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7427341 System for synthesis of electrode array  
Systems and methods for preparing electrocatalysts are disclosed. The system includes a high temperature synthesis device for preparing an array of electrocatalysts as electrolytic surfaces of...
7244347 Method and system to provide electrical contacts for electrotreating processes  
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
6916409 Apparatus and process for electrolytic removal of material from a medical device  
An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having...
6866763 Method and system monitoring and controlling film thickness profile during plating and electroetching  
The present invention provides method of adjusting a thickness profile of a top metal layer of a workpiece using a processing solution. A thickness profile control member is included that has at...
6864589 X/Y alignment vernier formed on a substrate  
A two dimensional vernier is provided along with a method of fabrication. The two dimensional vernier has a reference array patterned into a substrate, or a material overlying the substrate. An...
6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers  
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode...
6627064 Method for removing the hard material coating applied on a hard metal workpiece and a holding device for at least one workpiece  
A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm 2 is generated on the work piece at...
6610190 Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate  
A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode...
6572742 Apparatus for electrochemical fabrication using a conformable mask  
An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask...
6540899 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces  
A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an...
6402923 Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element  
An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for...
6287434 Plating cell apparatus for x-ray mask fabrication  
A method and apparatus are provided for the electroplating on only one side of a substrate immersed in an electroplating bath using a device which holds the substrate to be plated in spaced...
6258226 Device for preventing plating of material in surface openings of turbine airfoils  
A method for preventing the deposition of material in an opening near a surface of an article, and a masking insert therefore. The method and insert are particularly suited for preventing the...
6251257 Apparatus and method for electrochemically etching grooves in an outer surface of a shaft  
The present invention is directed to an apparatus 245 and method of etching grooves 235 in a shaft 175. In one embodiment, a cathode 250 is provided for electrochemically etching grooves 235 in an...
6251235 Apparatus for forming an electrical contact with a semiconductor substrate  
The present invention is directed to an apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the...
6168691 Device for electrochemical treatment of elongate articles  
A method and a device are described for the electrochemical treatment of elongate articles, preferably bars. The article 10 is clamped at one end by means of a clamp 3 and is introduced into a...
6120657 Device for transmitting electric current to disc elements in surface-coating thereof  
A device for evenly distributed electrical current transmission to a disc element when electroplating the disc element includes a closed loop of an elongated, elastic, electrically conducting body...
5997701 Galvanic deposition cell with a substrate holder  
The invention relates to an apparatus for the galvanic deposition of a metal layer on a substrate and comprises a substrate holder connected to a drive shaft that extends in a direction...
5871626 Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects  
A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive...
5785826 Apparatus for electroforming  
The present invention includes an apparatus and method for continuously adjusting the anode/cathode distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead...
5744019 Method for electroplating metal films including use a cathode ring insulator ring and thief ring  
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially...
5702574 Jig for coating rotor blades  
A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips...
5660699 Electroplating apparatus  
An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is...
5620581 Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring  
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially...
5607561 Apparatus for abrasive tipping of integrally bladed rotors  
The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly...
5589043 Mask for plating metals and method of construction thereof  
A two-part reusable mask to protect objects to be plated. The mask can be used for painting, chemical treatment or other treatments. By adjusting the shape of the mask, any object can be plated. In...
5538560 Vacuum coating apparatus  
A closed cylindrical housing defining a transport chamber has a top plate with a first opening communicating with an entry and exit chamber, and a second opening communicating with a coating...
5516416 Apparatus and method for electroplating pin grid array packaging modules  
An apparatus and a method for electroplating pin grid array (PGA) packaging modules by utilizing a compressible member and an electrically conductive foil for providing electrical connections to...
5458755 Anodization apparatus with supporting device for substrate to be treated  
An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a...
5421987 Precision high rate electroplating cell and method  
A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The...
5405518 Workpiece holder apparatus  
A high-temperature electrochemical etching apparatus containing a workpiece holder, which contains a first base plate and a second base plate to be joined together by screws, the first base plate...
5401370 Device for masking field lines in an electroplating plant  
The invention builds on an arrangement for the masking of field lines in an electroplating plant for the treatment of essentially plate-shaped workpieces, which are loaded into the bath suspended...
5374345 Partial plating method for a plate member and masking jig for use therein  
A method is provided for partially plating, for example, strip-shaped metallic straps which are parts of a support grid for a nuclear fuel assembly, and further relates to a masking jig for use in...
5324410 Device for one-sided etching of a semiconductor wafer  
A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which...
5310468 ECM slave assembly  
A slave assembly is provided to protect an anodic workpiece joined to a shuttle from stray electrochemical machining. The assembly includes a slave having a support flange joined integrally with a...
5227041 Dry contact electroplating apparatus  
A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an...
5098542 Controlled plating apparatus and method for irregularly-shaped objects  
An electroplating shield for providing controlled electroplating of an article having an irregular surface of crests and valleys. The shield, being made of a nonconductive material such as...
5078852 Plating rack  
A plating rack for use in electroplating at least one substrate includes a rack body onto which the subtrate may be placed; a metal ring connected to the rack body so as to surround a substrate...
5006217 Arrangement for contacting and holding a mold  
In an arrangement for contacting a mold with and holding it on a table, the outer edge of the mold is to be screened from undesired growths by electrodeposition through the use of an elastic collar...
4971676 Support device for a thin substrate of a semiconductor material  
A support device for a thin substrate, notably in a semiconductor material, having the shape of a plate with a circular profile, including a platen provided with projecting fixed abutments against...
4605483 Electrode for electro-plating non-continuously conductive surfaces  
Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically,...
4529493 Apparatus for the electrolytic drilling of precision holes  
An apparatus for the electrolytic drilling of precision holes into a work piece surface which extends at an acute angle to the drilling direction, has one tubular electrode for each hole to be...
4500394 Contacting a surface for plating thereon  
An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58)...
4445995 Cathode head having improved seal means  
An improved cathode head is provided for use in the matrixing of masters, molds and stampers for use in the manufacture of molded records and discs. The cathode head of this invention has a disc...
4428815 Vacuum-type article holder and methods of supportively retaining articles  
A vacuum-type holder (10) for retaining fragile articles such as semiconductor wafers (16) during a manufacturing operation, such as an electrolytic treatment includes a vacuum-operated support...
4405410 Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment  
Surface treatment, for example precious metal plating, on preselected areas of elongate three dimensional objects is obtained by applying a masking member, at least to the ends of the objects. The...
4394243 Electrode for an electrochemical metal machine process  
An electrode for an electrochemical metal removing process, with the electrode consisting of a metal sheet extending at right angles to a sinking direction of the electrode. To enable the...
4341613 Apparatus for electroforming  
An apparatus is disclosed for holding a matrix during electroforming. The apparatus is secured to the cathode of an electroforming apparatus and consists of a flat disc member having a diameter at...
4298446 Apparatus for plating  
An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that...
4290867 Means for and method of producing smooth electro-polished surfaces  
Means for and method of electro-polishing generally planar upright surfaces of relatively large areas on machine parts of various shapes and sizes. The means and method constitute improvements on...
Matches 1 - 50 out of 71 1 2 >