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6099701 |
AlCu electromigration (EM) resistance
A method of manufacturing a Al-Cu line stack comprised of Ti-rich TIN, TiN, Ti-rich TiN, Al-Cu, Ti-rich TiN, TiN layers. A key feature of the invention is the sputtering of the Ti-rich TiN layers...
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6099699 |
Thin encapsulation process for making thin film read/write heads
A process for providing a thin encapsulation layer for thin film heads includes controlling the bias voltage of the substrate and head during the encapsulation layer deposition process. The bias...
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6099698 |
Magnetic disc and method of manufacturing same
It is an object of the present invention to provide a method of making a magnetic disk having a uniform textured structure with micro-waviness of fabrication depth of less than 20 nm, preferably...
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6099700 |
Surface acoustic wave filter employing A1N/A1N:H/A1N tri-layered film and a process for fabricating the same
The present invention provides a novel surface acoustic wave (SAW) filter having a high propagation velocity and electromechanical coupling coefficient (k 2 ) employing A1N/A1N:H/A1N tri-layered...
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6096176 |
Sputtering method and a sputtering apparatus thereof
A target and a wafer are opposed to each other in a processing vessel in the form of a quartz tube whose internal pressure can be reduced. A low bias voltage is applied to the wafer while Helicon...
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6086730 |
Method of sputtering a carbon protective film on a magnetic disk with high sp.sup.3 content
Sputtering method for producing amorphous hydrogenated carbon thin films with high sp 3 content. By sputtering the carbon with a pulsed DC power supply having high voltage peaks, a carbon film...
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6086729 |
Method of manufacturing thin metal membranes
Method for manufacturing a composite membrane structure comprising a thin metal membrane, for example of silver, palladium or palladium alloys, for use in selective diffusion of gasses. The metal...
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6083624 |
Carbon material and method of preparing the same
A graphite having geometrically shaped holes limited to the top atomic layer such as circles, polygons and combinations thereof, and a method of preparing a graphite having geometrically shaped...
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6083359 |
Process and device for forming a coating on a substrate by cathode sputtering
Disclosed is a process for forming a coating on a substrate (2,2') by cate sputtering, comprising the coating of substrate surfaces (2,2') which have been transferred to a cathode sputtering...
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6083358 |
Multiple species sputtering for improved bottom coverage and improved sputter rate
An improved sputtering process increases the perpendicularity of the sputtered flux to the target surface by bombarding the target with both low and high mass ions, with low mass ions...
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6083361 |
Sputter device
A sputtering device includes a sputter chamber equipped with a vacuum pump system; a metal target provided inside the sputter chamber; a sputtering power source for producing a sputter discharge...
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6080285 |
Multiple step ionized metal plasma deposition process for conformal step coverage
A multiple step process sputter deposits material of uniform thickness on stepped surfaces of an integrated circuit substrate such as the surfaces of a high aspect ratio via or a narrow trench....
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6074535 |
Magnetoresistive head, method of fabricating the same and magnetic recording apparatus
The present invention relates to a method of fabricating a magnetoresistive head formed by laminating a magnetic layer and a nonmagnetic metal layer including a silver film and used for converting...
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6071595 |
Substrate with low secondary emissions
The present invention is directed to a method and apparatus for producing a highly-textured surface on a copper substrate with only extremely small amounts of texture-inducing seeding or masking...
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6068739 |
Method of manufacturing data recording medium made of ordered alloy thin film
A method of manufacturing a data recording medium for recording and reproducing data by use of a magnetic field or light and formed of an ordered alloy thin film comprising the steps of forming at...
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6063245 |
Magnetron sputtering method and apparatus utilizing a pulsed energy pattern
A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive...
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6059937 |
Sensor having tin oxide thin film for detecting methane gas and propane gas, and process for manufacturing thereof
The present invention relates to a sensor for detecting hydrocarbon type gas such as methane gas and propane gas, and process for manufacturing thereof. SiO 2 was deposited in 1 μm by ion beam...
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6060129 |
Method for bulk coating using a plasma process
Objects such as pharmaceutical vial stoppers are coated by treating with material such as a fluoropolymer. The objects to be coated are mixed with pieces of the treating material, and the resulting...
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6059940 |
Method for fabricating dual layer protective barrier copper metallization
Copper or copper alloy interconnection patterns are formed with improved barrier layer protection against copper diffusion. A damascene opening is formed in a dielectric layer and a barrier layer...
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6057414 |
Process of plasma treating polymer materials
The present invention is drawn to a method of modifying a polymer material to improve the bonding, wetting and printing properties of the polymer material, comprising exposing said polymer to an...
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6056857 |
Cryogenic annealing of sputtering targets
Sputtering targets are cryogenically annealed to provide a uniformly dense molecular structure by placing the target in a temperature-controlled cryogenic chamber and cooling the chamber to a...
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6057223 |
Passivated copper conductive layers for microelectronic applications
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a...
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6054175 |
Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
A conductive filler has a metallic layer having a low melting point formed on its surface. The filler can give an excellent electric/electromagnetic effect to a matrix.
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6051114 |
Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition
The present invention provides a method and apparatus for preferential PVD conductor fill in an integrated circuit structure. The present invention utilizes a high density plasma for sputter...
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6048442 |
Method for producing thin-film solar cell and equipment for producing the same
A thin-film light absorbing layer which is regulated so as to have any desired gallium concentration and which is capable of attaining a high open-circuit voltage is formed by a simple method at a...
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6045666 |
Aluminum hole filling method using ionized metal adhesion layer
A hole filling process for an integrated circuit in which wiring levels in the integrated circuit are connected by a narrow hole, especially where the underlying level is silicon. First, a physical...
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6042700 |
Adjustment of deposition uniformity in an inductively coupled plasma source
A plasma chamber in a semiconductor fabrication system uses a two step process to sputter deposit material onto a substrate. The first step provides a power ratio of RF power to DC power optimized...
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6039849 |
Method for the manufacture of electronic components
An apparatus (10) such as a plasma sputtering tool has a reaction chamber (11) containing a sputtering target (12) and a semiconductor substrate (13). The apparatus (10) also has a plasma ignitor...
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6040021 |
Plasma CVD process for metal films and metal nitride films
A plasma CVD process for a metal film made from Ti or the like and a formation process of a metal nitride film made from TiN or the like. Each process solves problems on asymmetry of a film shape...
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6039850 |
Sputtering of lithium
Lithium is sputtered from a target with a metallic lithium surface using an alternating sputtering potential with a frequency between about 8 and about 120 kHz, preferably about 10-100 kHz or using...
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6036823 |
Dielectric thin film and thin-film EL device using same
A thin-film electroluminescent device includes dielectric layers having improved dielectric characteristics. The device is fabricated by forming a first transparent electrode layer of ITO, a first...
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6036825 |
Magnetic film forming method
In a magnetic film forming method, a plurality of chips formed of Fe 3 O 4 and a plurality of chips formed of HfO 2 are disposed on a target formed of Fe. The composition ratio of a Fe--Hf--O...
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6036824 |
Magnetic recording disk sputtering process and apparatus
A process is provided for producing a thin-film magnetic longitudinal recording disk having a coercive anisotropy with a larger coercivity in a circumferential direction than in a radial direction...
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6036822 |
Thin-film solar cell manufacturing apparatus and manufacturing method
A base is provided with a gas outlet pipe and a gas inlet pipe. A bell jar is placed on top of the base with an O-ring interposed between them. Thin-film solar cells and a Se powder are placed in a...
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6033536 |
Magnetron sputtering method and sputtering target
A magnetron sputtering method using a sputtering target consisting of a material having a maximum relative magnetic permeability of 50 or more or consisting of a soft magnetic material which...
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6033534 |
Method for producing an Al-containing layer with a planar surface on a substrate having hole structures with a high aspect ratio in the surface
A method for producing an Al-containing layer having a planar surface onto a substrate having hole structures with high aspect ratios formed in the surface of the substrate, wherein the...
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6033535 |
Optical information recording disk and method for manufacturing the same
The present invention is to provide a method for manufacturing the PCE optical information recording disk under control of not only the crystallization velocity but also the complex index of...
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6030507 |
Process for making a crystalline solid-solution powder with low electrical resistance
A process for making a crystalline solid-solution powder which involves reacting at least two reactants in a plasma arc of a plasma chamber and blast-cooling the resultant product in a high...
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6030511 |
Collimated sputtering method and system used therefor
A collimated sputtering method that enables to improve the deposition rate per applied unit power and the bottom coverage is provided. This method contains a step of controlling a condition of a...
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6027792 |
Coating film excellent in resistance to halogen-containing gas corrosion and halogen-containing plasma corrosion, laminated structure coated with the same, and method for producing the same
The present invention relates to a coating film excellent in resistance to corrosive halogen-containing gas and halogen-containing plasma, a method for producing the same, and technology utilizing...
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6028003 |
Method of forming an interconnect structure with a graded composition using a nitrided target
A method for forming an interconnect structure on a semiconductor wafer (114) begins by placing the wafer (114) in a process chamber (100). The process chamber (100) contains a titanium (Ti) target...
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6024844 |
Enhanced reactive DC sputtering system
An enhanced reactive plasma processing method and system useful for deposition of highly insulating films. A variety of alternative embodiments are allowed for varying applications. In one...
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6019876 |
Pulsed DC sputtering method of thin film magnetic disks
A method and apparatus for depositing an underlayer and/or a magnetic thin film layer on a data storage disk are described. The sputtering power is supplied in the form of pulses during the...
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6017430 |
Cathode for use in electrolytic cell
A cathode wherein the electrocatalytically-active outer layer is of substantially uniform thickness and has contours which are at least substantially the same as the contours of the substrate...
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6013160 |
Method of making a printhead having reduced surface roughness
The nucleation efficiency of a thermal ink jet printhead is improved by providing a heater resistor with a thin planar oxide film formed over a conductive heater resistive layer. In a preferred...
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6010745 |
Method for manufacturing a combination read/write thin film magnetic head
The lower core layer 7 is formed in approximately constant thickness at the portion confronting the upper core layer so that its thickness gradually reduces toward its side edge. Therefore, the...
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6007684 |
Process for forming improved titanium-containing barrier layers
An improved titanium nitride barrier layer that prevents spiking between an overlying aluminum layer and a silicon substrate is formed by first sputter depositing a titanium layer onto the...
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6007683 |
Hybrid deposition of thin film solid oxide fuel cells and electrolyzers
The use of vapor deposition techniques enables synthesis of the basic components of a solid oxide fuel cell (SOFC); namely, the electrolyte layer, the two electrodes, and the electrolyte-electrode...
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6007685 |
Deposition of highly doped silicon dioxide films
The specification describes sputtering processes for the deposition of silicon dioxide films doped with high levels of oxides or other materials to alter the optical and/or electrical...
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6003336 |
Method of manufacturing a die for press-molding optical elements
A die for press-molding glass optical elements which can press-mold glass optical elements having high melting points and various shapes repeatedly, which includes a base material having high...
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