Matches 1 - 50 out of 363 1 2 3 4 5 6 7 8 >
Match Document Document Title
7282122 Method and system for target lifetime  
A method and system for determining a lifetime of a target for a physical vapor deposition tool ( 302 ), has, a mapping table ( 304 a ) of criteria for a minimum accumulating rate of Δ wafers...
7261797 Passive bipolar arc control system and method  
A method and system for controlling arcs in a DC sputtering system with a passive circuit is presented. The arc control system includes a sputtering chamber that houses an anode and a sputtering...
7247221 System and apparatus for control of sputter deposition process  
A method and apparatus for sputter deposition in which both a pulsed DC power supply and an RF power supply apply power to the target in the sputter deposition equipment. The pulsed DC power supply...
7232506 System and method for feedforward control in thin film coating processes  
A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering...
7216544 Ultrasonic inspection reference standard for composite Materials  
An ultrasonic inspection reference standard for composite materials includes a prism that is manufactured from a polymer resin. The ultrasonic inspection reference standard may be a rectangular...
7204915 Patterned medium, method for fabricating same and method for evaluating same  
A process for fabricating a patterned medium including a dot-forming step for forming a dot array constituted by sample magnetic dots having a predetermined size such as a single domain particle...
7192505 Wafer probe for measuring plasma and surface characteristics in plasma processing environments  
There is provided by this invention a wafer probe for measuring plasma and surface characteristics in plasma processing environment that utilizes integrated sensors on a wafer substrate. A...
7186319 Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry  
A multi-track magnetron having a convolute shape and asymmetric about the target center about which it rotates. A plasma track is formed as a closed loop between opposed inner and outer magnetic...
7179352 Vacuum treatment system and process for manufacturing workpieces  
A process is disclosed for manufacturing coated substantially plane workpieces, in which the workpieces are guided to a vacuum treatment area guided by a control. The treatment atmosphere is...
7172681 Process for producing rubber-based composite material  
Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the...
7172675 Observation window of plasma processing apparatus and plasma processing apparatus using the same  
An observation window airtightly installed at a wall of a processing room of a plasma processing apparatus includes a body having a through hole with an opening facing the processing room, a...
7160475 Fabrication of three dimensional structures  
The present disclosure relates to a method for generating a three-dimensional microstructure in an object. In one embodiment, a method for fabricating a microscopic three-dimensional structure is...
7153399 Method and apparatus for producing uniform isotropic stresses in a sputtered film  
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of...
7147759 High-power pulsed magnetron sputtering  
Magnetically enhanced sputtering methods and apparatus are described. A magnetically enhanced sputtering source according to the present invention includes an anode and a cathode assembly having a...
7105080 Vacuum treatment system and method of manufacturing same  
Method for manufacturing a workpiece by a vacuum treatment process includes providing a vacuum treatment system with first second parts in a vacuum chamber. Either a sensor or an adjusting element...
7087142 Method for determining a critical size of an inclusion in aluminum or aluminum alloy sputtering target  
The present invention relates to a method for determining a critical size for a diameter of an Al 2 O 3 inclusion ( 38 ) in an Al or Al alloy sputter target ( 42 ) to prevent arcing during...
7063773 High purity sputter targets with target end-of-life indication and method of manufacture  
A preferred sputter target assembly ( 10, 10 ′) comprises a target ( 12, 12 ′), a backing plate ( 14, 14 ′) bonded to the target ( 12, 12 ′) along an interface ( 22, 22 ′) and dielectric...
7048837 End point detection for sputtering and resputtering  
Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a...
7041200 Reducing particle generation during sputter deposition  
In a magnetron sputtering chamber, a substrate is placed in the chamber and a deposition shield is maintained about the substrate to shield internal surfaces in the chamber. The deposition shield...
7037595 Thin hafnium oxide film and method for depositing same  
A thin layer of hafnium oxide or stacking of thin layers comprising hafnium oxide layers for producing surface treatments of optical components, or optical components, in which at least one layer...
7033461 Thin film forming apparatus and method  
The present invention provides an efficient thin film forming apparatus which is capable of correcting a film thickness so as to take care of a variation in distribution in the film thickness and...
7025895 Plasma processing apparatus and method  
A plasma processing apparatus and method are capable of performing etching with high precision without damaging the semiconductor wafer. The plasma processing apparatus has a plasma generation...
7018553 Optical monitoring and control system and method for plasma reactors  
A method of adjusting plasma processing of a substrate in a plasma reactor having an electrode assembly. The method includes the steps of positioning the substrate in the plasma reactor, creating a...
7008518 Method and apparatus for monitoring optical characteristics of thin films in a deposition process  
The present invention is directed at least in part to methods and apparatus for optically monitoring selected optical characteristics of coatings formed on substrates during the deposition process...
6974524 Apparatus, method and system for monitoring chamber parameters associated with a deposition process  
Apparatus and methods for measuring characteristics of a metallic target as well as other interior surfaces of a sputtering chamber. The apparatus includes a sensor configured to emit an energy...
6951502 METHOD OF DETERMINING A FLATNESS OF AN ELECTRONIC DEVICE SUBSTRATE, METHOD OF PRODUCING THE SUBSTRATE, METHOD OF PRODUCING A MASK BLANK, METHOD OF PRODUCING A TRANSFER MASK, POLISHING METHOD, ELECTRONIC DEVICE SUBSTRATE, MASK BLANK, TRANSFER MASK, AND POLISHING APPARATUS  
A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate....
6911124 Method of depositing a TaN seed layer  
We have discovered a method of providing a thin approximately from about 20 Å to about 100 Å thick Ta N seed layer, which can be used to induce the formation of alpha tantalum when tantalum is...
6905578 Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure  
An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as these for GMR and MRAM...
6899979 Photomask blank, photomask, methods of manufacturing the same, and method of forming micropattern  
In obtaining a photomask blank 1 by disposing a sputtering target in a vacuum chamber and forming thin films 3, 4, and 5 with a three-layer construction of CrN/CrC/CrON over a transparent...
6896773 High deposition rate sputtering  
Methods and apparatus for high-deposition sputtering are described. A sputtering source includes an anode and a cathode assembly that is positioned adjacent to the anode. The cathode assembly...
6872284 Target and method of optimizing target profile  
A method of constructing increased life sputter targets and targets made by the method are disclosed. The method comprises starting with a precursor target design or profile and making magnetic...
6863785 Sputtering apparatus and sputter film deposition method  
A sputtering apparatus and a sputter film deposition method, which includes a conventional magnetron and an AC magnetron for deposition of a low refractive index film, and a conventional magnetron...
6860973 Device for the regulation of a plasma impedance  
The invention relates to a device for the regulation of a plasma impedance in a vacuum chamber, wherein at least one electrode is connected to an AC generator. This AC generator is a free-running...
6852390 Ultraphobic surface for high pressure liquids  
A durable ultraphobic surface that is capable of retaining ultraphobic properties at liquid pressures of one atmosphere and above. The surface generally includes a substrate portion with a...
6852202 Small epicyclic magnetron with controlled radial sputtering profile  
A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of...
6830663 Method for creating radial profiles on a substrate  
The present invention is directed to a method for depositing a radial profile of a target material onto a substrate. The method comprises directing one or more target materials toward a substrate,...
6827825 Method for detecting the position of a shutter disk in a physical vapor deposition chamber  
The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a...
6811657 Device for measuring the profile of a metal film sputter deposition target, and system and method employing same  
An apparatus and method for measuring the erosion profile of a metallic target in a sputtering device are provided by inserting a thin sensor into a gap between the target and a substrate pedestal....
6811656 Method for creating a material library  
A method for creating a material library of surface areas having different properties in which a substrate is coated. The substrate is subjected to a combined pretreatment procedure.
6797128 Method for regulating sputtering processes  
The invention relates to a method for regulating MF or HF sputtering processes, a harmonic analysis of the electrical discharge parameters being implemented and the MF or HF output and/or the...
6790322 Production of material libraries using sputter methods  
In a process for the combinatorial production of a library of materials in the form of a two-dimensional matrix in the surface region of a planar substrate by sputtering, the planar target used for...
6783641 Vacuum treatment system and process for manufacturing workpieces  
A vacuum treatment system has a vacuum treatment chamber, has an ACTUAL value sensor to establish a treatment atmosphere in the form of a regulating element of a control circuit. The treatment...
6783640 Sputtering method and sputtering apparatus  
In a sputtering method for forming a film on a substrate in a film forming space while monitoring emission intensity of plasma, the method comprises the steps of detecting a thickness of the film...
6752911 Device and method for coating objects at a high temperature  
The invention relates to a device for coating an object at a high temperature by means of cathode sputtering, having a vacuum chamber and a sputter source, the sputter source having a sputtering...
6746577 Method and apparatus for thickness control and reproducibility of dielectric film deposition  
The invention embodies a method and apparatus for controlling the thickness of a dielectric film formed by physical vapor deposition (PVD). The method compensates for the continuously varying...
6743341 Apparatus for applying thin layers to a substrate  
A process gas source ( 16 ) is connected to the vacuum chamber ( 5 ), and a metering valve ( 12 ) actuated by an automatic controller is installed between the vacuum chamber ( 5 ) and the process...
6740210 Sputtering method for forming film and apparatus therefor  
Since the transfer speed of a substrate is controlled to compensate for a film-forming rate, and an electric power applied to heating means for heating the substrate is controlled so that thermal...
6736944 Apparatus and method for arc detection  
An apparatus and technique are provided for generating a plasma using a power supply circuit and arc detection arrangement. The power supply circuit has a cathode enclosed in a chamber, and is...
6723210 Method for improving performance of sputtering target  
A method for improving a performance of a sputtering target in a magnetron sputtering system having at least one magnet repetitively and retracingly scanning between two sides thereof and receiving...
6695954 Plasma vapor deposition with coil sputtering  
A method and apparatus for depositing a layer of a material which contains a metal on a workpiece surface, in an installation including a deposition chamber; a workpiece support providing a...
Matches 1 - 50 out of 363 1 2 3 4 5 6 7 8 >