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7381282 |
Co alloy target and its production method, soft magnetic film for perpendicular magnetic recording and perpendicular magnetic recording medium
A Co alloy target comprising 1 to 10 atomic % of Zr and 1 to 10 atomic % of Nb and/or Ta, the balance being unavoidable impurities and Co, is produced by rapidly solidifying a melt of the Co alloy...
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7371285 |
Motorized chamber lid
A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom...
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7347353 |
Method for connecting magnetic substance target to backing plate, and magnetic substance target
A method for connecting a magnetic substance target to a backing plate with less variation in plate thickness, characterized in having the steps of connecting the magnetic substance target to an...
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7338582 |
Method for manufacturing manganese oxide nanostructure and oxygen reduction electrode using said manganese oxide nanostructure
It is an object of the present invention to provide an oxygen reduction electrode having excellent oxygen reduction catalysis ability. In a method of manufacturing a manganese oxide nanostructure...
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7316763 |
Multiple target tiles with complementary beveled edges forming a slanted gap therebetween
A target assembly composed of multiple target tiles bonded in an array to a backing plate of another material. The edges of the tile within the interior of the array are formed with complementary...
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7282123 |
Composite sputter target and phosphor deposition method
The invention is a novel sputter target and deposition method for multi-element thin film phosphors for thick film dielectric electroluminescent displays in which the deposited phosphors provide a...
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7282122 |
Method and system for target lifetime
A method and system for determining a lifetime of a target for a physical vapor deposition tool ( 302 ), has, a mapping table ( 304 a ) of criteria for a minimum accumulating rate of Δ wafers...
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7241368 |
Hafnium silicide target for gate oxide film formation and its production method
The present invention relates to a hafnium silicide target for forming a gate oxide film composed of HfSi 0.05-0.37 . Obtained is a hafnium silicide target superior in workability and embrittlement...
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7235162 |
Cathode for vacuum sputtering treatment machine
A cathode for a vacuum sputtering processing machine includes a target plate mounted on a support having a cooler. The support is secured to a frame delimiting a closed space for positioning and...
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7235160 |
Hollow cathode sputtering apparatus and related method
The present invention provides an improved hollow cathode method for sputter coating a substrate. The method of the invention comprises providing a channel for gas to flow through, the channel...
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7229588 |
Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidified alloy powders and elemental Pt metal
A cobalt-chromium-boron-platinum sputtering target alloy having multiple phases. The alloy can include Cr, B, Ta, Nb, C, Mo, Ti, V, W, Zr, Zn, Cu, Hf, O, Si or N. The alloy is prepared by mixing Pt...
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7186324 |
Hard film cutting tools, cutting tool coated with hard film, process for forming hard film and target used to form hard film
A hard film for cutting tools which is composed of
(Ti 1−a−b−c−d , Al a , Cr b , Si c , B d )(C 1−e N e )
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7175802 |
Refurbishing spent sputtering targets
Spent sputtering targets are refurbished by filling the depleted region of the target with new sputter material using a hot isostatic pressing or HIP'ing technique.
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7159537 |
Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
A plasma processing system includes a reactor, a top electrode made of a magnetic or ferromagnetic metal or a metal-alloy, wherein a RF or DC power is applied to generate plasma within the reactor;...
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7156963 |
Tantalum sputtering target and method for preparation thereof
Provided is a tantalum sputtering target having a crystal structure in which the (222) orientation is preferential from a position of 10% of the target thickness toward the center face of the...
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7156960 |
Method and device for continuous cold plasma deposition of metal coatings
A method for the deposition of a metal layer on a substrate ( 1 ) uses a cold plasma inside an enclosure ( 7 ) heated to avoid the formation of a metal deposit at its surface. The enclosure has an...
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7153399 |
Method and apparatus for producing uniform isotropic stresses in a sputtered film
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of...
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7150810 |
Sputtering target and method for fabricating the same
A sputtering target includes a backing plate, a copper target provided on the backing plate, and a protection layer formed of a corrosion-resistant metal on the surface of the copper target The...
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7146703 |
Low temperature sputter target/backing plate method and assembly
A sputtering target and a backing plate are diffusion-bonded with or without an insert or inserts interposed there-between so as to have a solid phase diffusion-bonded interface. The sputtering...
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7135097 |
Box-shaped facing-targets sputtering apparatus and method for producing compound thin film
Disclosed is a box-shaped facing-targets sputtering apparatus capable of forming, at low temperature, a compound thin film of high quality while causing minimal damage to an underlying layer. The...
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7115193 |
Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining
Provided is a sputtering target, backing plate or apparatus inside a sputtering device in which an electrical discharge machining mark is formed on the face to which unwanted films during...
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7087145 |
Sputtering cathode assembly
A sputtering cathode assembly attachable to a cathode mounting plate for a thin-film vapor deposition chamber. The cathode assembly includes a magnet module and a cathode body generally coextensive...
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7087142 |
Method for determining a critical size of an inclusion in aluminum or aluminum alloy sputtering target
The present invention relates to a method for determining a critical size for a diameter of an Al 2 O 3 inclusion ( 38 ) in an Al or Al alloy sputter target ( 42 ) to prevent arcing during...
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7074506 |
Method of forming a ceramic coating on a substrate by electron-beam physical vapor deposition
A composite target is placed in a chamber. The target is in the form of a bar made of ceramic powder and it presents composition that is not uniform in the longitudinal direction. At least one...
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7063984 |
Low temperature deposition of complex metal oxides (CMO) memory materials for non-volatile memory integrated circuits
A memory fabrication apparatus includes a pair of targets arranged so as to be spaced apart from one another within a closed vacuum vessel, each target of said pair of targets having a sputtering...
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7063773 |
High purity sputter targets with target end-of-life indication and method of manufacture
A preferred sputter target assembly ( 10, 10 ′) comprises a target ( 12, 12 ′), a backing plate ( 14, 14 ′) bonded to the target ( 12, 12 ′) along an interface ( 22, 22 ′) and dielectric...
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7041204 |
Physical vapor deposition components and methods of formation
A PVD component forming method includes inducing a sufficient amount of stress in the component to increase magnetic pass through flux exhibited by the component compared to pass through flux...
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7041200 |
Reducing particle generation during sputter deposition
In a magnetron sputtering chamber, a substrate is placed in the chamber and a deposition shield is maintained about the substrate to shield internal surfaces in the chamber. The deposition shield...
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7029560 |
Rod target for arc evaporation source, manufacturing method therefor, and arc deposition device
In the rod target for an arc evaporation source, of which the outer peripheral surface is used as an evaporation surface, the opposite ends thereof in the longitudinal direction thereof are each...
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6994775 |
Multilayer composites and manufacture of same
The present invention is directed towards a process of depositing multilayer thin films, disk-shaped targets for deposition of multilayer thin films by a pulsed laser or pulsed electron beam...
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6992261 |
Sputtering target assemblies using resistance welding
A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter...
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6955852 |
Method of manufacturing sputter targets with internal cooling channels
The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material ( 10 ) to the backing plate material ( 15 ) capable of withstanding the...
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6955748 |
PVD target constructions comprising projections
The invention includes PVD targets having non-sputtered regions (such as, for example, sidewalls), and particle-trapping features formed along the non-sputtered regions. In particular aspects, the...
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6946039 |
Physical vapor deposition targets, and methods of fabricating metallic materials
The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1...
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6933099 |
Method of forming a patterned metal layer
A method of forming a patterned layer on a substrate including depositing a notched or undercut resist pattern to define at least one recess in the photoresist, with the notch or undercut...
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6929726 |
Sputtering target, Al interconnection film, and electronic component
A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an...
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6921470 |
Method of forming metal blanks for sputtering targets
The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of...
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6916407 |
Target comprising thickness profiling for an RF magnetron
Method for sputtering from a dielectric target ( 9 ) in a vacuum chamber ( 2 ) with a high frequency gas discharge, the target ( 9 ) being mounted on a cooled metallic back plate ( 10 ) and this...
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6911123 |
Facing-targets-type sputtering apparatus and method
Disclosed is a facing-targets-type sputtering apparatus and method capable of forming a metal film under the conditions of low gas pressure and low discharge voltage. An opening is formed in each...
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6875325 |
Sputtering target producing few particles
A sputtering target having a sprayed coating at least on the side face thereof and producing few particles. The deposit produced on the side face of the sputtering target is prevented from...
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6875324 |
Sputtering target material
The present invention is directed to a precious metal sputtering target having a columnar crystallographic microstructure such that crystals are grown in a direction normal to the sputtering...
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6875319 |
Substrate with photocatalytic coating
The invention concerns a method from cathode spray deposition of a coating with photocatalytic properties comprising titanium oxide at least partly crystallised in anastatic form on a transparent...
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6863750 |
High purity niobium and products containing the same, and methods of making the same
High purity niobium metals and alloys containing the same are described. The niobium metal preferably has a purity of at least 99.99% and more preferably at least 99.999%. In addition, niobium...
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6858120 |
Method and apparatus for the fabrication of ferroelectric films
The present invention is related to methods and apparatus for processing weak ferroelectric films on semiconductor substrates, including relatively large substrates, e.g., with 300 millimeter...
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6858116 |
Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
A sputtering target producing few particles, a backing plate or a sputtering apparatus, and a sputtering method producing few particles. An arc-spraying coating film and a plasma-spraying coating...
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6855236 |
Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus
A component for a vacuum deposition apparatus comprises a component body and a spray deposit formed on a surface of a component body. A spray deposit has surface roughness in which a mean spacing S...
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6852201 |
Sputter target and method of using a sputter target
A sputtering target used in carrying out a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and a layer consisting of several metallic elements is...
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6848608 |
Method of bonding sputtering target materials
A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During...
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6843891 |
Apparatus for sputter deposition
In one embodiment of this invention, the apparatus for sputter deposition within an evacuated volume comprises a compact gridless ion source into which an ionizable gas is introduced and from which...
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6841202 |
Device and method for the vacuum plasma processing of objects
The invention concerns a device and a method for coating and/or surface modification of objects in a vacuum using a plasma, where there is the possibility of coating or modifying variform objects...
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