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7618525 |
Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b)...
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7615141 |
Electrochemical micromanufacturing system and method
An electrochemical printing system ( 100, 200 ) and method are disclosed having a printer head ( 130, 230 ) that expels a small jet of electrolyte ( 112 ) towards a conductive substrate ( 92 ) to...
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7611616 |
Mesoscale and microscale device fabrication methods using split structures and alignment elements
Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers...
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7585424 |
Pattern reversal process for self aligned imprint lithography and device
This invention provides a pattern reversal process for self aligned imprint lithography (SAIL). The method includes providing a substrate and depositing at least one layer of material upon the...
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7563353 |
Method of forming Sn-Ag-Cu ternary alloy thin-film on base material
A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a...
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7560015 |
Process for electrolytic coating of a strand casting mould
Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended...
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7537663 |
Corrosion-inhibiting coating
A corrosion-inhibiting coating, process, and system that provides a tight, adherent zinc- or zinc-alloy coating that is directly deposited onto steel or cast iron surfaces for enhanced corrosion...
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7534337 |
Substrate before insulation, method of manufacturing substrate, method of manufacturing surface acoustic wave transducer, surface acoustic wave device, and electronic equipment
A substrate before an insulation process, which is provided with a protection film to prevent a part of a surface area, which has electrical conductivity from being insulated, the substrate...
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7531077 |
Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe....
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7524427 |
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments...
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7504014 |
High density interconnections with nanowiring
The present invention generally relates to circuits on the nanotechnology scale. Specifically, it is directed to methods of fabricating carbon nanotube-based (i.e., CNT-based) circuits. The method...
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7473328 |
Composite alloy having a three-dimensional periodic hierarchical structure and method of producing the same
A composite alloy has a three-dimensional periodic hierarchical structure having hard and soft metallic phases periodically arranged with a period having a length ranging from a nanometer scale to...
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7462270 |
Cantilever probes for nanoscale magnetic and atomic force microscopy
The various embodiments discloses a cantilever probe comprising a first electrode and a second electrode engaged to a substrate and a branched cantilever wherein the cantilever comprises a...
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7459198 |
Stress relief for electroplated films
An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a...
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7449098 |
Method for planar electroplating
A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified...
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7435324 |
Noncontact localized electrochemical deposition of metal thin films
A method of selectively electroplating metal features on a semiconductor substrate having a conductive surface. An electrode assembly that includes a plurality of adjacent, mutually spaced and...
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7431817 |
Electroplating solution for gold-tin eutectic alloy
The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic...
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7422696 |
Multicomponent nanorods
Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the...
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7402231 |
Method and apparatus for partially plating work surfaces
For partially plating work surfaces, a tubular shield member is set around a work which is connected to a cathode, in face to face and in predetermined small gap relation with a non-plating surface...
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7396447 |
Through-hole conductors for semiconductor substrates and system for making same
A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to...
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7384531 |
Plated ground features for integrated lead suspensions
A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a...
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7384530 |
Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials
The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of...
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7375014 |
Methods of electrochemically treating semiconductor substrates
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second...
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7368045 |
Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate,...
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7368044 |
Non-conformable masks and methods and apparatus for forming three-dimensional structures
Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used...
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7364649 |
Method of producing the keytop for pushbutton switch
According to a method of producing a key top for a pushbutton switch of the present invention, a base layer made of an insulating resin that can be plated with metal, an electroless plating layer...
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7351448 |
Anti-reflective coating on patterned metals or metallic surfaces
An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than...
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7351321 |
Method for electrochemical fabrication
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b)...
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7338613 |
System and process for automated microcontact printing
An automated process for microcontact printing is provided, comprising the steps of providing a substrate and a stamp; automatically aligning the substrate and stamp so that the stamp is aligned...
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7338585 |
Electroplating chemistries and methods of forming interconnections
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an...
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7326327 |
Rhodium electroplated structures and methods of making same
A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that...
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7316772 |
Defect reduction in electrodeposited copper for semiconductor applications
A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating...
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7303663 |
Multistep release method for electrochemically fabricated structures
Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a...
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7297247 |
Electroformed sputtering target
A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is...
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7288327 |
Plated structures or components
Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a...
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7288320 |
Microstructured taggant particles, applications and methods of making the same
Microstructured taggant particles, their applications and methods of making the same are described. Precisely formed taggant particles can be formed, in the range of 500μ and smaller, from either...
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7288178 |
Methods of and apparatus for making high aspect ratio microelectromechanical structures
Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion...
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7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the...
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7270734 |
Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating
The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this...
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7255782 |
Selective catalytic activation of non-conductive substrates
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided....
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7252861 |
Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids...
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7250101 |
Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise...
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7235166 |
Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a...
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7226531 |
Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface...
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7220347 |
Electrolytic copper plating bath and plating process therewith
An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an...
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7217353 |
Method and apparatus for plating substrate
After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved...
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7214440 |
Metallic separator for fuel cell and production method for the same
A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The...
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7214304 |
Process for preparing a non-conductive substrate for electroplating
A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial...
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7198704 |
Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures
Disclosed methods reduce the discontinuities between individual layers of a structure that are formed at least in part using electrochemical fabrication techniques. Discontinuities may exist...
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7194798 |
Method for use in making a write coil of magnetic head
Methods suitable for use in making a write coil of a magnetic head includes the steps of forming a seed layer made of ruthenium (Ru) over a substrate; forming, over the seed layer, a patterned...
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