|
Match
|
Document |
Document Title |
|
|
7384522 |
Ergonomic loading apparatus for electroplating processes
A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed...
|
|
|
7294243 |
Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly ( 400 ) can comprise a support member ( 410 ) that includes an inner wall ( 412 ) which defines...
|
|
|
7172184 |
Substrate carrier for electroplating solar cells
A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding...
|
|
|
7138039 |
Liquid isolation of contact rings
Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface...
|
|
|
7112268 |
Plating device and plating method
A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated. The plating device includes: a plating...
|
|
|
7087144 |
Contact ring with embedded flexible contacts
A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an...
|
|
|
7067045 |
Method and apparatus for sealing electrical contacts during an electrochemical deposition process
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust...
|
|
|
7025862 |
Plating uniformity control by contact ring shaping
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The...
|
|
|
7021476 |
Jig and a method and apparatus of applying a surface treatment to a member on the jig
A jig ( 10 ) is provided for holding an elongate member ( 56 ) to be surface treated. The jig ( 10 ) comprises a beam ( 12 ) and a plurality of hangers 14 spaced apart along the beam ( 12 ). The...
|
|
|
6962649 |
Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured...
|
|
|
6926813 |
Electrical contacting element made of an elastic material
To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising...
|
|
|
6899800 |
Polymeric electrode for electrophysiological testing
A polymeric material such as PDMS is molded into an electrode structure containing a micron-size aperture for receiving and forming a giga-ohm seal with a biological membrane. One end of a tube is...
|
|
|
6830667 |
Cathode cartridge and anode cartridge of testing device for electroplating
To provide a cathode cartridge, which comprises a tabular cathode conductor 5 , which has an open hole having a same shape to that of plated pats 2 a of a plated base 2 as a negative plate,...
|
|
|
6805778 |
Contact assembly for supplying power to workpieces during electrochemical processing
Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated...
|
|
|
6749728 |
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the...
|
|
|
6673218 |
Cathode cartridge for electropating tester
A cathode cartridge (N) for an electroplating tester includes a cathode conductor ( 10 ) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a...
|
|
|
6663765 |
Method and device for the manufacture of the medical expanding stents
Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and...
|
|
|
6610190 |
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode...
|
|
|
6589401 |
Apparatus for electroplating copper onto semiconductor wafer
An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the...
|
|
|
6579430 |
Semiconductor wafer plating cathode assembly
A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer...
|
|
|
6572743 |
Electroplating assembly for metal plated optical fibers
An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame...
|
|
|
6569302 |
Substrate carrier
The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the...
|
|
|
6565983 |
Electrical contact element and use of the contact element
An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic...
|
|
|
6562204 |
Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
|
|
|
6540899 |
Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an...
|
|
|
6521103 |
Plating clamp assembly
A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the...
|
|
|
6500320 |
Fastening apparatus
A fastening apparatus is provided, in particular, for work-pieces in the form of plates for use in electrochemical baths. The fastening apparatus ensures that the contact quality is achieved...
|
|
|
6478937 |
Substrate holder system with substrate extension apparatus and associated method
An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially...
|
|
|
6365020 |
Wafer plating jig
The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer...
|
|
|
6342138 |
Clamp for electroplating articles
An electroplating rack includes a cathode flight bar from which depends an insulated rack bar over an acid bath. A clamp is fixed to the rack bar, and has a bridge electrically connected to the...
|
|
|
6334937 |
Apparatus for high deposition rate solder electroplating on a microelectronic workpiece
The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate...
|
|
|
6325903 |
Parallel action holding clamp for electroplating articles
A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and...
|
|
|
6274013 |
Electrode semiconductor workpiece holder
A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger...
|
|
|
6267860 |
Method and apparatus for electroplating
Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.
|
|
|
6254744 |
Holder for a mother plate
The invention relates to a holder to be used during the stripping of a metal deposit produced on the surface of a mother plate in electrolytic refining, which mother plate has a supporting bar (12)...
|
|
|
6251692 |
Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter...
|
|
|
6228231 |
Electroplating workpiece fixture having liquid gap spacer
A fixture for supporting a workpiece during electroplating of a metal upon the workpiece in a conductive electroplating bath includes a non-conductive frame member for receiving the workpiece...
|
|
|
6207030 |
Apparatus for measuring coating quality
A method and apparatus for measuring the quality, e.g., thickness, porosity, or corrosion rate, of a coating inside a hollow body having an opening. The method comprises attaching a probe from a...
|
|
|
6197171 |
Pin contact mechanism for plating pin grid arrays
An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a...
|
|
|
6193863 |
Product conveyance mechanism for electroplating apparatus
A product conveying mechanism is provided for an electroplating device which electroplates a thin-wall ribbonlike product such as a printed wiring board given to be plated. It suspends the product...
|
|
|
6176985 |
Laminated electroplating rack and connection system for optimized plating
An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket...
|
|
|
6168691 |
Device for electrochemical treatment of elongate articles
A method and a device are described for the electrochemical treatment of elongate articles, preferably bars. The article 10 is clamped at one end by means of a clamp 3 and is introduced into a...
|
|
|
6120657 |
Device for transmitting electric current to disc elements in surface-coating thereof
A device for evenly distributed electrical current transmission to a disc element when electroplating the disc element includes a closed loop of an elongated, elastic, electrically conducting body...
|
|
|
6080289 |
Electroplating apparatus with self-cleaning contacts
An electroplating apparatus comprising a plating tank containing electroplating solution, one or more substrates to be electroplated, and an electrical contact mechanism. The electrical contact...
|
|
|
6051119 |
Plating structure for a pin grid array package
Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at...
|
|
|
5976331 |
Electrodeposition apparatus for coating wafers
An apparatus may be used to deposit metal or conductive layers upon semiconductor wafers using an electrochemical process. The apparatus comprises a housing for retaining a first electrode (e.g.,...
|
|
|
5908120 |
Hanger for supporting articles to be electrostatically painted
The present invention is an electrically grounded hanger system for supporting a plurality of articles to be electrostatically coated with a paint particulate. The hanger system is supported from a...
|
|
|
5871626 |
Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects
A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive...
|
|
|
5635042 |
Apparatus for automatic loading/unloading of rack carrying lead frame
Disclosed herein is a rack for carrying a plurality of lead frames during processes for plating lead frames, which comprises a rack body into which the lead frames are loaded; at least two latch...
|
|
|
5580432 |
Jig for electroplating lead pins of an integrated circuit package
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a...
|