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7569134 |
Contacts for electrochemical processing
Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the...
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7550070 |
Electrode and pad assembly for processing conductive layers
An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for...
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7544274 |
Plating device and plating method
There is provided a plating method and device having a fixed drum ( 20 ) in which an anode ( 21 ) is exposed on the external peripheral surface; a rotating drum provided on the external periphery...
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7520967 |
Fluid applying apparatus
A meniscus of applying fluid is controlled by applying a voltage to a discharge-nozzle side electrode and a counter electrode placed downstream of the discharge nozzle and by increasing or...
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7520966 |
Electropolishing apparatus and method for implantable medical devices
An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism...
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7494576 |
Electroplating apparatus and method for making an electroplating anode assembly
Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes...
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7485258 |
Method and device for sterilizing containers
A method and device for sterilizing containers in which a plasma treatment is executed through excitation of an electromagnetic oscillation so that the plasma is excited in a vacuum in the vicinity...
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7479208 |
Electrode for electrochemical reduction
An electrode ( 10 ) is provided for electrochemical reduction of a workpiece ( 20 ) that is to be treated. The electrode ( 10 ) has a predefined contour and contains an electrically conductive...
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7462273 |
Method and apparatus for forming by electrochemical material removal
When forming metallic components, in particular three-dimensionally curved blades, which constitute a single piece with the blading of turbomachine rotor wheels, the linear oscillation of the...
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7438795 |
Electrochemical-mechanical polishing system
Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction...
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7399390 |
Barrel plating device
A barrel plating device is disclosed, wherein hollow support shafts placed to be approximately level with each other are mounted in a piercing form to support members combined together to face each...
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7378004 |
Pad designs and structures for a versatile materials processing apparatus
An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface...
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7341649 |
Apparatus for electroprocessing a workpiece surface
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the...
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7329335 |
Device providing electrical contact to the surface of a semiconductor workpiece during processing
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be...
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7288172 |
Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft...
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7267749 |
Workpiece processor having processing chamber with improved processing fluid flow
A processing container ( 610 ) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container...
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7255778 |
Electrochemical machining method and apparatus
An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece...
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7252746 |
Electropolishing apparatus and method for medical implants
An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the...
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7189313 |
Substrate support with fluid retention band
An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to...
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7166204 |
Plating apparatus and method
A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The...
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7160421 |
Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical...
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7153410 |
Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises...
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7108776 |
Plating apparatus and plating method
In the invention, there is provided a plating treatment technique which permits uniform plating treatment and easy replacement of articles to be plated without the effect of bubbles in a plating...
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7090750 |
Plating
An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically...
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7070686 |
Dynamically variable field shaping element
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a...
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7052586 |
Apparatus for making particulates of controlled dimension
We make particulates, especially magnetic Fe—Co alloys having high magnetic permeability, of controlled dimensions, especially those having a narrow thickness size distribution centered around a...
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7045040 |
Process and system for eliminating gas bubbles during electrochemical processing
A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is...
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7033468 |
Elastic contact element
For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory...
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7033465 |
Clamshell apparatus with crystal shielding and in-situ rinse-dry
Certain mechanisms of a plating apparatus address problems associated with interaction between plating solutions or other processing solutions and the components of the plating apparatus (such as...
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7033463 |
Substrate plating method and apparatus
A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of...
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7029558 |
Titanium-made cathode electrode for producing electrolytic copper foil, rotary cathode drum using the titanium-made cathode electrode, method of producing titanium material using titanium-made cathode electrode and method of correcting/working titanium material for titanium-made cathode electrode
The purpose is to provide a cathode electrode for manufacturing an electrodeposited copper foil which is possible to be continuously and stably usable for a long duration of 3000 hours or longer to...
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7025860 |
Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the...
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6991710 |
Apparatus for manually and automatically processing microelectronic workpieces
A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually...
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6991526 |
Control of removal profile in electrochemically assisted CMP
Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate...
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6974525 |
Method and apparatus for electrochemical planarization of a workpiece
An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed...
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6964792 |
Methods and apparatus for controlling electrolyte flow for uniform plating
The present invention provides apparatus and methods for controlling flow dynamics of a plating fluid during a plating process. The invention achieves this fluid control through use of a diffuser...
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6949177 |
System and method for processing semiconductor wafers using different wafer processes
A system and method for processing semiconductor wafers using different wafer processes utilizes multiple processing assemblies to efficiently perform these wafer processes. The wafer processes...
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6942765 |
Submicron and nano size particle encapsulation by electrochemical process and apparatus
An apparatus and method for coating or treating powdered material, particularly ultra-fine powders in the nanometer or submicron range of mean diameters, by electrolytic processes. A platen is...
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6929723 |
Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating...
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6926817 |
Solution processing apparatus and solution processing method
A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the...
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6926812 |
Electric feeding method and apparatus for a continuous plating apparatus
To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides...
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6921468 |
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode...
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6921467 |
Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward...
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6913683 |
Method and device for the production of pipe segments from a hollow pipe
A method for the production of pipe segments from a pipe ( 10 ) in which the pipe ( 10 ) is rotated about its longitudinal axis, while an electrode ( 20 ) is positioned in the vicinity of the outer...
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6899797 |
Apparatus for continuous processing of semiconductor wafers
An electrochemical reaction assembly of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly achieves a highly uniform thickness and...
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6890412 |
Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles
A method and apparatus for microencapsulating or electrodeposited coating of ferromagnetic and soft-magnetic sub-micron or nano sized powderized material comprising use of a rotary flow-through...
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6855239 |
Plating method and apparatus using contactless electrode
A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an...
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6855235 |
Anode impedance control through electrolyte flow control
Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned...
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6848977 |
Polishing pad for electrochemical mechanical polishing
The present invention provides a polishing pad for electrochemical mechanical polishing of conductive substrate. The pad comprises a plurality of grooves formed in a polishing surface of the...
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6843897 |
Anode slime reduction method while maintaining low current
Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned...
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