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7427341 |
System for synthesis of electrode array
Systems and methods for preparing electrocatalysts are disclosed. The system includes a high temperature synthesis device for preparing an array of electrocatalysts as electrolytic surfaces of...
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7244347 |
Method and system to provide electrical contacts for electrotreating processes
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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6916409 |
Apparatus and process for electrolytic removal of material from a medical device
An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having...
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6866763 |
Method and system monitoring and controlling film thickness profile during plating and electroetching
The present invention provides method of adjusting a thickness profile of a top metal layer of a workpiece using a processing solution. A thickness profile control member is included that has at...
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6864589 |
X/Y alignment vernier formed on a substrate
A two dimensional vernier is provided along with a method of fabrication. The two dimensional vernier has a reference array patterned into a substrate, or a material overlying the substrate. An...
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6802946 |
Apparatus for controlling thickness uniformity of electroplated and electroetched layers
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode...
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6627064 |
Method for removing the hard material coating applied on a hard metal workpiece and a holding device for at least one workpiece
A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm 2 is generated on the work piece at...
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6610190 |
Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode...
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6572742 |
Apparatus for electrochemical fabrication using a conformable mask
An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask...
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6540899 |
Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an...
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6402923 |
Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for...
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6287434 |
Plating cell apparatus for x-ray mask fabrication
A method and apparatus are provided for the electroplating on only one side of a substrate immersed in an electroplating bath using a device which holds the substrate to be plated in spaced...
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6258226 |
Device for preventing plating of material in surface openings of turbine airfoils
A method for preventing the deposition of material in an opening near a surface of an article, and a masking insert therefore. The method and insert are particularly suited for preventing the...
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6251257 |
Apparatus and method for electrochemically etching grooves in an outer surface of a shaft
The present invention is directed to an apparatus 245 and method of etching grooves 235 in a shaft 175. In one embodiment, a cathode 250 is provided for electrochemically etching grooves 235 in an...
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6251235 |
Apparatus for forming an electrical contact with a semiconductor substrate
The present invention is directed to an apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the...
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6168691 |
Device for electrochemical treatment of elongate articles
A method and a device are described for the electrochemical treatment of elongate articles, preferably bars. The article 10 is clamped at one end by means of a clamp 3 and is introduced into a...
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6120657 |
Device for transmitting electric current to disc elements in surface-coating thereof
A device for evenly distributed electrical current transmission to a disc element when electroplating the disc element includes a closed loop of an elongated, elastic, electrically conducting body...
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5997701 |
Galvanic deposition cell with a substrate holder
The invention relates to an apparatus for the galvanic deposition of a metal layer on a substrate and comprises a substrate holder connected to a drive shaft that extends in a direction...
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5871626 |
Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects
A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive...
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5785826 |
Apparatus for electroforming
The present invention includes an apparatus and method for continuously adjusting the anode/cathode distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead...
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5744019 |
Method for electroplating metal films including use a cathode ring insulator ring and thief ring
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially...
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5702574 |
Jig for coating rotor blades
A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips...
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5660699 |
Electroplating apparatus
An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is...
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5620581 |
Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially...
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5607561 |
Apparatus for abrasive tipping of integrally bladed rotors
The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly...
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5589043 |
Mask for plating metals and method of construction thereof
A two-part reusable mask to protect objects to be plated. The mask can be used for painting, chemical treatment or other treatments. By adjusting the shape of the mask, any object can be plated. In...
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5538560 |
Vacuum coating apparatus
A closed cylindrical housing defining a transport chamber has a top plate with a first opening communicating with an entry and exit chamber, and a second opening communicating with a coating...
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5516416 |
Apparatus and method for electroplating pin grid array packaging modules
An apparatus and a method for electroplating pin grid array (PGA) packaging modules by utilizing a compressible member and an electrically conductive foil for providing electrical connections to...
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5458755 |
Anodization apparatus with supporting device for substrate to be treated
An anodization apparatus for anodizing the surface of a semiconductor substrate by supporting the semiconductor substrate between a pair of electrodes in an electrolytic solution and applying a...
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5421987 |
Precision high rate electroplating cell and method
A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The...
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5405518 |
Workpiece holder apparatus
A high-temperature electrochemical etching apparatus containing a workpiece holder, which contains a first base plate and a second base plate to be joined together by screws, the first base plate...
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5401370 |
Device for masking field lines in an electroplating plant
The invention builds on an arrangement for the masking of field lines in an electroplating plant for the treatment of essentially plate-shaped workpieces, which are loaded into the bath suspended...
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5374345 |
Partial plating method for a plate member and masking jig for use therein
A method is provided for partially plating, for example, strip-shaped metallic straps which are parts of a support grid for a nuclear fuel assembly, and further relates to a masking jig for use in...
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5324410 |
Device for one-sided etching of a semiconductor wafer
A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which...
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5310468 |
ECM slave assembly
A slave assembly is provided to protect an anodic workpiece joined to a shuttle from stray electrochemical machining. The assembly includes a slave having a support flange joined integrally with a...
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5227041 |
Dry contact electroplating apparatus
A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an...
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5098542 |
Controlled plating apparatus and method for irregularly-shaped objects
An electroplating shield for providing controlled electroplating of an article having an irregular surface of crests and valleys. The shield, being made of a nonconductive material such as...
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5078852 |
Plating rack
A plating rack for use in electroplating at least one substrate includes a rack body onto which the subtrate may be placed; a metal ring connected to the rack body so as to surround a substrate...
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5006217 |
Arrangement for contacting and holding a mold
In an arrangement for contacting a mold with and holding it on a table, the outer edge of the mold is to be screened from undesired growths by electrodeposition through the use of an elastic collar...
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4971676 |
Support device for a thin substrate of a semiconductor material
A support device for a thin substrate, notably in a semiconductor material, having the shape of a plate with a circular profile, including a platen provided with projecting fixed abutments against...
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4605483 |
Electrode for electro-plating non-continuously conductive surfaces
Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically,...
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4529493 |
Apparatus for the electrolytic drilling of precision holes
An apparatus for the electrolytic drilling of precision holes into a work piece surface which extends at an acute angle to the drilling direction, has one tubular electrode for each hole to be...
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4500394 |
Contacting a surface for plating thereon
An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58)...
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4445995 |
Cathode head having improved seal means
An improved cathode head is provided for use in the matrixing of masters, molds and stampers for use in the manufacture of molded records and discs. The cathode head of this invention has a disc...
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4428815 |
Vacuum-type article holder and methods of supportively retaining articles
A vacuum-type holder (10) for retaining fragile articles such as semiconductor wafers (16) during a manufacturing operation, such as an electrolytic treatment includes a vacuum-operated support...
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4405410 |
Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment
Surface treatment, for example precious metal plating, on preselected areas of elongate three dimensional objects is obtained by applying a masking member, at least to the ends of the objects. The...
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4394243 |
Electrode for an electrochemical metal machine process
An electrode for an electrochemical metal removing process, with the electrode consisting of a metal sheet extending at right angles to a sinking direction of the electrode. To enable the...
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4341613 |
Apparatus for electroforming
An apparatus is disclosed for holding a matrix during electroforming. The apparatus is secured to the cathode of an electroforming apparatus and consists of a flat disc member having a diameter at...
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4298446 |
Apparatus for plating
An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that...
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4290867 |
Means for and method of producing smooth electro-polished surfaces
Means for and method of electro-polishing generally planar upright surfaces of relatively large areas on machine parts of various shapes and sizes. The means and method constitute improvements on...
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