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7615141 |
Electrochemical micromanufacturing system and method
An electrochemical printing system ( 100, 200 ) and method are disclosed having a printer head ( 130, 230 ) that expels a small jet of electrolyte ( 112 ) towards a conductive substrate ( 92 ) to...
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7604729 |
Methods and apparatus for selectively removing conductive material from a microelectronic substrate
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the...
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7566390 |
Wafer support apparatus for electroplating process and method for using the same
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film...
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7563348 |
Electroplating head and method for operating the same
An electroplating head including a chamber having a fluid entrance and a fluid exit is provided. The chamber is configured to contain a flow of electroplating solution from the fluid entrance to...
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7550070 |
Electrode and pad assembly for processing conductive layers
An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for...
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7544274 |
Plating device and plating method
There is provided a plating method and device having a fixed drum ( 20 ) in which an anode ( 21 ) is exposed on the external peripheral surface; a rotating drum provided on the external periphery...
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7524406 |
Processing apparatus including a reactor for electrochemically etching microelectronic workpiece
Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a...
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7520968 |
Conductive pad design modification for better wafer-pad contact
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad...
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7516748 |
Apparatus for cleaning articles
A method for performing electrochemical processes using an array of dedicated cells is disclosed. Various construction details and steps of the method are developed which promote, in one...
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7513986 |
Method and device for locally removing coating from parts
A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from...
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7501049 |
ECM-machine
ECM machine for electrochemically machining metallic workpieces by anodic dissolution of the workpiece by means of an electrolyte and an applied dc voltage, comprising at least one revolving table...
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7494576 |
Electroplating apparatus and method for making an electroplating anode assembly
Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes...
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7470351 |
Discrete particle electrolyzer cathode and method of making same
A system for producing metal particles using a discrete particle electrolyzer cathode, a discrete particle electrolyzer cathode, and methods for manufacturing the cathode. The cathode has a...
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7438795 |
Electrochemical-mechanical polishing system
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction...
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7427340 |
Conductive pad
A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made...
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7425250 |
Electrochemical mechanical processing apparatus
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer...
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7416647 |
Plating processing device
A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and...
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7413638 |
Nanolithography and microlithography devices and method of manufacturing such devices
A lithography device includes one or more conductive strips monolithically embedded within an insulative structure. A method of manufacturing a lithography device includes monolithically forming a...
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7378004 |
Pad designs and structures for a versatile materials processing apparatus
An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface...
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7368049 |
Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction and a flow-through anode
The present invention relates, generally, to a method and apparatus for electrowinning metals, and more particularly to a method and apparatus for copper electrowinning using the ferrous/ferric...
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7344623 |
System and method for radially positioning a workpiece for electrochemical machining
A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In...
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7329335 |
Device providing electrical contact to the surface of a semiconductor workpiece during processing
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be...
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7311809 |
Plating apparatus for substrate
The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a...
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7297239 |
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn...
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7294243 |
Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly ( 400 ) can comprise a support member ( 410 ) that includes an inner wall ( 412 ) which defines...
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7285195 |
Electric field reducing thrust plate
A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a...
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7252750 |
Dual contact ring and method for metal ECP process
A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge...
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7244347 |
Method and system to provide electrical contacts for electrotreating processes
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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7238092 |
Low-force electrochemical mechanical processing method and apparatus
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece...
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7211175 |
Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
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7201829 |
Mask plate design
The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate...
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7160421 |
Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical...
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7153410 |
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises...
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7153400 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in...
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7141274 |
Substrate processing apparatus and method
A substrate processing apparatus and method which employs the so-called batch processing method of processing a plurality of substrates simultaneously, thereby increasing the throughput, and which...
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7138039 |
Liquid isolation of contact rings
Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface...
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7125477 |
Contacts for electrochemical processing
Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact...
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7118658 |
Electroplating reactor
A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is...
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7101471 |
Method for planar material removal technique using multi-phase process environment
An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes...
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7097755 |
Electrochemical mechanical processing with advancible sweeper
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an...
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7087143 |
Plating system for semiconductor materials
A workpiece processing station is disclosed. The workpiece processing station has particular applicability in an electroplating process for semiconductor wafers. The apparatus includes a work...
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7070688 |
Electroplating tool and method for selective plating
A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements....
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7070686 |
Dynamically variable field shaping element
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a...
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7033464 |
Apparatus for electrochemically depositing a material onto a workpiece surface
A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one...
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7033463 |
Substrate plating method and apparatus
A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of...
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7029567 |
Electrochemical edge and bevel cleaning process and system
An edge cleaning system and method is disclosed in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and...
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7025862 |
Plating uniformity control by contact ring shaping
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The...
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7022211 |
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact...
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6991717 |
Web processing method and apparatus
The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing...
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6991710 |
Apparatus for manually and automatically processing microelectronic workpieces
A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually...
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