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8183473 |
Optimized power package for electrical device
Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an...
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8111527 |
Standardized support element with integrated interface
A support element for an electronic control device includes receivers for peripheral electronic components and at least one path region for guiding electrical connections. The electrical...
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8059404 |
Power inverters
Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and...
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8059411 |
Vehicular electronics assembly
An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic...
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8050054 |
Electronic device with a base plate
A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece...
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8031470 |
Systems and methods for thermal management
A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power...
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8014167 |
Liquid crystal material sealed housing
A hermetically sealed housing having a base deck, a cover member and a seal assembly constructed of a liquid crystal material (LCM), the base deck and cover member forming an enclosure containing...
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7948767 |
Integrated circuit packaging structure and method of making the same
The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a...
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7944697 |
Electronic equipment
Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic...
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7933126 |
Solid state relay with internal heat sink
A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type...
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7924565 |
Heat dissipation structure for communication chassis
A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe...
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7919854 |
Semiconductor module with two cooling surfaces and method
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first...
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7914902 |
Thermal module
A thermal module directly press-forged from magnesium alloy is disclosed having a peripheral wall, a recessed chamber surrounded by the peripheral wall. The body is made of magnesium alloy by means...
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7864534 |
Apparatus for mounting a module and enabling heat conduction from the module to the mounting surface
An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a...
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7863528 |
Housing with thermal bridge
A hermetically sealed and/or ignition protection housing is provided with heat bridges at discreet points. The heat bridges form mounting faces in the interior space of the housing and also on the...
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7855891 |
Modular heat sinks for housings for electronic equipment
A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components...
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7834444 |
Heatplates for heatsink attachment for semiconductor chips
An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid...
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7765687 |
Method for mechanical packaging of electronics
Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material...
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7764500 |
Electronic system with a heat sink assembly
An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel...
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7760507 |
Thermally and electrically conductive interconnect structures
An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body,...
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7750252 |
Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies
An apparatus and method are provided for limiting failure noise and smoke emissions produced as a result of electrical failure conditions and/or failed electronic devices or assemblies of...
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7742295 |
Cooling device and electronic device
According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion...
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7679886 |
Engine control device
An engine control device, especially an engine control device having an internal by-pass, is disclosed. The universally applicable engine control device includes an integrated by-pass function. For...
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7619896 |
Electrical junction box
The present invention improves heat dissipation of an electrical junction box. An electrical junction box includes a housing which houses a control circuit board disposed perpendicular to a power...
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7576995 |
Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex...
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7525803 |
Power converter having multiple layer heat sinks
A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat...
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7498673 |
Heatplates for heatsink attachment for semiconductor chips
An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid...
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7485815 |
Mounting device for a capacitor
A mounting device for mounting a capacitor on a connector element includes a hollow body defining a continuous through-hole that axially penetrates the body for receiving and mounting the...
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7459629 |
Extension box of storage media
The invention discloses an extension box of storage media, which mainly utilized a plurality of heat dissipation fins protruding from a bottom surface of a bottom shell of the extension box. The...
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7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame...
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7394029 |
Module, method of manufacturing module, and electronic apparatus using module
A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal...
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7371965 |
Modular cage with heat sink for use with pluggable module
A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a...
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7365273 |
Thermal management of surface-mount circuit devices
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first...
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7292447 |
Back plate assembly for a board
A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion...
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7272015 |
Electronic unit with EMC shielding
To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat...
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7180173 |
Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid...
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7109413 |
Inlet with heat-isolation element
An inlet with a heat-isolation element to be disposed in an opening of an electronic apparatus is disclosed. The inlet comprises a conductive terminal disposed on one surface thereof and a...
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7094966 |
Packaging integrated circuits with adhesive posts
A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and...
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6943293 |
High power electronic package with enhanced cooling characteristics
A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed...
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6903271 |
Electronic assembly with thermally separated support
According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support...
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6882531 |
Method and rack for exchanging air with modular bricks in a computer system
A modular computing system that includes an enclosure and a rack at least partially mounted within the enclosure. The modular computing system further includes a plurality of modular bricks that...
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6822875 |
Assembly of opto-electronic module with improved heat sink
A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter...
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6819572 |
Electromagnetic noise suppression device
Briefly, in accordance with one embodiment of the invention, an electromagnetic interference (EMI) reduction device may include a circuit and at least one heatsink. The circuit may include analog...
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6813154 |
Reversible heat sink packaging assembly for an integrated circuit
A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat...
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6809931 |
Heat sink apparatus that provides electrical isolation for integrally shielded circuit
In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole...
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6797880 |
Plastic frame for the mounting of an electronic heavy-current control unit
A plastic frame (8) serves for the simple mounting of an electronic heavy-current control unit. It has cutouts (20, 21, 22, 23, 24) for the positionally accurate receiving of busbars (4, 5, 6, 7;...
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6791847 |
Retention module for heat sink
A retention module (30) of the present invention is fastened to a motherboard (50), and surrounds a land grid array (LGA) central processing unit (CPU) (52) which is engaged on an LGA socket (54)...
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6778388 |
Water-resistant electronic enclosure having a heat sink
A device and method for enclosing electronics in a waterproof environment and transferring the heat generated by the electronics to an external environment is provided. The device includes a...
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6680849 |
Extruded heatsink and EMC enclosure
An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component...
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6664463 |
Apparatus and method for shielding electromagnetic radiation
An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by...
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