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7431815 |
Method to reduce ferric ions in ferrous based plating baths
A process for cathodically reducing unwanted Fe +3 ions to needed Fe +2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3...
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7427344 |
Methods for determining organic component concentrations in an electrolytic solution
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring...
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7371311 |
Modified electroplating solution components in a low-acid electrolyte solution
An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment,...
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7323096 |
Method for treating the surface of object and apparatus thereof
A method for treating the surface of an object to be treated includes introducing a surface treatment fluid into a reaction vessel ( 4 ) capable of receiving an object, introducing-the surface...
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7288170 |
Process for producing a ready-to-use electrolyte
A process is intended to allow simple and particularly reliable electrolyte generation and conditioning from metal-containing used electrolytes and/or used process solutions and/or pulverulent...
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7273539 |
Method for regeneration of an electrolysis bath for the production of a compound I-III-VI2 in thin layers
The invention relates to the regeneration of an electrolysis bath for the production of I-III-VI<SB>Y</SB> compounds in thin layers, where y is approaching 2 and VI is an element...
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7264704 |
Electrolysis cell for restoring the concentration of metal ions in electroplating processes
It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or...
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7186326 |
Efficient analysis of organic additives in an acid copper plating bath
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two...
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7172683 |
Method of managing a plating liquid used in a plating apparatus
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a...
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7166203 |
Controlled concentration electrolysis system
A system for maintaining a concentration range of an electroreducible metal species undergoing electrolysis within a predetermined concentration range comprises a first container containing a body...
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7156972 |
Method for controlling the ferric ion content of a plating bath containing iron
A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution.
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7147827 |
Chemical mixing, replenishment, and waste management system
A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container...
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7122105 |
Use of siderophores to increase the current efficiency of iron plating solutions
A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The...
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7037420 |
Anodic oxidation method and treatment apparatus thereof
The present invention relates to an anodic oxidation method and a treatment apparatus thereof which is suitable, for example, for generation of an oxide film and electropolishing of aluminum,...
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6984300 |
Method for recovering useful components from electrolytic phosphate chemical treatment bath
The present invention provides means for recovering and reusing useful component ions in electrolytic phosphate chemical treatment bath without subjecting them to waste water treatment. In the...
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6977035 |
Method for electrolytic copper plating
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from...
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6942779 |
Method and system for regenerating of plating baths
The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More...
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6921472 |
Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process
A process for dissolving metals, in particular tin, and a plant for dissolving metals operating according to said process allow to minimize the quantity of metal in the sludge and the oxygen...
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6899803 |
Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof
In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox...
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6899802 |
Method for recycling of plating solutions
In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads,...
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6893548 |
Method of conditioning electrochemical baths in plating technology
An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical...
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6890414 |
Purification system and method
A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a...
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6884332 |
Method and apparatus for treating an aqueous electroplating bath solution
A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of...
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6881319 |
Electrolytic copper plating solution and method for controlling the same
Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an...
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6878258 |
Apparatus and method for removing contaminants from semiconductor copper electroplating baths
The present invention generally provides an apparatus and method for removing contaminants from a plating solution. The apparatus generally includes a plating cell having an electrolyte inlet and...
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6878245 |
Method and apparatus for reducing organic depletion during non-processing time periods
Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on...
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6875331 |
Anode isolation by diffusion differentials
Embodiments of the invention generally provide an electrochemical plating cell having a cell body configured to contain a plating solution therein. An anode assembly is immersed in a fluid solution...
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6849172 |
Electrolytic process and apparatus
A method of operating a cell for electrowinning of copper, the cell including a plurality of anodes and cathodes therein, the method including the steps of introducing fresh electrolyte and...
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6835294 |
Electrolytic copper plating method
Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper...
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6827832 |
Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths
The invention disclosed relates to an electrochemical process for decreasing high levels of organic contaminants in metal plating baths. The process involves breaking down the organic contaminants...
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6821681 |
Electrochemical cells and an interchangeable electrolyte therefore
An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a...
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6805786 |
Precious alloyed metal solder plating process
A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and...
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6797141 |
Removal of coagulates from a non-glare electroplating bath
The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production...
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6793795 |
Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing...
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6790332 |
Method for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses
A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one...
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6750144 |
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
A method for filling recesses of different sizes on a semiconductor substrate comprising immersing a semiconductor substrate having a surface provided with recesses of different sizes in an...
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6746589 |
Plating method and plating apparatus
The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing...
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6685815 |
Electroplating of semiconductor wafers
An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate...
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6676822 |
Method for electro chemical mechanical deposition
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the...
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6673226 |
Voltammetric measurement of halide ion concentration
The concentration of chloride ion in an acid copper electroplating bath is determined from the effect that chloride exerts on the copper electrodeposition rate in the presence of organic additives....
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6645364 |
Electroplating bath control
Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
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6632346 |
Process for electrodepositing zinc oxide film
The present process for electrodepositing a zinc oxide film comprises the steps of immersing a substrate and an opposing electrode in an electrodeposition bath which contains zinc nitrate and is...
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6616828 |
Recovery method for platinum plating bath
A recovery system for platinum electrolytic baths operating at low current densities is disclosed. An oxidizing system is provided in a closed-loop recirculation system for platinum plating at low...
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6607651 |
Process and system for treating the discharge stream from an ion exchanger
A method is disclosed for treating a flushing solution from an ion exchanger used in electroplating operations by co-precipitating or selectively precipitating out metal hydroxides derived from...
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6596148 |
Regeneration of plating baths and system therefore
The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the...
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6576111 |
Process for the copper plating of substrates
A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the...
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6572753 |
Method for analysis of three organic additives in an acid copper plating bath
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order...
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6569307 |
Object plating method and system
A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the...
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6527934 |
Method for electrolytic deposition of copper
A process is provided for electrolytically depositing copper onto a workpiece. The process includes the steps of providing a copper generation vessel and generating a copper plating solution from...
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6521112 |
Paced chemical replenishment system
A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition;...
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