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7604727 |
Electroplating method for a semiconductor device
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is...
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7585424 |
Pattern reversal process for self aligned imprint lithography and device
This invention provides a pattern reversal process for self aligned imprint lithography (SAIL). The method includes providing a substrate and depositing at least one layer of material upon the...
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7566482 |
SOI by oxidation of porous silicon
A method in which a SOI substrate structure is fabricated by oxidation of graded porous Si is provided. The graded porous Si is formed by first implanting a dopant (p- or n-type) into a...
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7560016 |
Selectively accelerated plating of metal features
To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the...
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7553401 |
Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow...
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7544281 |
Uniform current distribution for ECP loading of wafers
An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The...
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7462269 |
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal...
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7456030 |
Electroforming technique for the formation of high frequency performance ferromagnetic films
A hybrid method of fabricating magnetic core elements of an on-chip inductor structure addresses issues associated with conventional bottom up and damascene magnetic core plating techniques. The...
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7449098 |
Method for planar electroplating
A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified...
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7438794 |
Method of copper electroplating to improve gapfill
A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating...
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7435323 |
Method for controlling thickness uniformity of electroplated layers
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode...
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7431817 |
Electroplating solution for gold-tin eutectic alloy
The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic...
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7425250 |
Electrochemical mechanical processing apparatus
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer...
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7405163 |
Selectively accelerated plating of metal features
An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration...
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7396447 |
Through-hole conductors for semiconductor substrates and system for making same
A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to...
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7388147 |
Metal contact structure for solar cell and method of manufacture
In a solar cell having p doped regions and n doped regions alternately formed in a surface of a semiconductor wafer in offset levels through use of masking and etching techniques, metal contacts...
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7387717 |
Method of performing electrolytic treatment on a conductive layer of a substrate
A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion ...
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7370406 |
Method of manufacturing a thin film structure
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
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7357850 |
Electroplating apparatus with segmented anode array
An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The...
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RE40218 |
Electro-chemical deposition system and method of electroplating on substrates
The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the...
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7338585 |
Electroplating chemistries and methods of forming interconnections
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an...
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7335288 |
Methods for depositing copper on a noble metal layer of a work piece
Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The...
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7323097 |
Electroplating method for a semiconductor device
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is...
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7323094 |
Process for depositing a layer of material on a substrate
An electroplating system ( 30 ) and process makes electrical current density across a semiconductor device substrate ( 20 ) surface more uniform during plating to allow for a more uniform or...
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7316783 |
Method of wiring formation and method for manufacturing electronic components
A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film...
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7316772 |
Defect reduction in electrodeposited copper for semiconductor applications
A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating...
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7314543 |
Tin deposition
A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The...
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7309413 |
Providing electrical contact to the surface of a semiconductor workpiece during processing
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be...
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7300562 |
Platinum alloy using electrochemical deposition
The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy...
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7288179 |
Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft...
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7270734 |
Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating
The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this...
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7267749 |
Workpiece processor having processing chamber with improved processing fluid flow
A processing container ( 610 ) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container...
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7254885 |
Wafer-level fabrication method for top or side slider bond pads
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises...
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7252750 |
Dual contact ring and method for metal ECP process
A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge...
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7232513 |
Electroplating bath containing wetting agent for defect reduction
An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid...
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7224039 |
Polymer nanocomposite structures for integrated circuits
In accordance with certain embodiments consistent with the present invention, diamond nanoparticles are mixed with polymers. This mixture is expected to provide improved properties in interlayer...
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7220347 |
Electrolytic copper plating bath and plating process therewith
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an...
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7217353 |
Method and apparatus for plating substrate
After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved...
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7214305 |
Method of manufacturing electronic device
Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of...
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7211175 |
Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
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7204918 |
High efficiency plating apparatus and method
An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray...
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7201829 |
Mask plate design
The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate...
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7198705 |
Plating-rinse-plating process for fabricating copper interconnects
An improved copper ECD process. After the copper seed layer ( 116 ) is formed, a first portion of copper film ( 118 ) is plated onto the surface of the seed layer ( 116 ). The surface of the first...
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7189317 |
Semiconductor manufacturing system for forming metallization layer
A method for forming a metallization layer. A first layer is formed outwardly from a semiconductor substrate. Contact vias are formed through the first layer to the semiconductor substrate. A...
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7179361 |
Method of forming a mass over a semiconductor substrate
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second...
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7166232 |
Method for producing a solid body including a microstructure
According to a method for producing a solid body ( 1 ) including a microstructure ( 2 ), the surface of a substrate ( 3 ) is provided with a masking layer ( 6 ) that is impermeable to a substance...
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7163613 |
Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses
There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect...
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7147827 |
Chemical mixing, replenishment, and waste management system
A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container...
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7147766 |
Chip interconnect and packaging deposition methods and structures
The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a...
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7144490 |
Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
A method for selective electroplating of a semiconductor input/output (I/O) pad includes forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer...
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