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7582490 |
Controlled fabrication of gaps in electrically conducting structures
A method for controlling a gap in an electrically conducting solid state structure provided with a gap. The structure is exposed to a fabrication process environment conditions of which are...
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7569123 |
Optimizing target erosion using multiple erosion regions in a magnetron sputtering apparatus
In one embodiment, the erosion profile of a shaped target (e.g., hollow cathode target) of a magnetron apparatus is enhanced by using a plurality of sputtering tracks, such as plasma loops, on the...
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7566384 |
System and apparatus for real-time monitoring and control of sputter target erosion
The present invention relates to a method and apparatus for real-time monitoring and controlling surface area erosion of a sputter target assembly utilized in a physical vapor deposition process.
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7556718 |
Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
This invention relates to ionized PVD processing of semiconductor wafers and provides conditions for highly uniform deposition-etch process sequence and coverage capabilities of high aspect ratio...
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7537676 |
Cathode apparatus to selectively bias pallet during sputtering
A system and method for sputtering having a substrate holder, the target-cathode and the shield that are all electrically isolated from each other and are all capable of independently being...
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7498587 |
Bi-directional filtered arc plasma source
An apparatus for generating plasma includes a cathode having an evaporable surface configured to emit a material comprising plasma and macroparticles; oppositely directed output apertures...
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7476302 |
Apparatus and method to deposit magnesium oxide film on a large area
An apparatus and method to deposit a MgO film on a large substrate area. The method includes applying a voltage to one or more magnesium targets; applying an electric current to the one or more...
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7476301 |
Procedure and device for the production of a plasma
The present invention concerns a procedure for the production of a plasma that is at least co-produced in the vacuum chamber ( 1 a ) of a vacuum recipient ( 1 ) of a device suitable for plasma...
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7450233 |
Measuring device for the measurement of optical properties of coated substrates
A measuring device includes several sequentially disposed coating chambers for measuring optical properties of coated substrates. These coating chambers are separated from one another by...
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7445695 |
Method and system for conditioning a vapor deposition target
A method and system for conditioning a vapor deposition target is described. In one illustrative embodiment, a vapor deposition system is operated in which a vapor deposition target is used, the...
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7388201 |
Radiation detector having coated nanostructure and method
A radiation detector has an electron emitter that includes a coated nanostructure on a support. The nanostructure can include a plurality of nanoneedles. A nanoneedle is a shaft tapering from a...
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7378001 |
Magnetron sputtering
A magnetron sputtering apparatus has a controller for selectively releasing the spread of plasma on a substrate on a support. The controller can also contain the plasma when the substrate is to be...
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7338581 |
Sputtering apparatus
A sputtering apparatus includes paired targets 31 disposed in a vacuum chamber 30 , substrate holder 33 disposed at a position nearly perpendicular to the paired target 31 and apart from a...
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7282122 |
Method and system for target lifetime
A method and system for determining a lifetime of a target for a physical vapor deposition tool ( 302 ), has, a mapping table ( 304 a ) of criteria for a minimum accumulating rate of Δ wafers...
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7261797 |
Passive bipolar arc control system and method
A method and system for controlling arcs in a DC sputtering system with a passive circuit is presented. The arc control system includes a sputtering chamber that houses an anode and a sputtering...
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7247221 |
System and apparatus for control of sputter deposition process
A method and apparatus for sputter deposition in which both a pulsed DC power supply and an RF power supply apply power to the target in the sputter deposition equipment. The pulsed DC power supply...
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7232506 |
System and method for feedforward control in thin film coating processes
A system and method for feedforward control in thin film coating processes. A standard PID feedback control system that continuously monitors two or more process variables in a reactive sputtering...
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7216544 |
Ultrasonic inspection reference standard for composite Materials
An ultrasonic inspection reference standard for composite materials includes a prism that is manufactured from a polymer resin. The ultrasonic inspection reference standard may be a rectangular...
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7204915 |
Patterned medium, method for fabricating same and method for evaluating same
A process for fabricating a patterned medium including a dot-forming step for forming a dot array constituted by sample magnetic dots having a predetermined size such as a single domain particle...
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7192505 |
Wafer probe for measuring plasma and surface characteristics in plasma processing environments
There is provided by this invention a wafer probe for measuring plasma and surface characteristics in plasma processing environment that utilizes integrated sensors on a wafer substrate. A...
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7186319 |
Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
A multi-track magnetron having a convolute shape and asymmetric about the target center about which it rotates. A plasma track is formed as a closed loop between opposed inner and outer magnetic...
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7179352 |
Vacuum treatment system and process for manufacturing workpieces
A process is disclosed for manufacturing coated substantially plane workpieces, in which the workpieces are guided to a vacuum treatment area guided by a control. The treatment atmosphere is...
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7172681 |
Process for producing rubber-based composite material
Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the...
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7172675 |
Observation window of plasma processing apparatus and plasma processing apparatus using the same
An observation window airtightly installed at a wall of a processing room of a plasma processing apparatus includes a body having a through hole with an opening facing the processing room, a...
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7153399 |
Method and apparatus for producing uniform isotropic stresses in a sputtered film
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of...
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7147759 |
High-power pulsed magnetron sputtering
Magnetically enhanced sputtering methods and apparatus are described. A magnetically enhanced sputtering source according to the present invention includes an anode and a cathode assembly having a...
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7105080 |
Vacuum treatment system and method of manufacturing same
Method for manufacturing a workpiece by a vacuum treatment process includes providing a vacuum treatment system with first second parts in a vacuum chamber. Either a sensor or an adjusting element...
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7087142 |
Method for determining a critical size of an inclusion in aluminum or aluminum alloy sputtering target
The present invention relates to a method for determining a critical size for a diameter of an Al 2 O 3 inclusion ( 38 ) in an Al or Al alloy sputter target ( 42 ) to prevent arcing during...
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7063773 |
High purity sputter targets with target end-of-life indication and method of manufacture
A preferred sputter target assembly ( 10, 10 ′) comprises a target ( 12, 12 ′), a backing plate ( 14, 14 ′) bonded to the target ( 12, 12 ′) along an interface ( 22, 22 ′) and dielectric...
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7048837 |
End point detection for sputtering and resputtering
Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a...
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7041200 |
Reducing particle generation during sputter deposition
In a magnetron sputtering chamber, a substrate is placed in the chamber and a deposition shield is maintained about the substrate to shield internal surfaces in the chamber. The deposition shield...
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7037595 |
Thin hafnium oxide film and method for depositing same
A thin layer of hafnium oxide or stacking of thin layers comprising hafnium oxide layers for producing surface treatments of optical components, or optical components, in which at least one layer...
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7033461 |
Thin film forming apparatus and method
The present invention provides an efficient thin film forming apparatus which is capable of correcting a film thickness so as to take care of a variation in distribution in the film thickness and...
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7025895 |
Plasma processing apparatus and method
A plasma processing apparatus and method are capable of performing etching with high precision without damaging the semiconductor wafer. The plasma processing apparatus has a plasma generation...
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7008518 |
Method and apparatus for monitoring optical characteristics of thin films in a deposition process
The present invention is directed at least in part to methods and apparatus for optically monitoring selected optical characteristics of coatings formed on substrates during the deposition process...
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6974524 |
Apparatus, method and system for monitoring chamber parameters associated with a deposition process
Apparatus and methods for measuring characteristics of a metallic target as well as other interior surfaces of a sputtering chamber. The apparatus includes a sensor configured to emit an energy...
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6911124 |
Method of depositing a TaN seed layer
We have discovered a method of providing a thin approximately from about 20 Å to about 100 Å thick Ta N seed layer, which can be used to induce the formation of alpha tantalum when tantalum is...
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6905578 |
Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure
An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as these for GMR and MRAM...
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6896773 |
High deposition rate sputtering
Methods and apparatus for high-deposition sputtering are described. A sputtering source includes an anode and a cathode assembly that is positioned adjacent to the anode. The cathode assembly...
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6872284 |
Target and method of optimizing target profile
A method of constructing increased life sputter targets and targets made by the method are disclosed. The method comprises starting with a precursor target design or profile and making magnetic...
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6863785 |
Sputtering apparatus and sputter film deposition method
A sputtering apparatus and a sputter film deposition method, which includes a conventional magnetron and an AC magnetron for deposition of a low refractive index film, and a conventional magnetron...
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6860973 |
Device for the regulation of a plasma impedance
The invention relates to a device for the regulation of a plasma impedance in a vacuum chamber, wherein at least one electrode is connected to an AC generator. This AC generator is a free-running...
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6852390 |
Ultraphobic surface for high pressure liquids
A durable ultraphobic surface that is capable of retaining ultraphobic properties at liquid pressures of one atmosphere and above. The surface generally includes a substrate portion with a...
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6852202 |
Small epicyclic magnetron with controlled radial sputtering profile
A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of...
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6830663 |
Method for creating radial profiles on a substrate
The present invention is directed to a method for depositing a radial profile of a target material onto a substrate. The method comprises directing one or more target materials toward a substrate,...
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6827825 |
Method for detecting the position of a shutter disk in a physical vapor deposition chamber
The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a...
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6811657 |
Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
An apparatus and method for measuring the erosion profile of a metallic target in a sputtering device are provided by inserting a thin sensor into a gap between the target and a substrate pedestal....
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6811656 |
Method for creating a material library
A method for creating a material library of surface areas having different properties in which a substrate is coated. The substrate is subjected to a combined pretreatment procedure.
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6797128 |
Method for regulating sputtering processes
The invention relates to a method for regulating MF or HF sputtering processes, a harmonic analysis of the electrical discharge parameters being implemented and the MF or HF output and/or the...
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6790322 |
Production of material libraries using sputter methods
In a process for the combinatorial production of a library of materials in the form of a two-dimensional matrix in the surface region of a planar substrate by sputtering, the planar target used for...
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