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7608173 |
Biased retaining ring
A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating...
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7608174 |
Apparatus and method for electroforming high aspect ratio micro-parts
A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any...
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7597787 |
Methods and apparatuses for electrochemical deposition
Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck...
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7597786 |
Transfer and insulation device for electrolysis
The invention relates to a transfer and insulation device ( 1 ) for electrically insulating electrodes, particularly anodes ( 2 ) and cathodes ( 3 ), used in the electrolytic cleaning of metals,...
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7575636 |
Substrate processing apparatus and substrate processing method
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing...
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7566390 |
Wafer support apparatus for electroplating process and method for using the same
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film...
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7507319 |
Anode holder
An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar,...
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7504009 |
Method for the formation of a good contact surface on an aluminium support bar and a support bar
The invention relates to a method for achieving a good contact surface on an aluminium electrode support bar used in electrolysis. In the method the support bar is fabricated as a continuous bar...
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7494576 |
Electroplating apparatus and method for making an electroplating anode assembly
Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes...
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7445697 |
Method and apparatus for fluid processing a workpiece
A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece,...
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7416648 |
Image sensor system for monitoring condition of electrode for electrochemical process tools
A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an...
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7402227 |
Plating apparatus and method
An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps...
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7384522 |
Ergonomic loading apparatus for electroplating processes
A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed...
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RE40218 |
Electro-chemical deposition system and method of electroplating on substrates
The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the...
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RE40035 |
Modular ceramic oxygen generator
A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a...
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7294243 |
Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly ( 400 ) can comprise a support member ( 410 ) that includes an inner wall ( 412 ) which defines...
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7288172 |
Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft...
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7285195 |
Electric field reducing thrust plate
A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a...
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7264699 |
Workpiece holder for processing apparatus, and processing apparatus using the same
An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The...
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7252750 |
Dual contact ring and method for metal ECP process
A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge...
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7223324 |
Capping board with separating walls
Disclosed in a capping board for use to support hanging legs of anodes and cathodes within adjacent electrolytic cells. This capping board has a main body having a bottom surface shaped to fit onto...
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7214297 |
Substrate support element for an electrochemical plating cell
A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact...
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7211178 |
Fixture for electro-chemical machining
On a fixture for electro-chemical machining for the production of long, curved cavities ( 11 ) in a component ( 12 ), the working electrode ( 3 ) of the electro-chemical machining tool ( 1 ) is...
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7208070 |
Stent manufacture
The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which...
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7204920 |
Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing
A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus...
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7204919 |
Capping board with at least one sheet of electrically conductive material embedded therein
Disclosed is a capping board for use to support anodes and cathodes within adjacent electrolytic cells, which has a plurality of individual seats positioned in spaced apart relationship all along...
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7189313 |
Substrate support with fluid retention band
An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to...
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7169269 |
Plating apparatus, plating cup and cathode ring
A plating apparatus ( 10 ) provided with: a plating vessel ( 61 a to 61 d ) having a cylindrical side wall ( 361 ) for containing a plating liquid; a substrate holding mechanism ( 74 a to 74 d...
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7153400 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in...
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7138039 |
Liquid isolation of contact rings
Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface...
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7122101 |
Electrically conductive plastic electrode sealingly embedded in an insulating plastic valve seat
A sensor including at least one electrode ( 3, 4 ) which is made of electrically conductive plastic and is connected to one end of an electrical conductor ( 5, 6 ). The electrode ( 3, 4 ) and...
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7118658 |
Electroplating reactor
A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is...
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7087144 |
Contact ring with embedded flexible contacts
A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an...
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7067045 |
Method and apparatus for sealing electrical contacts during an electrochemical deposition process
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust...
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7030401 |
Modular substrate measurement system
A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate...
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7025860 |
Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the...
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7022211 |
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact...
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7017251 |
Resistored anode and a water heater including the same
Apparatus and method of incorporating a resistive interface between an anode rod and a water heater tank connector. The resistive interface can include a conductive polymer material or coating.
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7014947 |
Integral membrane support and frame structure
An electrochemical cell includes a first electrode, a second electrode, and a proton exchange membrane disposed between and in intimate contact with the electrodes. The proton exchange membrane is...
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7003868 |
Coated stainless-steel/copper weld for electroplating cathode
A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to...
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6966976 |
Electroplating panel with plating thickness-compensation structures
An electroplating panel having a strip of components to be electroplated. The components are spaced apart from one another along an edge of the strip. The panel includes a main buss and a plating...
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6962649 |
Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured...
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6936153 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto...
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6926813 |
Electrical contacting element made of an elastic material
To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising...
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6921468 |
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode...
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6899801 |
Electrode refilling mechanism
A method and apparatus for automatically refilling reference electrodes used in chemical analysis. The apparatus generally includes a reference electrode including an outer chamber with an...
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6890415 |
Reactor vessel having improved cup, anode and conductor assembly
An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter...
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6881309 |
Diffuser with spiral opening pattern for electroplating reactor vessel
In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate...
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6869510 |
Methods and apparatus for processing the surface of a microelectronic workpiece
A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the...
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6855235 |
Anode impedance control through electrolyte flow control
Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned...
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