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9039873 Manufacturing apparatus  
The present invention provides a manufacturing apparatus which can realize so-called sequential substrate transfer and can improve throughput, even when one multi-layered thin film includes plural...
9028660 Low impedance plasma  
A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the...
8968529 Production method for forming an antibacterial film on the surface of an object  
A production method combining cathode arc and magnetron sputtering methods to form an antibacterial film on the surface of an object. Inside the vacuum chamber, both a cathode arc target source...
8961745 Plant and method for producing a semiconductor film  
The plant is suitable to produce a semiconductor film (8) having a desired thickness and consisting substantially of a compound including at least one element for each of the groups 11, 13, and 16...
8956515 Multilayer-film sputtering apparatus and method of forming multilayer film  
Provided is a sputtering apparatus which can form a multilayer film giving high productivity and with less spiral pattern by effective use of targets, and a method of forming multilayer film using...
8920618 Combinatorial processing using high deposition rate sputtering  
Apparatuses and methods for high-deposition-rate sputtering for depositing layers onto a substrate are disclosed. The apparatuses generally comprise a process chamber; one or more sputtering...
8911602 Dual hexagonal shaped plasma source  
A plasma source includes a hexagonal hollow cathode, the cathode including six targets and six magnets to generate and maintain a high density plasma; and an anode located beneath the cathode. A...
8900426 Double-layer shutter sputtering apparatus  
A sputtering apparatus including a target holder configured to hold at least two targets; a substrate holder configured to hold a substrate; a first shutter plate arranged between the target...
8882914 Processing substrates using site-isolated processing  
Substrate processing systems and methods are described for processing substrates having two or more regions. The processing includes one or more of molecular self-assembly and combinatorial...
8864958 Method and sputter-deposition system for depositing a layer composed of a mixture of materials and having a predetermined refractive index  
A method and sputter-deposition system for depositing a layer composed of a mixture of materials and having a predetermined refractive index are provided. The sputter-deposition system includes a...
8864956 Multi-component deposition  
Ion-enhanced physical vapor deposition is augmented by sputtering to deposit multi-component materials. The process may be used to deposit coatings and repair material on Ti alloy turbine engine...
8821638 Continuous deposition apparatus  
Provided is a continuous deposition apparatus wherein replacement operations of a feeding unit and a take-up unit are easily performed. The continuous deposition apparatus is provided with: a...
8815013 Method and system for isolated and discretized process sequence integration  
A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage...
8808514 Magnetron sputtering apparatus  
A magnetron sputtering apparatus comprising: a deposition chamber; a processing chamber in communication with the deposition chamber, wherein a target area composed of targets is located at the...
8770143 Multi-region processing system  
The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on...
8741116 Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same  
A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target...
8691064 Sputter-enhanced evaporative deposition apparatus and method  
A deposition apparatus includes a deposition source that produces a deposition flow of a deposited material and has an evaporation source with a material to be deposited therein, and a sputtering...
8691063 Methods and apparatus for forming diamond-like coatings  
The invention is an apparatus and method for depositing a coating onto a substrate. The apparatus includes a vacuum chamber with an inlet for supplying a precursor gas to the chamber. The chamber...
8557093 Deposition system with electrically isolated pallet and anode assemblies  
A system for substrate deposition. The system includes a wafer pallet and an anode. The wafer pallet has a bottom and a top. The top of the wafer pallet is configured to hold a substrate wafer....
8535496 Sputter-coating apparatus  
A sputter-coating apparatus is configured for forming coatings on a plurality of workpieces, and includes a deposition chamber defining a cavity, a plurality of targets received in the cavity, and...
8524099 Methods for accessing a process chamber using a dual zone gas injector with improved optical access  
Methods for processing events occurring in a process chamber are provided. In one method, an operation includes carrying gas and receiving an optical signal from the process chamber to an analysis...
8506774 Vacuum processing device  
To provide a vacuum processing apparatus applicable to various manufacturing processes, by efficiently and highly reliably stacking films of various types and thicknesses and by downsizing the...
8500977 Coating apparatus  
A coating apparatus includes a housing, a sputter mechanism, an evaporation mechanism, and a workpiece transport assembly. The housing defines a receiving space. The workpiece transport assembly...
8500978 Composite coating apparatus  
A composite coating apparatus includes a main body, two carrying boards, and two actuators. The main body defines a first chamber and a second chamber with a separating board intervening...
8470145 Cathode unit and sputtering apparatus provided with the same  
There is provided an inexpensive cathode unit which is simple in construction and is capable of forming a film at good coating characteristics relative to each of micropores of high aspect ratio...
8460522 Method of forming thin film and apparatus for forming thin film  
A plurality of targets are disposed in parallel with, and at a given distance to, one another. In case a predetermined thin film is formed by sputtering, the occurrence of non-uniformity in the...
8454810 Dual hexagonal shaped plasma source  
A plasma source includes a hexagonal hollow cathode, the cathode including six targets and six magnets to generate and maintain a high density plasma; and an anode located beneath the cathode. A...
8440061 System and method for plasma arc detection, isolation and prevention  
A device for use with an RF generating source, a first electrode, a second electrode and an element. The RF generating source is operable to provide an RF signal to the first electrode and thereby...
8388753 Coating apparatus  
A coating apparatus includes a deposition case, a reaction assembly, two precursors, a target, and a driving assembly. The deposition case includes a housing defining a cavity for receiving...
8357272 Quantum dot manipulating method and quantum dot production/manipulation apparatus  
A quantum dot manipulating method and a generation/manipulation apparatus are provided which can control the size of a large number of generated quantum dots on or below the order of percent which...
8349156 Microwave-assisted rotatable PVD  
Disclosed invention uses a coaxial microwave antenna to enhance ionization in PVD or IPVD. The coaxial microwave antenna increases plasma density homogeneously adjacent to a sputtering cathode or...
8314027 Wafer electroless plating system and associated methods  
A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone...
8308915 Systems and methods for magnetron deposition  
Systems and methods are disclosed for face target sputtering to fabricate semiconductors by providing one or more materials with differential coefficients of expansion in the FTS chamber; and...
8303786 Sputtering apparatus  
A sputtering apparatus comprises a plurality of independent plasma generation regions formed in a single process chamber; a cathode disposed at an edge portion of each of the plurality of...
8282794 Filtered cathodic arc deposition method and apparatus  
An apparatus for the application of coatings in a vacuum comprising a plasma duct surrounded by a magnetic deflecting system communicating with a first plasma source and a coating chamber in which...
8236152 Deposition system  
A deposition system includes a chamber, a plurality of targets in a center region in the chamber and a plurality of substrates in the chamber. The targets are sequentially positioned when viewed...
8187434 Method and system for large scale manufacture of thin film photovoltaic devices using single-chamber configuration  
A system for large scale manufacture of thin film photovoltaic cells. The system includes a chamber comprising a plurality of compartments in a common vacuum ambient therein. Additionally, the...
8163144 Magnetron sputtering device  
The present invention relates to a magnetron sputtering device and technique for depositing materials onto a substrate at a high production rate in which the deposited films have predictive...
8152975 Deposition system with improved material utilization  
A target assembly for material deposition includes a first target piece having a first sputtering surface and comprising a first target material that is to be sputtered off the first sputtering...
8147657 Sputtering device and film forming method  
A sputtering apparatus according to the present invention is provided with first to fourth targets. The first and the second targets are disposed so that their surfaces face each other. The third...
8147924 Apparatus for manufacturing magnetic recording disk, and in-line type substrate processing apparatus  
An apparatus for manufacturing a magnetic recording disk includes a magnetic-film deposition chamber in which a magnetic film for a recording layer is deposited on a substrate; a lubricant-layer...
8137510 Coater with a large-area assembly of rotatable magnetrons  
This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode...
8133358 Method and apparatus for producing a metal wire coated with a layer of metal alloy  
A method and an apparatus for producing a steel wire for reinforcing an elastomeric material. The steel wire has a metal core and a coating layer made of a metal alloy material having a...
8101049 Method for producing low cost media  
Disclosed is a method for the low cost manufacturing a plurality of rigid sputtered magnetic media disks of one or more sizes from a rigid sheet, in which one or more initial steps of preparing...
8092657 Module for coating both sides of a substrate in a single pass  
A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries...
8083911 Apparatus for treating a substrate  
This invention relates to an apparatus (1) for treating, e.g. coating, a substrate (35, 39) in a vacuum chamber (2). In this vacuum chamber (2) there are arranged n cathodes (7-10) and n+1 anodes...
8052850 Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same  
A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target...
7887677 Silicon object forming method and apparatus  
A silicon object formation target substrate is arranged in a first chamber, a silicon sputter target is arranged in a second chamber communicated with the first chamber, plasma for chemical...
7871506 Continuous ARC deposition apparatus and method with multiple available targets  
An arc deposition apparatus comprises an evacuatable chamber and means for positioning at least two targets in the chamber, wherein a first one of the at least two targets is positionable in an...
7857946 Sputtering film forming method, electronic device manufacturing method, and sputtering system  
A sputtering film forming method. which positions a target 4 and 5 at an incline to a surface of a substrate 10 whereupon a film is to be formed, and forms the film upon the surface of the...

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