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7628899 |
Apparatus and method of positioning a multizone magnetron assembly
The present invention generally provides an apparatus and method for processing a surface of a substrate in a PVD chamber that has a magnetron assembly whose shape can be distorted to adjust the...
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7625472 |
Plasma-assisted sputter deposition system
A plasma-assisted sputter deposition system includes a reactor 1 into which a process gas is introduced; a doughnut-shaped electrode to be sputtered by plasma, in which a lower surface thereof is...
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7618521 |
Split magnet ring on a magnetron sputter chamber
A split magnet ring, particularly useful in a magnetron plasma reactor sputter depositing tantalum or tungsten or other barrier metal into a via and also resputter etching the deposited material...
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7588669 |
Single-process-chamber deposition system
A deposition system includes a process chamber, a workpiece holder for holding the workpiece within the process chamber, a first target comprising a first material, a second target comprising a...
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7585399 |
Rotating magnet arrays for magnetron sputtering apparatus
In one embodiment, a magnetron sputtering apparatus includes one or more magnet arrays for moving ions or charged particles on at least two plasma discharge paths on a target. Charged particles on...
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7563349 |
Sputtering device
A sputtering device includes at least: a vacuum container defining a vacuum space; a substrate holder installed rotatably in the vacuum space; a substrate installed on the substrate holder; a...
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7556718 |
Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
This invention relates to ionized PVD processing of semiconductor wafers and provides conditions for highly uniform deposition-etch process sequence and coverage capabilities of high aspect ratio...
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7544276 |
Biased pulse DC reactive sputtering of oxide films
A biased pulse DC reactor for sputtering of oxide films is presented. The biased pulse DC reactor couples pulsed DC at a particular frequency to the target through a filter which filters out the...
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7531071 |
Magnet arrangement for a planar magnetron
A magnetic arrangement for a planar magnetron, in which an initial magnetic pole encompasses a second magnetic pole. This magnetic arrangement is moved linear in longitudinal direction to a target...
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7520965 |
Magnetron sputtering apparatus and method for depositing a coating using same
A method for depositing a coating using a magnetron sputtering apparatus and a magnetron sputtering apparatus comprising: a support structure comprising a hollowed shaft comprising a central...
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7513982 |
Two dimensional magnetron scanning for flat panel sputtering
A generally rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The...
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7504006 |
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
A DC magnetron sputter reactor for sputtering deposition materials such as tantalum and tantalum nitride, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and...
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7485210 |
Sputtering target fixture
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the...
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7399385 |
Alternating current rotatable sputter cathode
The present invention is an alternating current rotary sputter cathode in a vacuum chamber. The apparatus includes a housing containing a vacuum and a cathode disposed therein. A drive shaft is...
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7378001 |
Magnetron sputtering
A magnetron sputtering apparatus has a controller for selectively releasing the spread of plasma on a substrate on a support. The controller can also contain the plasma when the substrate is to be...
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7368041 |
Method for controlling plasma density or the distribution thereof
Method for manufacturing magnetron sputter-coated workpieces includes placing a substrate adjacent a magnetron source having a target cathode, generating above the target cathode, at least one...
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7351596 |
Method and system for operating a physical vapor deposition process
A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a...
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7347919 |
Sputter source, sputtering device, and sputtering method
According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering,...
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7335282 |
Sputtering using an unbalanced magnetron
A sputtering process and magnetron especially advantageous for low-pressure plasma sputtering or sustained self-sputtering, in which the magnetron has a reduced area but full target coverage. The...
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7223322 |
Moving magnetic/cathode arrangement and method
A magnetron sputtering electrode for use with a magnetron sputtering device, wherein the magnetron sputtering electrode comprises a cathode body, a drive unit coupled to the cathode body, a target...
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7208878 |
Method of manufacturing a rotation-magnetron-in-magnetron (RMIM) electrode
An RMIM electrode, a method for manufacturing the RMIM electrode, and a sputtering apparatus using the RMIM electrode, wherein the RMIM electrode includes a magnet unit including a cylinder-shaped...
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7186319 |
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
A multi-track magnetron having a convolute shape and asymmetric about the target center about which it rotates. A plasma track is formed as a closed loop between opposed inner and outer magnetic...
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7182843 |
Rotating sputtering magnetron
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further,...
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7179351 |
Methods and apparatus for magnetron sputtering
In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on...
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7169271 |
Magnetron executing planetary motion adjacent a sputtering target
A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target...
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7166199 |
Magnetron sputtering systems including anodic gas distribution systems
The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is...
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7156961 |
Sputtering apparatus and film forming method
The present invention is to provide a sputtering apparatus and a thin film formation method which make it possible to form respective layers of a multilayer film having a clean interface at a...
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7119489 |
Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode
An RMIM electrode, a method for manufacturing the RMIM electrode, and a sputtering apparatus using the RMIM electrode, wherein the RMIM electrode includes a magnet unit including a cylinder-shaped...
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7115194 |
Magnetron sputtering apparatus
A magnetron sputtering apparatus 1 is composed of a vacuum chamber 2, a target 3, a cathode 4 that holds the target 3 in the vacuum chamber 2, a substrate 5, an anode 6 that holds...
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7101466 |
Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
A sweeping linear magnetron is described. The magnetron has a cathode backing plate, a drive housing attached to the cathode backing plate and a motor held in the drive housing. The motor drives a...
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7094322 |
Use of self-sustained atmospheric pressure plasma for the scattering and absorption of electromagnetic radiation
A self-sustained atmospheric pressure system for absorbing or scattering electromagnetic waves using a capillary discharge electrode configuration plasma panel and a method for using the same. Of...
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7041200 |
Reducing particle generation during sputter deposition
In a magnetron sputtering chamber, a substrate is placed in the chamber and a deposition shield is maintained about the substrate to shield internal surfaces in the chamber. The deposition shield...
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7022209 |
PVD method and PVD apparatus
A PVD method and a PVD apparatus use a rotating magnetic field in order to increase the yield. The magnetic field is provided such that it essentially vanishes, at least in a time average, outside...
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7018515 |
Selectable dual position magnetron
A dual-position magnetron that is rotated about a central axis in back of a sputtering target, particularly for sputtering an edge of a target of a barrier material onto a wafer and cleaning...
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6960284 |
Rotational and reciprocal radial movement of a sputtering magnetron
A plasma reactor for physical vapor deposition (PVD), also known as sputtering, which is adapted so that the atomic species sputtered from the target can self-sustain the plasma without the need of...
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6949170 |
Deposition methods and apparatus
A method and apparatus for processing a thin film on a substrate. The method involves locating the substrate in a first rotational position a location opposed to a process station. The process...
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6916407 |
Target comprising thickness profiling for an RF magnetron
Method for sputtering from a dielectric target ( 9 ) in a vacuum chamber ( 2 ) with a high frequency gas discharge, the target ( 9 ) being mounted on a cooled metallic back plate ( 10 ) and this...
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6887357 |
Sputtering system
A sputtering system for depositing a thin film on a substrate includes a vacuum chamber, a support for supporting the substrate in the vacuum chamber, a target arranged to oppose the support, a...
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6885154 |
Discharge plasma processing system
The present invention provides a magnetic neutral line plasma discharge processing system that makes it no longer necessary to use an insulator wall in the vacuum chamber and metal such as...
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6881310 |
Cooling system for magnetron sputtering apparatus
Apparatus and method for cooling a magnetron sputtering apparatus. More particularly, a system including a stationary conduit, a hollow drive shaft rotatably coupled to the stationary conduit, and...
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6860977 |
Method for manufacturing a workpiece using a magnetron sputter source
A workpiece is manufactured using a magnetron source that has an optimized yield of sputtered-off material as well as service life of the target. Good distribution values of the layer on the...
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6852202 |
Small epicyclic magnetron with controlled radial sputtering profile
A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of...
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6841050 |
Small planetary magnetron
A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target...
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6837975 |
Asymmetric rotating sidewall magnet ring for magnetron sputtering
A magnetron system for a sputtering target having an annular vault facing the wafer to be coated and having inner and outer sidewalls and a roof. A small magnetron is positioned over the roof. A...
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6793785 |
Magnetic control oscillating-scanning sputter
A magnetic control oscillation-scanning sputter includes a sputtering target, a base and an elongated magnet. The sputtering target has a surface with a target located thereon corresponding to the...
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6790326 |
Magnetron for a vault shaped sputtering target having two opposed sidewall magnets
A plasma sputter reactor including a target with an annular vault formed in its surface facing the wafer to be sputter coated and having inner and outer sidewalls and a roof thereover. A well is...
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6758950 |
Controlled magnetron shape for uniformly sputtered thin film
A sputtering chamber includes a sputtering target with a front target surface, and a magnetron behind the sputtering target. The magnetron provides a magnetic field at the front target surface...
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6749730 |
Sputter device
An object of the present invention is to alter the shape of the magnetic field with ease in the state of auxiliary magnet poles being disposed in a sputtering apparatus. In a sputtering apparatus...
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6743342 |
Sputtering target with a partially enclosed vault
A sputtering target having an annular vault with a throat between two sidewalls and facing a substrate to be sputter coated. The vault is partially closed by a plate placed in the annular throat...
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6740209 |
Multilayer film deposition apparatus, and method and apparatus for manufacturing perpendicular-magnetic-recording media
This application discloses a multi-layer film deposition apparatus comprising; plural cathodes comprising targets respectively, a main rotation mechanism for rotating each cathode together, and a...
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