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8172992 Wafer electroplating apparatus for reducing edge defects  
Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses....
8137158 Electrical contact method  
An electrical contact method. An axle having an axis of rotation is provided. Cantilever arms are provided. Each cantilever arm has a first end and a second opposing end. The first end is connected...
8066856 Service module with at least one anode clamp and means for applying a force or a shock on the anode rod  
A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to...
8038856 Method and apparatus for fluid processing a workpiece  
A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature...
7985325 Closed contact electroplating cup assembly  
Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal...
7935231 Rapidly cleanable electroplating cup assembly  
Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly...
7905994 Substrate holder and electroplating system  
In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one...
7901551 Substrate holder and plating apparatus  
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily...
7901550 Plating apparatus  
A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a...
7883395 Electrical contact structures and methods for use  
Methods and structures. A planarization method includes: providing a contact structure, where the contact structure includes an axle configured to rotate about an axis of rotation, a plurality of...
7727366 Balancing pressure to improve a fluid seal  
A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to...
7727365 Suction pad and substrate treatment apparatus  
A suction pad used for use in a substrate treatment apparatus which treats a substrate by immersing the substrate in a solution while the pad attaches to the substrate, including: a main face for...
7722747 Method and apparatus for fluid processing a workpiece  
A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece,...
7601248 Substrate holder and plating apparatus  
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily...
7566390 Wafer support apparatus for electroplating process and method for using the same  
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film lay...
7534329 Frame for holding sheet material taut  
A frame for holding sheet material taut comprises a support as well as two legs which extend essentially parallel to one another transversely from the support, on which legs fixing elements are...
7384522 Ergonomic loading apparatus for electroplating processes  
A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed...
7294243 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof  
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an...
7172184 Substrate carrier for electroplating solar cells  
A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding...
7138039 Liquid isolation of contact rings  
Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface...
7112268 Plating device and plating method  
A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated. The plating device includes: a plating...
7087144 Contact ring with embedded flexible contacts  
A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an...
7067045 Method and apparatus for sealing electrical contacts during an electrochemical deposition process  
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust...
7025862 Plating uniformity control by contact ring shaping  
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The...
7021476 Jig and a method and apparatus of applying a surface treatment to a member on the jig  
A jig (10) is provided for holding an elongate member (56) to be surface treated. The jig (10) comprises a beam (12) and a plurality of hangers 14 spaced apart along the beam (12). The hangers (14)...
6962649 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces  
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured...
6926813 Electrical contacting element made of an elastic material  
To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising...
6899800 Polymeric electrode for electrophysiological testing  
A polymeric material such as PDMS is molded into an electrode structure containing a micron-size aperture for receiving and forming a giga-ohm seal with a biological membrane. One end of a tube is...
6830667 Cathode cartridge and anode cartridge of testing device for electroplating  
To provide a cathode cartridge, which comprises a tabular cathode conductor 5, which has an open hole having a same shape to that of plated pats 2a of a plated base 2 as a negative plate, which has...
6805778 Contact assembly for supplying power to workpieces during electrochemical processing  
Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated...
6749728 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces  
A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the...
6673218 Cathode cartridge for electropating tester  
A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a...
6663765 Method and device for the manufacture of the medical expanding stents  
Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and...
6610190 Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate  
A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode...
6589401 Apparatus for electroplating copper onto semiconductor wafer  
An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the...
6579430 Semiconductor wafer plating cathode assembly  
A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer...
6572743 Electroplating assembly for metal plated optical fibers  
An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame...
6569302 Substrate carrier  
The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the...
6565983 Electrical contact element and use of the contact element  
An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic...
6562204 Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers  
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
6540899 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces  
A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an...
6521103 Plating clamp assembly  
A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the...
6500320 Fastening apparatus  
A fastening apparatus is provided, in particular, for work-pieces in the form of plates for use in electrochemical baths. The fastening apparatus ensures that the contact quality is achieved...
6478937 Substrate holder system with substrate extension apparatus and associated method  
An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially...
6365020 Wafer plating jig  
The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer...
6342138 Clamp for electroplating articles  
An electroplating rack includes a cathode flight bar from which depends an insulated rack bar over an acid bath. A clamp is fixed to the rack bar, and has a bridge electrically connected to the...
6334937 Apparatus for high deposition rate solder electroplating on a microelectronic workpiece  
The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate...
6325903 Parallel action holding clamp for electroplating articles  
A holding clamp device, for releasably holding a thick planar article over ground, comprising: an elongated main arm member, defining first and second opposite end portions; a pair of first and...
6274013 Electrode semiconductor workpiece holder  
A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger...
6267860 Method and apparatus for electroplating  
Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.
Matches 1 - 50 out of 163 1 2 3 4 >