor pattern on wiring board
A method of forming a conductor pattern on a wiring board, in which a conductor pattern forming process on the wiring board can be simplified; and an interval between the conductor patterns can be...
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6240636 |
Method for producing vias in the manufacture of printed circuit boards
In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating...
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6231619 |
Electroplating process
A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then...
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6221229 |
Method for forming metal conductor patterns on electrically insulating substrates and supports
In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate...
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6162365 |
Pd etch mask for copper circuitization
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a...
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6127052 |
Substrate and method for producing it
A substrate wherein a layer comprising a principal component of nickel and a layer comprising a principal component of palladium are deposited on a glass substrate and wherein an electroconductive...
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6100178 |
Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface...
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6093443 |
Process for producing a ceramic-metal substrate
The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating,...
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6057027 |
Method of making peripheral low inductance interconnects with reduced contamination
A method for making a circuit device having at least one peripheral interconnect for electrically connecting the device to another circuit device on a motherboard, includes forming at least one...
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6035527 |
Method for the production of printed circuit boards
A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in...
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6022466 |
Process of plating selective areas on a printed circuit board
A process for plating gold on a multi-layered printed circuit board, having plated copper on an external surface. In one embodiment, first copper features for plating gold thereon and second copper...
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6017438 |
Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor
A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a...
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5948233 |
Method of manufacturing an electric component which can be mounted on the surface of a printed circuit board
Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components. The invention relates to an electric component (surface...
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5919514 |
Process for preparing electroded donor rolls
A process for preparing a toner donor roll having an integral electrode pattern involving: (a) providing a cylindrically shaped insulating member; (b) coating the insulating member with a photo or...
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5869126 |
Process for the manufacture of printed circuit boards
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
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5863406 |
Method of manufacturing a printed circuit board
A method of manufacturing a printed circuit board adapted for having surface mounted components positioned thereon including the step of selectively electroplating a thick solder layer (340) onto...
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5863405 |
Process for forming conductive circuit on the surface of molded article
Conductive circuits are formed by first metallizing a surface of a molded synthetic resin substrate to form an electrically conductive metallic film coating thereon of a thickness (e.g., between...
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5837427 |
Method for manufacturing build-up multi-layer printed circuit board
A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip...
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5770032 |
Metallizing process
A process for metallizing a surface of a substrate. Preferably, the substrate is composed of a dielectric material such as a circuit board which has copper cladding on at least one face and at...
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5761802 |
Multi-layer electrical interconnection method
A method for electrically interconnecting a first electrical conductor to a second electrical conductor through a via formed in an insulating layer disposed between the conductors. A refractory...
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5706999 |
Preparation of a coated metal-matrix composite material
A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat...
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5705219 |
Method for coating surfaces with finely particulate materials
A method for coating surfaces of a non-conductor with finely particulate solid particles by substrate-induced coagulation, including the steps of: contacting the non-conductor with a first solution...
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