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6099701 AlCu electromigration (EM) resistance  
A method of manufacturing a Al-Cu line stack comprised of Ti-rich TIN, TiN, Ti-rich TiN, Al-Cu, Ti-rich TiN, TiN layers. A key feature of the invention is the sputtering of the Ti-rich TiN layers...
6099699 Thin encapsulation process for making thin film read/write heads  
A process for providing a thin encapsulation layer for thin film heads includes controlling the bias voltage of the substrate and head during the encapsulation layer deposition process. The bias...
6099698 Magnetic disc and method of manufacturing same  
It is an object of the present invention to provide a method of making a magnetic disk having a uniform textured structure with micro-waviness of fabrication depth of less than 20 nm, preferably...
6099700 Surface acoustic wave filter employing A1N/A1N:H/A1N tri-layered film and a process for fabricating the same  
The present invention provides a novel surface acoustic wave (SAW) filter having a high propagation velocity and electromechanical coupling coefficient (k 2 ) employing A1N/A1N:H/A1N tri-layered...
6096176 Sputtering method and a sputtering apparatus thereof  
A target and a wafer are opposed to each other in a processing vessel in the form of a quartz tube whose internal pressure can be reduced. A low bias voltage is applied to the wafer while Helicon...
6086730 Method of sputtering a carbon protective film on a magnetic disk with high sp.sup.3 content  
Sputtering method for producing amorphous hydrogenated carbon thin films with high sp 3 content. By sputtering the carbon with a pulsed DC power supply having high voltage peaks, a carbon film...
6086729 Method of manufacturing thin metal membranes  
Method for manufacturing a composite membrane structure comprising a thin metal membrane, for example of silver, palladium or palladium alloys, for use in selective diffusion of gasses. The metal...
6083624 Carbon material and method of preparing the same  
A graphite having geometrically shaped holes limited to the top atomic layer such as circles, polygons and combinations thereof, and a method of preparing a graphite having geometrically shaped...
6083359 Process and device for forming a coating on a substrate by cathode sputtering  
Disclosed is a process for forming a coating on a substrate (2,2') by cate sputtering, comprising the coating of substrate surfaces (2,2') which have been transferred to a cathode sputtering...
6083358 Multiple species sputtering for improved bottom coverage and improved sputter rate  
An improved sputtering process increases the perpendicularity of the sputtered flux to the target surface by bombarding the target with both low and high mass ions, with low mass ions...
6083361 Sputter device  
A sputtering device includes a sputter chamber equipped with a vacuum pump system; a metal target provided inside the sputter chamber; a sputtering power source for producing a sputter discharge...
6080285 Multiple step ionized metal plasma deposition process for conformal step coverage  
A multiple step process sputter deposits material of uniform thickness on stepped surfaces of an integrated circuit substrate such as the surfaces of a high aspect ratio via or a narrow trench....
6074535 Magnetoresistive head, method of fabricating the same and magnetic recording apparatus  
The present invention relates to a method of fabricating a magnetoresistive head formed by laminating a magnetic layer and a nonmagnetic metal layer including a silver film and used for converting...
6071595 Substrate with low secondary emissions  
The present invention is directed to a method and apparatus for producing a highly-textured surface on a copper substrate with only extremely small amounts of texture-inducing seeding or masking...
6068739 Method of manufacturing data recording medium made of ordered alloy thin film  
A method of manufacturing a data recording medium for recording and reproducing data by use of a magnetic field or light and formed of an ordered alloy thin film comprising the steps of forming at...
6063245 Magnetron sputtering method and apparatus utilizing a pulsed energy pattern  
A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive...
6059937 Sensor having tin oxide thin film for detecting methane gas and propane gas, and process for manufacturing thereof  
The present invention relates to a sensor for detecting hydrocarbon type gas such as methane gas and propane gas, and process for manufacturing thereof. SiO 2 was deposited in 1 μm by ion beam...
6060129 Method for bulk coating using a plasma process  
Objects such as pharmaceutical vial stoppers are coated by treating with material such as a fluoropolymer. The objects to be coated are mixed with pieces of the treating material, and the resulting...
6059940 Method for fabricating dual layer protective barrier copper metallization  
Copper or copper alloy interconnection patterns are formed with improved barrier layer protection against copper diffusion. A damascene opening is formed in a dielectric layer and a barrier layer...
6057414 Process of plasma treating polymer materials  
The present invention is drawn to a method of modifying a polymer material to improve the bonding, wetting and printing properties of the polymer material, comprising exposing said polymer to an...
6056857 Cryogenic annealing of sputtering targets  
Sputtering targets are cryogenically annealed to provide a uniformly dense molecular structure by placing the target in a temperature-controlled cryogenic chamber and cooling the chamber to a...
6057223 Passivated copper conductive layers for microelectronic applications  
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a...
6054175 Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste  
A conductive filler has a metallic layer having a low melting point formed on its surface. The filler can give an excellent electric/electromagnetic effect to a matrix.
6051114 Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition  
The present invention provides a method and apparatus for preferential PVD conductor fill in an integrated circuit structure. The present invention utilizes a high density plasma for sputter...
6048442 Method for producing thin-film solar cell and equipment for producing the same  
A thin-film light absorbing layer which is regulated so as to have any desired gallium concentration and which is capable of attaining a high open-circuit voltage is formed by a simple method at a...
6045666 Aluminum hole filling method using ionized metal adhesion layer  
A hole filling process for an integrated circuit in which wiring levels in the integrated circuit are connected by a narrow hole, especially where the underlying level is silicon. First, a physical...
6042700 Adjustment of deposition uniformity in an inductively coupled plasma source  
A plasma chamber in a semiconductor fabrication system uses a two step process to sputter deposit material onto a substrate. The first step provides a power ratio of RF power to DC power optimized...
6039849 Method for the manufacture of electronic components  
An apparatus (10) such as a plasma sputtering tool has a reaction chamber (11) containing a sputtering target (12) and a semiconductor substrate (13). The apparatus (10) also has a plasma ignitor...
6040021 Plasma CVD process for metal films and metal nitride films  
A plasma CVD process for a metal film made from Ti or the like and a formation process of a metal nitride film made from TiN or the like. Each process solves problems on asymmetry of a film shape...
6039850 Sputtering of lithium  
Lithium is sputtered from a target with a metallic lithium surface using an alternating sputtering potential with a frequency between about 8 and about 120 kHz, preferably about 10-100 kHz or using...
6036823 Dielectric thin film and thin-film EL device using same  
A thin-film electroluminescent device includes dielectric layers having improved dielectric characteristics. The device is fabricated by forming a first transparent electrode layer of ITO, a first...
6036825 Magnetic film forming method  
In a magnetic film forming method, a plurality of chips formed of Fe 3 O 4 and a plurality of chips formed of HfO 2 are disposed on a target formed of Fe. The composition ratio of a Fe--Hf--O...
6036824 Magnetic recording disk sputtering process and apparatus  
A process is provided for producing a thin-film magnetic longitudinal recording disk having a coercive anisotropy with a larger coercivity in a circumferential direction than in a radial direction...
6036822 Thin-film solar cell manufacturing apparatus and manufacturing method  
A base is provided with a gas outlet pipe and a gas inlet pipe. A bell jar is placed on top of the base with an O-ring interposed between them. Thin-film solar cells and a Se powder are placed in a...
6033536 Magnetron sputtering method and sputtering target  
A magnetron sputtering method using a sputtering target consisting of a material having a maximum relative magnetic permeability of 50 or more or consisting of a soft magnetic material which...
6033534 Method for producing an Al-containing layer with a planar surface on a substrate having hole structures with a high aspect ratio in the surface  
A method for producing an Al-containing layer having a planar surface onto a substrate having hole structures with high aspect ratios formed in the surface of the substrate, wherein the...
6033535 Optical information recording disk and method for manufacturing the same  
The present invention is to provide a method for manufacturing the PCE optical information recording disk under control of not only the crystallization velocity but also the complex index of...
6030507 Process for making a crystalline solid-solution powder with low electrical resistance  
A process for making a crystalline solid-solution powder which involves reacting at least two reactants in a plasma arc of a plasma chamber and blast-cooling the resultant product in a high...
6030511 Collimated sputtering method and system used therefor  
A collimated sputtering method that enables to improve the deposition rate per applied unit power and the bottom coverage is provided. This method contains a step of controlling a condition of a...
6027792 Coating film excellent in resistance to halogen-containing gas corrosion and halogen-containing plasma corrosion, laminated structure coated with the same, and method for producing the same  
The present invention relates to a coating film excellent in resistance to corrosive halogen-containing gas and halogen-containing plasma, a method for producing the same, and technology utilizing...
6028003 Method of forming an interconnect structure with a graded composition using a nitrided target  
A method for forming an interconnect structure on a semiconductor wafer (114) begins by placing the wafer (114) in a process chamber (100). The process chamber (100) contains a titanium (Ti) target...
6024844 Enhanced reactive DC sputtering system  
An enhanced reactive plasma processing method and system useful for deposition of highly insulating films. A variety of alternative embodiments are allowed for varying applications. In one...
6019876 Pulsed DC sputtering method of thin film magnetic disks  
A method and apparatus for depositing an underlayer and/or a magnetic thin film layer on a data storage disk are described. The sputtering power is supplied in the form of pulses during the...
6017430 Cathode for use in electrolytic cell  
A cathode wherein the electrocatalytically-active outer layer is of substantially uniform thickness and has contours which are at least substantially the same as the contours of the substrate...
6013160 Method of making a printhead having reduced surface roughness  
The nucleation efficiency of a thermal ink jet printhead is improved by providing a heater resistor with a thin planar oxide film formed over a conductive heater resistive layer. In a preferred...
6010745 Method for manufacturing a combination read/write thin film magnetic head  
The lower core layer 7 is formed in approximately constant thickness at the portion confronting the upper core layer so that its thickness gradually reduces toward its side edge. Therefore, the...
6007684 Process for forming improved titanium-containing barrier layers  
An improved titanium nitride barrier layer that prevents spiking between an overlying aluminum layer and a silicon substrate is formed by first sputter depositing a titanium layer onto the...
6007683 Hybrid deposition of thin film solid oxide fuel cells and electrolyzers  
The use of vapor deposition techniques enables synthesis of the basic components of a solid oxide fuel cell (SOFC); namely, the electrolyte layer, the two electrodes, and the electrolyte-electrode...
6007685 Deposition of highly doped silicon dioxide films  
The specification describes sputtering processes for the deposition of silicon dioxide films doped with high levels of oxides or other materials to alter the optical and/or electrical...
6003336 Method of manufacturing a die for press-molding optical elements  
A die for press-molding glass optical elements which can press-mold glass optical elements having high melting points and various shapes repeatedly, which includes a base material having high...