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7622024 High resistance ionic current source  
A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves...
7566390 Wafer support apparatus for electroplating process and method for using the same  
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film...
7563352 Method and conveyorized system for electorlytically processing work pieces  
In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3. x in a...
7550070 Electrode and pad assembly for processing conductive layers  
An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for...
7531069 Device for the transport of flexible planar material, in particular circuit boards  
A transport system for circuit boards ( 12 ) in treatment devices ( 11 ) which runs the circuit boards ( 12 ) between pairs of rollers ( 20, 21 ). The pairs of rollers are arranged in roller tracks...
7516748 Apparatus for cleaning articles  
A method for performing electrochemical processes using an array of dedicated cells is disclosed. Various construction details and steps of the method are developed which promote, in one...
7507318 Devices using resin wafers and applications thereof  
Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange...
RE40672 Cathodic protection of concrete  
An existing concrete structure is restored by embedding sacrificial anodes into the concrete layer at spaced positions over the layer and connecting the anodes to the reinforcing members to provide...
7467741 Method of forming a sputtering target assembly and assembly made therefrom  
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low...
7449089 Conveyorized plating line and method for electrolytically metal plating a workpiece  
To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide...
7425250 Electrochemical mechanical processing apparatus  
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer...
7402227 Plating apparatus and method  
An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps...
7371306 Integrated tool with interchangeable wet processing components for processing microfeature workpieces  
An integrated tool that enables wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other...
7303064 Feeder belt for strip-shaped parts  
A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at...
7241366 Continuous coating process  
A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The...
7238264 Galvanizing device  
A galvanizing device has at least one jet cell with a contact zone located after the jet cell in the direction of transportation of a work piece through the jet cell. At least one partition...
7211170 Twist-N-Lock wafer area pressure ring and assembly  
Wafer area pressure rings used to confine plasma in plasma processing chambers which are manufactured with bores therein such that replacement of the pressure rings during routine or repair...
7186322 Methods of producing and polishing semiconductor device and polishing apparatus  
A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of...
7160428 Plating machine and process for producing film carrier tapes for mounting electronic parts  
A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention...
7135098 Copper interconnect seed layer treatment methods and apparatuses for treating the same  
A method for making semiconductor interconnect features in a dielectric layer is provided. The method includes depositing a copper seed layer over a barrier layer that is formed over the dielectric...
7128817 Feed belt for strip-shaped elements  
A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body...
7112264 Plating apparatus and method  
A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long...
7101465 Electrolytic processing device and substrate processing apparatus  
There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the...
7097754 Continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process  
A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and...
7090761 Method of producing metal ferrules, and device therefor  
A method of producing metal ferrules and an apparatus therefore enable metal ferrules to be produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core...
7083706 Substrate processing apparatus  
A substrate processing apparatus comprises a plating section having a plating bath for holding a plating liquid therein, and a head assembly for holding a substrate and immersing the substrate in...
7045040 Process and system for eliminating gas bubbles during electrochemical processing  
A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is...
7033463 Substrate plating method and apparatus  
A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of...
7033464 Apparatus for electrochemically depositing a material onto a workpiece surface  
A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one...
6991710 Apparatus for manually and automatically processing microelectronic workpieces  
A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually...
6979391 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method  
For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15′,...
6949177 System and method for processing semiconductor wafers using different wafer processes  
A system and method for processing semiconductor wafers using different wafer processes utilizes multiple processing assemblies to efficiently perform these wafer processes. The wafer processes...
6932884 Substrate processing apparatus  
A substrate processing apparatus comprises roll chucks for holding and rotating a substrate, a closable chamber housing the roll chucks therein, and a gas introduction pipe for introducing a gas...
6929722 Substrate plating apparatus  
A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus...
6926817 Solution processing apparatus and solution processing method  
A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the...
6921466 Revolution member supporting apparatus and semiconductor substrate processing apparatus  
A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable...
6919008 Conveyance apparatus for use with carriages  
A transport object support means ( 40 ) is rotated about an anteroposterior axis ( 39 ) by a rotary control means ( 30 ), whereby a transport object ( 85 ) supported by the transport object support...
6821405 Device for conveying electrodes used in the electrolytic refining or electrowinning of metals  
The invention relates to a device for conveying electrodes, used in the electrolytic refining or electrowinning of metals, from one station to another, particularly when the electrodes are conveyed...
6818115 System and method for electrolytic plating  
The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a...
6811658 Apparatus for forming interconnects  
A method and apparatus for forming interconnects embedding a metal such as copper (Cu) into recesses for interconnects formed on the surface of a substrate such as a semiconductor substrate. The...
6811659 Microelectrogravimetrically plated biosensors and apparatus for producing same  
Disclosed is a method for microelectrogravimetrically depositing an electroactive species onto an electrode or a plurality of electrodes comprising dispensing a solution containing the...
6752915 Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus  
The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with...
6746590 Ultrasonically-enhanced electroplating apparatus and methods  
Electroplating methods and systems employing ultrasonic energy to enhance electroplating processes. The electroplating methods involve sweeping a plating surface with ultrasonic energy having an...
6746720 Conveyance apparatus and conveyance method  
A plurality of baths for dipping and the like is arranged in series so that these baths contact one another, and a conveyor 2 is linearly arranged above the dipping bath in one plane. A workpiece...
6709555 Plating method, interconnection forming method, and apparatus for carrying out those methods  
The present invention relates to a plating method for use in forming a liner for plating in a conductor-embedding fine recess that is defined in a surface of a semiconductor substrate, and an...
6699380 Modular electrochemical processing system  
Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an...
6699373 Apparatus for processing the surface of a microelectronic workpiece  
A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the...
6673219 Transverse conveyor for electrodes  
The invention relates to a transverse conveyor for electrodes used in the production of metals. This transverse conveyor consists of a transfer device, located below the electrodes to be...
6613200 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform  
An apparatus is provided for depositing and polishing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a basin, a cover, a permeable disc, an anode and a...
6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head  
A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a...
Matches 1 - 50 out of 242 1 2 3 4 5 >