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8172993 |
Magnetron sputtering electrode, and sputtering apparatus provided with magnetron sputtering electrode
In a magnetron sputtering apparatus an arrangement is made such that the peripheral portion of a target is uniformly eroded to attain a high efficiency in target utilization and, in addition, that...
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8157970 |
Sputtering target fixture
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the...
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8152972 |
Method for forming fine particles, method for forming concavities and convexities, and device for forming fine particles
A method of the present invention for forming fine particles includes forming fine particles on a substrate by supplying, in the presence of inert gas, to the substrate, atoms or molecules of a...
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8137519 |
Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device
The present invention provides a sputtering cathode whereby it is possible to increase the degree of freedom to adjust a distance between a target and a magnet unit. A sputtering cathode in...
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8123918 |
Method and a system for operating a physical vapor deposition process
A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a...
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8114256 |
Control of arbitrary scan path of a rotating magnetron
A control system and method for controlling two motors determining the azimuthal and circumferential position of a magnetron rotating about the central axis of the sputter chamber in back of its...
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8105466 |
Biased pulse DC reactive sputtering of oxide films
A biased pulse DC reactor for sputtering of oxide films is presented. The biased pulse DC reactor couples pulsed DC at a particular frequency to the target through a filter which filters out the...
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8097133 |
Evacuable magnetron chamber
A vacuum pumping system and method in conjunction with a sputter reactor having a vacuum-pumped magnetron chamber sealed to the target backing plate. A main sputter chamber is vacuum sealed to the...
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8088263 |
Phased magnetic cathode
The present invention is a device for controlling sputter coating deposition to at least one surface of at least one substrate. The device includes a magnetic structure having a plurality of...
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8048277 |
Magnet unit and magnetron sputtering apparatus
A magnet unit, which can realize uniform film thickness distribution of a thin film formed on a substrate without increasing the length and width of a target. The magnet unit includes a peripheral...
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8043481 |
Sputtering method and apparatus
A sputtering method deposits a film on a substrate by controlling a magnetic field parallel to a surface of a target so that the magnetic field at a part of the target, other than parts of the...
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8021527 |
Coaxial shafts for radial positioning of rotating magnetron
A magnetron actuator for moving a magnetron in a nearly arbitrary radial and azimuthal path in the back of a target in a plasma sputter reactor. The magnetron includes two coaxial rotary shafts...
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8016985 |
Magnetron sputtering apparatus and method for manufacturing semiconductor device
A magnetron sputtering apparatus includes: a target provided in a sputtering chamber; a susceptor opposed to the target; a high-frequency power supply connected to the susceptor; a plate provided...
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7981263 |
Sputtering apparatus, method of driving the same, and method of manufacturing substrate using the same
A sputtering apparatus includes a susceptor having a substrate and a plurality of target devices facing the substrate and substantially parallel to each other, each target device being rotatable.
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7943016 |
Magnetron sputtering apparatus
The magnetron sputtering arrangement (2) comprises a target arrangement (3) comprising a target (3a1) having a sputtering surface (4) the shape of which defines a first (A1 and a second axis (A2)...
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7935232 |
Sputtering apparatus and method, and sputtering control program
To provide a sputtering apparatus and method, and a sputtering control program which are configured simply and can secure the uniformity of the film thickness from the beginning to the end of the...
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7901552 |
Sputtering target with grooves and intersecting channels
A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate comprises a backside surface having a plurality of concentric circular grooves and...
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7892405 |
Methods and apparatus for magnetron sputtering
In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on...
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7879210 |
Partially suspended rolling magnetron
A magnetron scanning and support mechanism in which the magnetron is partially supported from an overhead scanning mechanism through multiple springs coupled to different horizontal locations on...
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7833387 |
Mask blank manufacturing method and sputtering target for manufacturing the same
A sputtering target for manufacturing a mask blank having a backing plate 5 where a portion for bonding a target member 4 is protruded like the convex with respect to a base portion 5′, and the t...
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7815782 |
PVD target
A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target...
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7807030 |
Small scanned magentron
A small magnet assembly having a magnet assembly of area less than 10% of the target area, is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered...
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7785449 |
Magnetron unit, magnetron sputtering apparatus, and method of manufacturing electronic device
A magnetron unit includes a plurality of first magnet elements each including first magnets which have the same polarity and are provided on two end portions of a yoke plate made of a magnetic...
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7767064 |
Position controlled dual magnetron
A dual magnetron for plasma sputtering including a source magnetron and an auxiliary magnetron, each of which rotate about the center of the target at respective radii. The positions of the...
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7744730 |
Rotating pallet in sputtering system
A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or...
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7744731 |
Sputtering apparatus of forming thin film
A sputtering deposit apparatus capable of depositing a thin film having uniform sheet resistance value is provided. The sputtering deposit apparatus is arranged with at least two magnetron...
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7744735 |
Ionized PVD with sequential deposition and etching
An iPVD apparatus (20) is programmed to deposit material (10) onto semiconductor substrates (21) by cycling between deposition and etch modes within a vacuum chamber (30). Static magnetic fields...
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7736473 |
Magnetron having continuously variable radial position
A continuously variable multi-position magnetron that is rotated about a central axis in back of a sputtering target at a freely selected radius. The position is dynamically controlled from the...
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7718042 |
Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source
A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range...
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7700484 |
Method and apparatus for a metallic dry-filling process
An iPVD system is programmed to deposit uniform material, such as a metallic material, into high aspect ratio nano-sized features on semiconductor substrates using a process that enhances the...
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7686928 |
Pressure switched dual magnetron
A dual magnetron for plasma sputtering in which two distinctly different magnetrons are mounted on a common plate rotating about a central axis in back of a target. At least one of the magnetrons...
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7682495 |
Oscillating magnet in sputtering system
A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or...
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7678240 |
Method for controlling plasma density or the distribution thereof
Magnetron source has a target configuration with a sputter surface, a magnet configuration generating above the sputter surface a magnetic field which forms, in top view onto the sputter surface,...
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7674360 |
Mechanism for varying the spacing between sputter magnetron and target
A lift mechanism for and a corresponding use of a magnetron in a plasma sputter reactor. A magnetron rotating about the target axis is controllably lifted away from the back of the target to...
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7628899 |
Apparatus and method of positioning a multizone magnetron assembly
The present invention generally provides an apparatus and method for processing a surface of a substrate in a PVD chamber that has a magnetron assembly whose shape can be distorted to adjust the...
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7625472 |
Plasma-assisted sputter deposition system
A plasma-assisted sputter deposition system includes a reactor 1 into which a process gas is introduced; a doughnut-shaped electrode to be sputtered by plasma, in which a lower surface thereof is...
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7618521 |
Split magnet ring on a magnetron sputter chamber
A split magnet ring, particularly useful in a magnetron plasma reactor sputter depositing tantalum or tungsten or other barrier metal into a via and also resputter etching the deposited material...
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7588669 |
Single-process-chamber deposition system
A deposition system includes a process chamber, a workpiece holder for holding the workpiece within the process chamber, a first target comprising a first material, a second target comprising a...
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7585399 |
Rotating magnet arrays for magnetron sputtering apparatus
In one embodiment, a magnetron sputtering apparatus includes one or more magnet arrays for moving ions or charged particles on at least two plasma discharge paths on a target. Charged particles on...
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7563349 |
Sputtering device
A sputtering device includes at least: a vacuum container defining a vacuum space; a substrate holder installed rotatably in the vacuum space; a substrate installed on the substrate holder; a...
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7556718 |
Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
This invention relates to ionized PVD processing of semiconductor wafers and provides conditions for highly uniform deposition-etch process sequence and coverage capabilities of high aspect ratio...
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7544276 |
Biased pulse DC reactive sputtering of oxide films
A biased pulse DC reactor for sputtering of oxide films is presented. The biased pulse DC reactor couples pulsed DC at a particular frequency to the target through a filter which filters out the...
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7531071 |
Magnet arrangement for a planar magnetron
A magnetic arrangement for a planar magnetron, in which an initial magnetic pole encompasses a second magnetic pole. This magnetic arrangement is moved linear in longitudinal direction to a target...
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7520965 |
Magnetron sputtering apparatus and method for depositing a coating using same
A method for depositing a coating using a magnetron sputtering apparatus and a magnetron sputtering apparatus comprising: a support structure comprising a hollowed shaft comprising a central...
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7513982 |
Two dimensional magnetron scanning for flat panel sputtering
A generally rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The...
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7504006 |
Self-ionized and capacitively-coupled plasma for sputtering and resputtering
A DC magnetron sputter reactor for sputtering deposition materials such as tantalum and tantalum nitride, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and...
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7485210 |
Sputtering target fixture
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the...
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7399385 |
Alternating current rotatable sputter cathode
The present invention is an alternating current rotary sputter cathode in a vacuum chamber. The apparatus includes a housing containing a vacuum and a cathode disposed therein. A drive shaft is...
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7378001 |
Magnetron sputtering
A magnetron sputtering apparatus has a controller for selectively releasing the spread of plasma on a substrate on a support. The controller can also contain the plasma when the substrate is to be...
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7351596 |
Method and system for operating a physical vapor deposition process
A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a...
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