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7582199 |
Plating method
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current...
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7569131 |
Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process
A method for multi-layer electrodeposition in a single bath is also provided. A substrate is immersed in a bath. An electrodeposition operation is initiated for depositing a first layer of material...
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7544282 |
Method for filling material separations on a surface
Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often...
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7465385 |
Gold alloy electrolytes
Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which...
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7462270 |
Cantilever probes for nanoscale magnetic and atomic force microscopy
The various embodiments discloses a cantilever probe comprising a first electrode and a second electrode engaged to a substrate and a branched cantilever wherein the cantilever comprises a...
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7396445 |
Method of manufacturing a thin-film magnetic head using a soft magnetic film having high saturation magnetic flux density
A soft magnetic film is formed of a CoFe alloy having an Fe content in the range of 68 to 80 mass %, thereby having a saturation magnetic flux density of 2.0 T or more. The center lain average...
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7381318 |
Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom
Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a...
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7309412 |
Compositions and coatings including quasicrystals
Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the...
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7309411 |
Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt...
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7220346 |
Methods for fabricating metal nanowires
Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition...
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7195700 |
Method of electroplating copper layers with flat topography
A method of electrochemically filling features on a wafer surface to form a substantially planar copper layer is provided. The features to be filled includes a first feature that is an unfilled...
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7179360 |
Soft magnetic film having improved saturated magnetic flux density, magnetic head using the same, and manufacturing method therefore
A lower magnetic pole layer and/or an upper magnetic pole layer are formed of a CoFeα alloy in which the component ratio X of Co is 8 to 48 mass %, the component ratio Y of Fe is 50 to 90 mass %,...
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7135103 |
Preparation of soft magnetic thin film
A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt...
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7060176 |
Method and apparatus for anodizing objects
A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component....
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6974531 |
Method for electroplating on resistive substrates
A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the...
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6946065 |
Process for electroplating metal into microscopic recessed features
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is...
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6921551 |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a...
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6919010 |
Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is...
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6913680 |
Method of application of electrical biasing to enhance metal deposition
A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the...
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6902827 |
Process for the electrodeposition of low stress nickel-manganese alloys
A process for electrodepositing a low stress nickel-manganese multilayer alloy on an electrically conductive substrate is provided. The process includes the steps of immersing the substrate in an...
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6896783 |
Method for producing material libraries by means of electrochemical deposition
The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of...
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6887365 |
Nanotube cantilever probes for nanoscale magnetic microscopy
The present invention provides an MFM or MRFM analytical device comprising a micro-dimensional probe that is capable of detecting single proton and single electron spin. Furthermore, it provides an...
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6884335 |
Electroplating using DC current interruption and variable rotation rate
A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer...
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6875332 |
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for...
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6858121 |
Method and apparatus for filling low aspect ratio cavities with conductive material at high rate
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on...
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6855240 |
CoFe alloy film and process of making same
A cobalt-iron alloy film having saturation magnetization of at least about 2.30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a...
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6852207 |
Method for producing prosthetic moulded parts for dental use
In a method for manufacture of prosthetic moulded parts for the dental sector with the aid of galvanic metal deposition, deposition at least partly takes place by pulse current. Deposition is...
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6824668 |
Method for electroplating Ni-Fe-P alloys using sulfamate solution
Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel...
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6808612 |
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
A method and apparatus for electrochemically depositing a metal into a high aspect ratio structure on a substrate are provided. In one aspect, a method is provided for processing a substrate...
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6805786 |
Precious alloyed metal solder plating process
A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and...
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6797145 |
Current carrying structure using voltage switchable dielectric material
An electrochemical processing method is provided for forming a current carrying device for semiconductor chip packaging and similar applications. The method comprises selecting sections of a...
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6793796 |
Electroplating process for avoiding defects in metal features of integrated circuit devices
Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density...
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6793795 |
Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing...
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6776891 |
Method of manufacturing an ultra high saturation moment soft magnetic thin film
A method for forming a plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co 100−a−b Fe a M b , where M can be Mo, Cr, W, Ni or Rh, which is...
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6755956 |
Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
A method is described for catalyst-induced growth of carbon nanotubes, nanofibers, and other nanostructures on the tips of nanowires, cantilevers, conductive micro/nanometer structures, wafers and...
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6755955 |
Catalytic converter and method for producing a catalytic converter
A method for producing a catalytic converter includes depositing a layer of catalytically active metallic material by electrochemical deposition on a planar substrate by immersing the substrate in...
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6746591 |
ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature
A method and apparatus for electrochemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode....
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6740221 |
Method of forming copper interconnects
A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.
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6677056 |
Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film
A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of...
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6641710 |
Metal plating method
To provide a method of metal plating to give a metal plating coating with excellent luster and high corrosion resistance and wear resistance. This metal plating method includes pulse plating by...
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6620303 |
Process for making nickel electroforms
It is known to apply a pulse current during electrodeposition of nickel. In the invention, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms...
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6599411 |
Method of electroplating a nickel-iron alloy film with a graduated composition
In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the...
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6569543 |
Copper foil with low profile bond enahncement
A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel...
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6562216 |
Method of coating an internal surface of a weapon barrel
A method of coating a metal surface, particularly an inner surface of a gun barrel, with a chromium layer, includes the following steps: electrolytically precipitating on the metal surface a...
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6551485 |
Electrodeposition of metals for forming three-dimensional microstructures
Microscopic mechanical elements suitable for manufacture of microelectromechanical systems (MEMS) are directly prepared by forming a low-relief base of microscopic dimensions on a substrate surface...
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6551483 |
Method for potential controlled electroplating of fine patterns on semiconductor wafers
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
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6547944 |
Commercial plating of nanolaminates
A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic...
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6534116 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on...
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6516233 |
Pulse plating rectifiers and methods, systems and computer program products for controlling pulse plating rectifiers in master/slave mode
Methods, systems and computer program products for controlling plating pulse rectifiers are provided by identifying one of the plurality of plating pulse rectifiers as a master plating pulse...
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6478944 |
Functional Sn-Bi alloy plating using a substitute material for Pb
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for...
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