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7596855 |
Method for manufacturing a magnetic head
A thin film magnetic head capable of shortening a manufacturing time and a method of manufacturing the same are provided. After forming a write gap layer by using a non-magnetic conductive material...
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7592706 |
Multi-layer circuit board with fine pitches and fabricating method thereof
A method for fabricating a multi-layer circuit board with fine pitch is provided. First, a plurality of contact pads is disposed on a core substrate. Next, a first dielectric layer, a second...
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7585541 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7553401 |
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow...
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7524429 |
Method of manufacturing double-sided printed circuit board
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad...
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7520054 |
Process of manufacturing high frequency device packages
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a...
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7514022 |
Composite plated product and method for producing same
There is provided a composite plated product which has a large content of carbon and a large quantity of carbon particles on the surface thereof and which has an excellent wear resistance, by...
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7429400 |
Method of using ultrasonics to plate silver
A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied...
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7405146 |
Electroplating method by transmitting electric current from a ball side
An electroplating method by transmitting electric current from a ball side is provided. In the electroplating method, the circuit layer is firstly formed on the bump side of the IC board, and the...
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7393473 |
Method for producing a composite plated product
There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a...
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7387717 |
Method of performing electrolytic treatment on a conductive layer of a substrate
A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion ...
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7374652 |
Plating method
Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a...
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7370406 |
Method of manufacturing a thin film structure
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
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7354675 |
Apparatus and method for maintaining compression of the active area in an electrochemical cell
An electrochemical cell includes a first electrode, a second electrode, a proton exchange membrane disposed between and in intimate contact with the electrodes, and a pressure pad disposed in...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7350294 |
Method of electroplating a plurality of conductive fingers
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
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7323093 |
Producing method of flexible wired circuit board
A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the...
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7316783 |
Method of wiring formation and method for manufacturing electronic components
A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film...
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7307022 |
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof
A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one...
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7273538 |
Surface mountable laminated circuit protection device and method of making the same
A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a...
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7270734 |
Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating
The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this...
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7267755 |
Method of making a microstructure using a circuit board
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure...
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7258808 |
High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and...
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7247226 |
Coating support and method for the selective coating of conductive tracks on one such support
The present invention concerns a lining support comprising a plurality of conductive pads ( 12 ) associated with a shared addressing contact ( 18 ) and means of selecting at least one pad to be...
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7226531 |
Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface...
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7220347 |
Electrolytic copper plating bath and plating process therewith
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an...
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7217464 |
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method
The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by...
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7214304 |
Process for preparing a non-conductive substrate for electroplating
A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial...
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7213333 |
Method for manufacturing mounting substrate and method for manufacturing circuit device
Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for...
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7204918 |
High efficiency plating apparatus and method
An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray...
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7189302 |
Multi-layer printed circuit board and fabricating method thereof
A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal...
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7128820 |
Process for preparing a non-conductive substrate for electroplating
A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion...
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7105082 |
Composition and method for electrodeposition of metal on a work piece
A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a...
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7093356 |
Method for producing wiring substrate
A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching...
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7082655 |
Process for plating a piezoelectric composite
A transducer having a ceramic element in which the ceramic is elevated above a polymer and a method of manufacturing the transducer. The transducer comprises a piezo-composite element comprising a...
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7071026 |
Production method for making film carrier tape for mounting electronic devices thereon
A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof....
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7070687 |
Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a...
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7070686 |
Dynamically variable field shaping element
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a...
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7041591 |
Method for fabricating semiconductor package substrate with plated metal layer over conductive pad
A method for fabricating a semiconductor package substrate having a plated metal layer on a conductive pad is proposed. First of all, a first resist layer is formed on a semiconductor package...
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7034688 |
Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation fo devices thereby are provided. The method involves selectively exposing the...
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7025867 |
Direct electrolytic metallization on non-conducting substrates
The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a...
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7005054 |
Method for manufacturing probes of a probe card
A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a...
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6977035 |
Method for electrolytic copper plating
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from...
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6951604 |
Production method for flexible printed board
A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method...
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6935018 |
Copper plated invar with acid preclean
A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar,...
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6931724 |
Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
A method of producing a multilayered substrate having: a first face being provided with pads bondable to electrode terminals of a semiconductor element, and a body containing a plurality of wiring...
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6905589 |
Circuitized substrate and method of making same
A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate...
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6902659 |
Method and apparatus for electro-chemical mechanical deposition
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the...
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6899829 |
Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate...
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6896784 |
Method for controlling local current to achieve uniform plating thickness
A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the...
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