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6290822 |
Sputtering method for forming dielectric films
A method for forming a dielectric film having a desired composition comprising sputtering a dielectric material onto a substrate to produce an intermediary film, the intermediary film incorporating...
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6284324 |
Coal gasification burner shield coating
A method for protecting a synthesis gas generator burner heat shield includes coating the burner heat shield with an overlay alloy coating composition of the formula MCrAlY wherein M is selected...
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6277249 |
Integrated process for copper via filling using a magnetron and target producing highly energetic ions
A target and magnetron for a plasma sputter reactor. The target has an annular trough facing the wafer to be sputter coated. Various types of magnetic means positioned around the trough create a...
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6274008 |
Integrated process for copper via filling
A target and magnetron for a plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated. Various types of magnetic means positioned around the vault create a...
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6271129 |
Method for forming a gap filling refractory metal layer having reduced stress
A method for forming a refractory metal layer that features two-stage nucleation prior to bulk deposition of the same. The method includes placing a substrate in a deposition zone, flowing, into...
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6261423 |
Sputtering process
A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first...
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6258219 |
Two-step deposition process for preventing arcs
A method of deposition for W or TiW on a silicon wafer in a physical vapor deposition chamber equipped with a clamping ring without incurring arcing problem between the wafer and the clamping ring...
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6255001 |
Bond coat for a thermal barrier coating system and method therefor
A thermal barrier coating system and a method for forming the coating system on an article. The coating system employs a bond coat of a nickel aluminide alloy over which a thermal-insulating...
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6254740 |
Sputtering method of producing and electroluminescent device with improved blue color purity
Disclosed is a method of producing an electroluminescent (EL) device having a CaGa 2 S 4 :Ce luminescent layer. The ratio of the X-ray diffraction peak intensity I 2 for the (200) reflection of...
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6248401 |
Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
This invention relates to a metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material...
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6242085 |
Magnetic recording medium and method for producing the same
An underlying layer is formed of Cr or the like on a glass substrate, and a magnetic layer is formed on the underlying layer by simultaneously sputtering a magnetic substance and a non-magnetic...
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6241858 |
Methods and apparatus for producing enhanced interference pigments
Methods and apparatus are provided for uniformly depositing a coating material from a vaporization source onto a powdered substrate material to form a thin coalescence film of the coating material...
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6241859 |
Method of forming a self-aligned refractory metal silicide layer
The present invention provides a method of forming a silicide layer on a silicon region. The method comprises the following steps. A first refractory metal layer is formed on the silicon region....
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6238808 |
Substrate with zinc oxide layer, method for producing zinc oxide layer, photovoltaic device, and method for producing photovoltaic device
Provided are a substrate with a zinc oxide layer, in which at least a zinc oxide layer is provided on a support substrate, wherein the zinc oxide layer comprises a zinc oxide layer having the c...
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6238531 |
Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system
An ion beam sputtering system having a chamber, an ion beam source, multiple targets, a shutter, and a substrate stage for securely holding a wafer substrate during the ion beam sputtered...
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6228186 |
Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies
Improved targets for use in DC_magnetron sputtering of aluminum or like metals are disclosed for forming metallization films having low defect densities. Methods for manufacturing and using such...
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6228228 |
Method of making a light-emitting fiber
A display as for images and/or information comprises a plurality of light-emitting fibers disposed in side-by-side arrangement to define a viewing surface. Each light-emitting fiber includes a...
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6224972 |
Method of making a PVD-coated HSS drill
The present invention discloses an HSS tool with a PVD coating and with at least one cutting edge. The cutting edge has a radius of 15-25 μm and the carbides in the HSS are in contact with the...
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6224942 |
Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon
The invention includes methods of forming aluminum containing lines having titanium nitride containing layers thereon, and preferably by physical vapor deposition. In one aspect, a first layer...
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6221495 |
Thin transparent conducting films of cadmium stannate
A process for preparing thin Cd 2 SnO 4 films. The process comprises the steps of RF sputter coating a Cd 2 SnO 4 layer onto a first substrate; coating a second substrate with a CdS layer;...
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6220204 |
Film deposition method for forming copper film
A film deposition apparatus to which the present invention is applied comprises a vacuum chamber 11, a plasma beam generator 13, a main hearth 30 which is disposed within the vacuum chamber and...
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6221219 |
Magneto-optical medium and process for production thereof
A magneto-optical medium comprises a light-transmissive substrate, a third magnetic layer formed on the light-transmissive substrate, a first magnetic layer formed on the light-transmissive...
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6217952 |
Method of forming films over inner surface of cylindrical member
The present invention relates to a method of forming an intermediate film and a hard carbon film over the inner surface of a cylindrical member having a bore, such as a bushing or a cylinder, with...
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6217969 |
Sputtering target disk
A sputtering target disk is provided which is comprised of a sintered silicon carbide having a density of 2.9 g/cm 3 or more and obtained by sintering a uniform mixture of a powder of silicon...
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6217951 |
Impurity introduction method and apparatus thereof and method of manufacturing semiconductor device
An impurity solid including boron as impurity and a solid sample to which boron is introduced are held in a vacuum chamber. Ar gas is introduced into the vacuum chamber to generate plasma composed...
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6217715 |
Coating of vacuum chambers to reduce pump down time and base pressure
Internal surfaces of a vacuum chamber are coated with a metal or metal oxide to reduce pump down time and base pressure. The metal is sputter deposited within a partially assembled chamber from a...
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6217721 |
Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer
An aluminum sputtering process, particularly useful for filling vias and contacts of high aspect ratios formed through a dielectric layer and also usefull for forming interconnects that are highly...
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6217719 |
Process for thin film formation by sputtering
A process is provided for forming a thin film having refractive index thereof varying continuously or stepwise in a thickness direction. The process comprises sputtering in a vacuum chamber by...
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6217722 |
Process for producing Ti-Cr-Al-O thin film resistors
Thin films of Ti-Cr-Al-O are used as a resistor material. The films are rf sputter deposited from ceramic targets using a reactive working gas mixture of Ar and O 2 . Resistivity values from 10 4 ...
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6214177 |
Method of producing a silicon/aluminum sputtering target
A method of producing a silicon aluminum sputtering target is provided. The target is formed from a powder base of between about 80% to about 95% by weight silicon and about 5% to about 20% by...
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6210545 |
Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target
An inventive method for forming a thin film comprises the steps of preparing a sputter-target of a material which is fully oxidized and crystallized to a perovskite structure, sputter-depositing a...
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6210547 |
Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties
A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially...
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6210541 |
Process and apparatus for cold copper deposition to enhance copper plating fill
A process and apparatus for depositing thin films onto a substrate. The process comprises mounting a wafer onto a wafer chuck and pumping a cryogenic fluid through the chuck which cools the wafer...
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6210977 |
Measuring device and method for making same
A measuring device for measuring or examining physiological parameters on biocomponents includes an FET sensor 5 whose electrical protective layer 12 is roughened or has a structured coating 15....
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6210540 |
Method and apparatus for depositing thin films on vertical surfaces
A mask is placed over a center portion of a deposition source to limit angle of the flux from the source. A substrate or device with a vertical surface (referenced to a major surface of the...
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6210544 |
Magnetic film forming method
Disclosed is a magnetic film forming method of forming a magnetic film on a substrate by preparing a material A formed of oxide of an element T of at least one kind of Fe, Co, and Ni and a material...
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6203674 |
Continuous forming method for TI/TIN film
In a Ti/TiN film continuous forming method, when a nitride mode TiN film is formed in a TiN film forming step, according to a correlation between the generation conditions of the nitride TiN film...
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6200433 |
IMP technology with heavy gas sputtering
The present invention generally provides a copper metallization method for depositing a conformal barrier layer and seed layer in a plasma chamber. The barrier layer and seed layer are preferably...
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6200432 |
Method of handling a substrate after sputtering and sputtering apparatus
A substrate which has been heated to a predetermined temperature by a heating unit during sputtering is transferred into an unload-lock chamber having a vacuum pump system and a vent gas...
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6197167 |
Step coverage and overhang improvement by pedestal bias voltage modulation
The invention provides a method for depositing a metal film on a substrate, comprising generating a high density plasma in a chamber, sputtering metal particles from a target to the substrate, and...
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6197166 |
Method for inductively-coupled-plasma-enhanced ionized physical-vapor deposition
A system and related method are disclosed for performing inductively-coupled-plasma-enhanced ionized physical-vapor deposition process for depositing a material layer on a work piece such as a...
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6193854 |
Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
A hollow cathode magnetron (HCM) sputter source includes a main magnet positioned near the sidewall of the hollow cathode target and a pair of rotating magnet arrays that are positioned near the...
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6187150 |
Method for manufacturing thin film photovoltaic device
A method for manufacturing a thin film photovoltaic device comprising a transparent conductive film, a thin film photovoltaic unit, and a back transparent conductive film and a back metal electrode...
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6183606 |
Manufacture method of high coercivity FePt-Si3N4 granular composite thin films
A method of producing high coercivity FePt--Si 3 N 4 granular composite thin films for magnetic recording media is invented. The method includes magnetron co-sputtering of FePt and Si 3 N 4 ...
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6180253 |
Brazing or soldering material and production method thereof
The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a...
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6179976 |
Surface treatment and method for applying surface treatment to suppress secondary electron emission
A surface treatment and method for applying the surface treatment to electrical components are provided that include a coating of yttrium-iron-garnet (YIG), which is applied to the inner surface of...
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6176982 |
Method of applying a coating to a metallic article and an apparatus for applying a coating to a metallic article
A method of applying a coating to a metallic article (10) comprises placing the metallic article within a hollow cathode (38) in a vacuum chamber (30), evacuating the vacuum chamber (30), applying...
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6176981 |
Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor
A plasma reactor for physical vapor deposition (PVD), also known as sputtering, which is adapted so that the atomic species sputtered from the target can self-sustain the plasma without the need of...
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6174416 |
Micromechanical component production method
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6171456 |
Method for making improved long life bonding tools
The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the...
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