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8157978 |
Etching system and method for forming multiple porous semiconductor regions with different optical and structural properties on a single semiconductor wafer
Disclosed is an electrochemical etching system with localized etching capability. The system allows multiple different porous semiconductor regions to be formed on a single semiconductor wafer....
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8147659 |
Gated electrodes for electrolysis and electrosynthesis
A gated electrode structure for altering a potential and electric field in an electrolyte near at least one working electrode is disclosed. The gated electrode structure may comprise a gate...
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8110077 |
Sealing jig and plating treatment apparatus
A sealing jig comes into contact with a cylinder inner peripheral surface as a surface to be processed of a cylinder block and seals the cylinder inner peripheral surface in introducing treatment...
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8101050 |
System, method, and apparatus for continuous electroplating of elongated workpieces
A system electroplates the interior or exterior cylindrical surfaces of an elongated workpiece, such as a pipe or shaft. The workpiece is continuously electroplated with metallic solutions via a...
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8099861 |
Current-leveling electroplating/electropolishing electrode
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The...
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8097132 |
Process and device to obtain metal in powder, sheet or cathode from any metal containing material
A metal-containing material is introduced in the container with an anode inserted therein, the container is introduced in a tank filled with an electrolyte, with a cathode opposed to it, and direct...
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8052851 |
Protective edging for a cathode of an electroplating system
Protective edging for a cathode of an electroplating system. At least some of the illustrative embodiments a cathodes of an electroplating system, the cathodes including a sheet of metallic...
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8048282 |
Apparatus and method for plating a substrate
A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating...
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7988843 |
Method and apparatus for electrochemical plating semiconductor wafers
A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a...
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7947157 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in...
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7943033 |
Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode
The present invention pertains to an electrolytic copper plating method characterized in employing pure copper as the anode upon performing electrolytic copper plating, and performing electrolytic...
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7938937 |
Solid-electrolyte capacitor manufacturing device and manufacturing method
The invention provides an apparatus for producing solid electrolytic capacitors having uniform properties with excellent ESR value efficiently at low costs and a production process using the...
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7935231 |
Rapidly cleanable electroplating cup assembly
Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly...
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7927468 |
Electrode assembly for use in an electrodeposition process
An electrode assembly for use with an electrodeposition process. According to an exemplary embodiment, the electrode assembly includes an electrode for exchanging electrical current with a...
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7922877 |
Method and apparatus for plating a semiconductor package
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on...
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7914651 |
Reducing power consumption in electro-refining or electro-winning of metal
A cathode plate and method for electro-refining or electro-winning of metal. The cathode includes a cathode blade and hanger bar. A quantity of electrically conductive material is wrapped around...
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7901550 |
Plating apparatus
A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a...
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7897024 |
Conducting belt for use with anode holder and anode holder
A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are...
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7850830 |
Method and apparatus for racking articles for surface treatment
A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of...
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7837839 |
Conductive coating of surfaces
The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is...
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7811423 |
Proximity processing using controlled batch volume with an integrated proximity head
A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a...
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7811424 |
Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials
An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between...
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7811427 |
Monolithic structures including alignment and/or retention fixtures for accepting components
Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition...
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7803258 |
Machine for localized cleaning with an electrolytic cell, for pickling and/or polishing metal surfaces
A machine for localized cleaning, using pickling acid or a composition/mixture of chemical elements with the effect of pickling acid, applied by mechanical feed instruments (54, 55) to the surface...
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7803257 |
Current-leveling electroplating/electropolishing electrode
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The...
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7799182 |
Electroplating on roll-to-roll flexible solar cell substrates
Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and...
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7767065 |
Device and method for electrolytically treating an at least superficially electrically conducting work piece
A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the...
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7727365 |
Suction pad and substrate treatment apparatus
A suction pad used for use in a substrate treatment apparatus which treats a substrate by immersing the substrate in a solution while the pad attaches to the substrate, including: a main face for...
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7722745 |
Device for plating contacts in hermetic connector assemblies
This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart...
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7713398 |
Selective plating apparatus and selective plating method
A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of...
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7695604 |
Method for producing separator and electrodeposition coating device
A primer (16) for forming a resin frame (17) is formed on an outer end portion (16p) of a separator (1) of a fuel cell. An electrodeposition coating device (2) includes an upper frame (21) and a...
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7691241 |
Electrolytic etching method and apparatus
The present invention relates to a method and apparatus for partial etching or pattern etching using an electrolysis reaction, wherein, conventionally, there was the problem that an etching line...
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7685712 |
Method for repairing a rubbing surface of a turbomachine variable-pitch blade
Method for repairing a rubbing surface of a variable-pitch blade of a turbomachine, consisting in filling a deficit of material of said surface of the blade that results from wear thereof by...
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7655126 |
Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
A method for making a gasket (32) for an internal combustion engine (20) includes forming a generally annual stopper (38) on a metallic gasket body (40) through the process of electrochemical...
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7615141 |
Electrochemical micromanufacturing system and method
An electrochemical printing system (100, 200) and method are disclosed having a printer head (130, 230) that expels a small jet of electrolyte (112) towards a conductive substrate (92) to...
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7604729 |
Methods and apparatus for selectively removing conductive material from a microelectronic substrate
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the...
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7566390 |
Wafer support apparatus for electroplating process and method for using the same
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film lay...
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7563348 |
Electroplating head and method for operating the same
An electroplating head including a chamber having a fluid entrance and a fluid exit is provided. The chamber is configured to contain a flow of electroplating solution from the fluid entrance to...
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7550070 |
Electrode and pad assembly for processing conductive layers
An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for...
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7544274 |
Plating device and plating method
There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of...
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7524406 |
Processing apparatus including a reactor for electrochemically etching microelectronic workpiece
Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a...
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7520968 |
Conductive pad design modification for better wafer-pad contact
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad...
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7516748 |
Apparatus for cleaning articles
A method for performing electrochemical processes using an array of dedicated cells is disclosed. Various construction details and steps of the method are developed which promote, in one...
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7513986 |
Method and device for locally removing coating from parts
A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from...
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7501049 |
ECM-machine
ECM machine for electrochemically machining metallic workpieces by anodic dissolution of the workpiece by means of an electrolyte and an applied dc voltage, comprising at least one revolving table...
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7494576 |
Electroplating apparatus and method for making an electroplating anode assembly
Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes...
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7470351 |
Discrete particle electrolyzer cathode and method of making same
A system for producing metal particles using a discrete particle electrolyzer cathode, a discrete particle electrolyzer cathode, and methods for manufacturing the cathode. The cathode has a...
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7438795 |
Electrochemical-mechanical polishing system
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction...
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7427340 |
Conductive pad
A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made...
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7425250 |
Electrochemical mechanical processing apparatus
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer...
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