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Match Document Document Title
8172993 Magnetron sputtering electrode, and sputtering apparatus provided with magnetron sputtering electrode  
In a magnetron sputtering apparatus an arrangement is made such that the peripheral portion of a target is uniformly eroded to attain a high efficiency in target utilization and, in addition, that...
8157970 Sputtering target fixture  
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the...
8152975 Deposition system with improved material utilization  
A target assembly for material deposition includes a first target piece having a first sputtering surface and comprising a first target material that is to be sputtered off the first sputtering...
8048277 Magnet unit and magnetron sputtering apparatus  
A magnet unit, which can realize uniform film thickness distribution of a thin film formed on a substrate without increasing the length and width of a target. The magnet unit includes a peripheral...
8016985 Magnetron sputtering apparatus and method for manufacturing semiconductor device  
A magnetron sputtering apparatus includes: a target provided in a sputtering chamber; a susceptor opposed to the target; a high-frequency power supply connected to the susceptor; a plate provided...
7972486 Machine for coating a substrate, and module  
A machine for coating a transparent substrate for the production of display screens comprises a coating chamber that has a modular design. Each of the modules 1 features a chamber section 2, a...
7955480 Sputtering apparatus and film deposition method  
The present invention provides a sputtering apparatus and a film deposition method capable of forming a magnetic film with reduced variations in the direction of magnetic anisotropy. The sputtering...
7943016 Magnetron sputtering apparatus  
The magnetron sputtering arrangement (2) comprises a target arrangement (3) comprising a target (3a1) having a sputtering surface (4) the shape of which defines a first (A1 and a second axis (A2)...
7935232 Sputtering apparatus and method, and sputtering control program  
To provide a sputtering apparatus and method, and a sputtering control program which are configured simply and can secure the uniformity of the film thickness from the beginning to the end of the...
7931787 Electron-assisted deposition process and apparatus  
Previous limitations in utilizing energetic vapor deposition means are addressed through the introduction of a novel means of vapor deposition, namely, an Electron-Assisted Deposition (EAD) process...
7901552 Sputtering target with grooves and intersecting channels  
A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate comprises a backside surface having a plurality of concentric circular grooves and...
7892405 Methods and apparatus for magnetron sputtering  
In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on...
7879209 Cathode for sputter coating  
A magnetron sputtering cathode for use in a vacuum deposition process is disclosed wherein the cathode is coated on its sides with an electrically insulating material such as alumina to prevent...
7837836 Method and apparatus for multi-stage sputter deposition of uniform thickness layers  
A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of: (a) providing a multi-stage cathode sputtering apparatus comprising a group of...
7815782 PVD target  
A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target...
7799190 Target backing plate for sputtering system  
A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple magnets (one...
7767064 Position controlled dual magnetron  
A dual magnetron for plasma sputtering including a source magnetron and an auxiliary magnetron, each of which rotate about the center of the target at respective radii. The positions of the...
7744730 Rotating pallet in sputtering system  
A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or...
7718042 Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source  
A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range...
7713390 Ground shield for a PVD chamber  
Apparatus for processing a substrate in a physical vapor deposition chamber is provided herein. In one embodiment, apparatus for processing a substrate in a physical vapor deposition chamber having...
7686928 Pressure switched dual magnetron  
A dual magnetron for plasma sputtering in which two distinctly different magnetrons are mounted on a common plate rotating about a central axis in back of a target. At least one of the magnetrons...
7678240 Method for controlling plasma density or the distribution thereof  
Magnetron source has a target configuration with a sputter surface, a magnet configuration generating above the sputter surface a magnetic field which forms, in top view onto the sputter surface,...
7641773 Process for producing layers and layer systems, and coated substrate  
A method of producing substrates with functional layers which have high optical properties and/or a high surface smoothness, in particular a low turbidity and significantly lower roughness, is...
7625471 Sacrificial cathode target for sputtering cathode assembly  
A sputtering cathode assembly attachable to a cathode mounting plate for a thin-film vapor deposition chamber. The cathode assembly includes a magnet module and a cathode body generally coextensive...
7604716 Methods and apparatus for generating high-density plasma  
Methods and apparatus for generating a strongly-ionized plasma are described. An apparatus for generating a strongly-ionized plasma according to the present invention includes an anode and a...
7585399 Rotating magnet arrays for magnetron sputtering apparatus  
In one embodiment, a magnetron sputtering apparatus includes one or more magnet arrays for moving ions or charged particles on at least two plasma discharge paths on a target. Charged particles on...
7578908 Sputter coating system  
A sputter coating system comprises a vacuum chamber, means for generating a vacuum in the vacuum chamber, a gas feed system attached to the vacuum chamber, a gas plasma forming system attached to...
7531071 Magnet arrangement for a planar magnetron  
A magnetic arrangement for a planar magnetron, in which an initial magnetic pole encompasses a second magnetic pole. This magnetic arrangement is moved linear in longitudinal direction to a target...
7513982 Two dimensional magnetron scanning for flat panel sputtering  
A generally rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The...
7485210 Sputtering target fixture  
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the...
7411352 Dual plasma beam sources and method  
A pair of plasma beam sources are connected across an AC power supply to alternatively produce an ion beam for depositing material on a substrate transported past the ion beams. Each plasma beam...
7378001 Magnetron sputtering  
A magnetron sputtering apparatus has a controller for selectively releasing the spread of plasma on a substrate on a support. The controller can also contain the plasma when the substrate is to be...
7327089 Beam plasma source  
A plasma source which includes a discharge cavity having a first width, where that discharge cavity includes a top portion, a wall portion, and a nozzle disposed on the top portion and extending...
7316763 Multiple target tiles with complementary beveled edges forming a slanted gap therebetween  
A target assembly composed of multiple target tiles bonded in an array to a backing plate of another material. The edges of the tile within the interior of the array are formed with complementary...
7223322 Moving magnetic/cathode arrangement and method  
A magnetron sputtering electrode for use with a magnetron sputtering device, wherein the magnetron sputtering electrode comprises a cathode body, a drive unit coupled to the cathode body, a target...
7186319 Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry  
A multi-track magnetron having a convolute shape and asymmetric about the target center about which it rotates. A plasma track is formed as a closed loop between opposed inner and outer magnetic...
7182843 Rotating sputtering magnetron  
The magnet arrangement and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets. Further,...
7179350 Reactive sputtering of silicon nitride films by RF supported DC magnetron  
An asymmetric alternating voltage (preferably 40 KHz) is provided between a pair of targets having a coaxial (preferably frusto-conical) relationship to (1) deposit the material in a uniform...
7179351 Methods and apparatus for magnetron sputtering  
In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on...
7166199 Magnetron sputtering systems including anodic gas distribution systems  
The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is...
7156960 Method and device for continuous cold plasma deposition of metal coatings  
A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an...
7147759 High-power pulsed magnetron sputtering  
Magnetically enhanced sputtering methods and apparatus are described. A magnetically enhanced sputtering source according to the present invention includes an anode and a cathode assembly having a...
7135820 Vane structure of magnetron  
A magnetron includes semi-circularly shaped electric field adjusting grooves provided on surfaces of outer ends of vanes brought into contact with an inner surface of a positive polar body to make...
7135097 Box-shaped facing-targets sputtering apparatus and method for producing compound thin film  
Disclosed is a box-shaped facing-targets sputtering apparatus capable of forming, at low temperature, a compound thin film of high quality while causing minimal damage to an underlying layer. The...
7115194 Magnetron sputtering apparatus  
A magnetron sputtering apparatus 1 is composed of a vacuum chamber 2, a target 3, a cathode 4 that holds the target 3 in the vacuum chamber 2, a substrate 5, an anode 6 that holds the substrate 5...
7087145 Sputtering cathode assembly  
A sputtering cathode assembly attachable to a cathode mounting plate for a thin-film vapor deposition chamber. The cathode assembly includes a magnet module and a cathode body generally coextensive...
7041200 Reducing particle generation during sputter deposition  
In a magnetron sputtering chamber, a substrate is placed in the chamber and a deposition shield is maintained about the substrate to shield internal surfaces in the chamber. The deposition shield...
7018515 Selectable dual position magnetron  
A dual-position magnetron that is rotated about a central axis in back of a sputtering target, particularly for sputtering an edge of a target of a barrier material onto a wafer and cleaning...
6916407 Target comprising thickness profiling for an RF magnetron  
Method for sputtering from a dielectric target (9) in a vacuum chamber (2) with a high frequency gas discharge, the target (9) being mounted on a cooled metallic back plate (10) and this back plate...
6896773 High deposition rate sputtering  
Methods and apparatus for high-deposition sputtering are described. A sputtering source includes an anode and a cathode assembly that is positioned adjacent to the anode. The cathode assembly...
Matches 1 - 50 out of 376 1 2 3 4 5 6 7 8 >