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5093989 |
Method of making heat-resistant hermetic packages for electronic components
A heat-resistant package for electrical components comprises a housing composed of a plurality of independent side walls made of heat resistant ceramic material. Sealed-in leads are provided in one...
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5090919 |
Terminal piece sealing structure
A seal structure for an electric device having an electrically conductive lead portion which passes through a through hole in a bottom surface of an electrically insulating housing. Additionally,...
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5077536 |
Device for protecting electric power resistances and anti-overpressure system
A device for the protection of electric power resistances assembled in a battery using rods, insulating guns and isolators all housed within a dust tight and water jet tight parallelepipedic...
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5043211 |
Epoxy resin composition and a resin-sealed semiconductor device
An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder,...
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5039942 |
Cable supporting insert closing an opening in the housing of an inductive rotational speed sensor
A measurement pickup comprising a housing having a side opening, a measuring element located in the housing, a connection cable extending through the side opening and connected with the measuring...
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5032953 |
Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and...
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5028987 |
High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid....
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5019829 |
Plug-in package for microwave integrated circuit having cover-mounted antenna
A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one...
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5016086 |
IC card
An IC card having a connection portion, a changeover switch and card-shaped memory means in which an integrated circuit is accommodated within a prescribed case and has a processor and memory. Lead...
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5001451 |
Sub-miniature electrical component
A sub-miniature fuse for electrical protection includes an assembly of an outer tube and an inner tube made of insulating material. The inner tube has electrodes and a fusible metal link sputtered...
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4966559 |
Internal terminal block for compressor hermetic terminal
A terminal block assembly for connection to the interior side of an electrical hermetic terminal of a hermetic compressor is disclosed. The hermetic terminal comprises a cup-shaped metallic body...
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4961105 |
Arrangement of a semiconductor device for use in a card
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the...
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4943686 |
Seal frame and method of use
A sealing frame arrangement is disclosed for creating a hermetic seal between two components or bodies such as a connector and heat sink module of an integrated circuit package. The frame members...
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4931854 |
Low capacitance integrated circuit package
An integrated circuit package utilizing low temperature sealing glass and having reduced lead capacitance. Voids in the glass material on the base substrate and the cap substrate result in the...
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4908086 |
Low-cost semiconductor device package process
An adhesive composition for attaching semiconductor die to a substate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane cross-linking agent. For...
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4903830 |
Automatic mounting chip component
A novel tubular chip component for holding a probe for examination having a rectangularly parallelepipedic cross section and made of a metal having a solderable outer surface and a not solderable...
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4870224 |
Integrated circuit package for surface mount technology
The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the...
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4862323 |
Chip carrier
A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer...
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4855808 |
Hermetic glass chip carrier
A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and...
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4852250 |
Hermetically sealed package having an electronic component and method of making
Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape...
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4847557 |
Hermetically sealed magnetic sensor
A hermetically sealed magnetic sensor for detecting variations in a magnetic field has a sensor element with an output terminal for detecting variations in the magnetic field and generating a...
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4843695 |
Method of assembling tab bonded semiconductor chip package
A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the...
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4839716 |
Semiconductor packaging
A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a...
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4833102 |
Process of making a ceramic lid for use in a hermetic seal package
A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the...
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4821151 |
Hermetically sealed package
A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive...
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4814943 |
Printed circuit devices using thermoplastic resin cover plate
A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof...
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4805009 |
Hermetically sealed semiconductor package
The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a...
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4801488 |
Sealing glass composite
The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of...
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4791258 |
Sealed enclosure for electrical circuitry in moist environment
A sealed enclosure is provided for electrical circuitry to be located in a moist environment, as near a spa. The enclosure includes a housing of electrical insulating material, a display overlay...
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4788382 |
Duplex glass preforms for hermetic glass-to-metal compression sealing
A duplex glass preform for forming hermetic glass-to-metal seals of the compression type. The duplex glass preform comprises a glass infrasturcture or matrix having at least one end thereof...
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4783697 |
Leadless chip carrier for RF power transistors or the like
A leadless chip carrier for RF power transistors or the like is disclosed which includes a body of insulating material having two major surfaces and side walls joining the major surfaces. In a...
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4781621 |
Sealing material receiving structure in a junction block
A sealing material receiving structure in a junction block for use on a vehicle or the like is provided. The junction block comprises a top cover provided with a connector or connectors, or a...
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4780578 |
Anerobic sealed rotary switch
A rotary switch includes an open ended housing and a stator closing the open end of the housing. There is a seal member positioned between the stator and housing. The stator is formed of plastic...
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4777520 |
Heat-resistant plastic semiconductor device
A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first...
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4774383 |
Water tight seals for electronics package
Sealing assemblies (16, 18, 20) are disclosed for isolating electronic circuitry (14) within a magnetometer (12) from the effects of water intrusion when the magnetometer is used under water. The...
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4769272 |
Ceramic lid hermetic seal package structure
A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the...
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4758689 |
Card-type thin electronic device
A card-type thin electronic device in which the upper and lower panels are bonded to flanges projecting from a side-wall forming frame between the two panels, while a number of grooves are formed...
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4748294 |
Housing for an electromechanical device
A relay housing comprising a cover plate which is inserted in a step-shaped recess of a housing rim. The rim portion of the plate has a reduced thickness so that there is formed a rim channel...
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4742182 |
Flatpack for hermetic encapsulation of piezoelectric components
A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a...
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4742024 |
Semiconductor device and method of producing semiconductor device
A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the...
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4737884 |
Semiconductor device module
A semiconductor device module includes a package and a holder, the package includes, for example, a central processing unit, and the holder accommodates a removable leadless chip carrier. The...
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4736520 |
Process for assembling integrated circuit packages
Automatic manufacture of integrated circuit packages including a leadless chip carrier is facilitated by providing, in strip form, flexible tape circuitry having a dielectric layer and a conductive...
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4727410 |
High density integrated circuit package
A multifaceted package is disclosed that permits VLSI and VHSIC integrated circuits in the form of integrated circuit die or chip carries to be mounted on the faces of the package to form a...
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4722137 |
High frequency hermetically sealed package for solid-state components
A package for discrete components is hermetically sealed, has very low parasitic inductance and capacitance, small size, 50 ohm input and output leads and is suitable for surface mount...
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4721543 |
Hermetic sealing device
A method and apparatus for effecting a hermetic seal between an electronic component package and a package cover is disclosed. The method includes the steps of bonding a heater layer of conductive...
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4714981 |
Cover for a semiconductor package
A cover for a semiconductor package includes a composite layer on its upper most surface containing a passive circuit. The passive circuit may include a number of passive components to fulfill...
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4701999 |
Method of making sealed housings containing delicate structures
A method of making an integrated circuit package comprising an integrated "chip" within an hermetically sealed housing with external electrical leads extending from the chip terminals, and the...
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4675987 |
Method of sealing a relay
A relay is sealed with a sealing compound when the relay housing is in a closed state, thus causing an air cushion to be formed in the inside, with an afterflow of sealing compound into the...
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4675472 |
Integrated circuit package and seal therefor
An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band...
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4675779 |
Telephone protector module having self-contained sealing means
An improved telephone protector module construction for use with individual subscriber circuits in which the inner end wall having contact means thereon is recessed to accommodate a sealing gasket...
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