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7378040 Method of forming fluoropolymer binders for carbon nanotube-based transparent conductive coatings  
This invention relates to flexible, transparent and conductive coatings and films formed using carbon nanotubes (CNT) and, in particular, single wall CNT, with polymer binders. Preferably, coatings...
7309838 Multi-layered circuit board assembly with improved thermal dissipation  
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
7189929 Flexible circuit with cover layer  
Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more...
7175893 Corrosion protection method  
A corrosion protection covering method for spliced regions of reinforcing steel is disclosed. The covering may include an outer, heat shrinkable layer and a flowable inner layer. The covering is...
7118693 Conformal coatings comprising carbon nanotubes  
The invention is directed to conformal coatings that provide excellent shielding against electromagnetic interference (EMI). A conformal coating comprises an insulating layer and a conducting layer...
6940022 Protective coating for an electronic device  
An electronic device includes a surface and a conductive termination on the surface. A protective conformal coating on the surface of the electronic device includes a window formed in the...
6881896 Semiconductor device package  
A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor...
6858799 Electronic component with a semiconductor chip and method of producing the electronic component  
An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor...
6670550 Underfill coating for LOC package  
A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die,...
6610925 Surface mounting electronic component  
A surface mounting electronic component with external electrodes has a structure in which plated coatings are laminated on metallic coatings by a wet barrel plating method, so as to achieve reduced...
6492589 Electronics enclosure utilizing thermal insulating ceramic coating  
An electronics enclosure ( 10 ) utilizing thermal insulating ceramic coating ( 50 ) includes a first member ( 14 ) having a first surface ( 26 ), and a second member ( 16 ) having a second surface...
6350952 Semiconductor package including heat diffusion portion  
Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the...
6326544 Polymer based circuit  
A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate...
6326543 Self-sealing accessible container  
A portable electronic device (10) is configured to include an accessible container (12) which has an access hatch (16) and a receptacle (18). The hatch (16) and receptacle (18) are each one-piece...
6265065 Concrete reinforcement protection system  
A corrosion-resistant joint for use on concrete reinforcing rods and a method to create such a joint are provided. Metal reinforcing bars are typically coated to resist corrosion. However, cutting,...
6204448 High frequency microwave packaging having a dielectric gap  
A hermetically sealed package assembly for microwave circuits in the high microwave frequencies having a dielectric gap defined in the substrate. The package assembly comprises a substrate for...
6201185 Substrate for mounting electronic part having conductive projections and process for manufacturing the same  
A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection...
6002584 Heat protective enclosure and heat protected electronic device  
In a high-temperature protective arrangement for an electronic device, which as such generates heat, the electronic device is enclosed by a heat protective enclosure provided with gaps for...
5990418 Hermetic CBGA/CCGA structure with thermal paste cooling  
A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The...
5959247 Low cost protective coating and method for a die-on-board electronic assembly  
An electronic circuit assembly includes a printed circuit board having a plurality of conductors formed thereon. An integrated circuit die is mounted directly on and bonded to the circuit board. A...
5910641 Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation  
An electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting...
5821455 Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid  
A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the...
5817987 Circuit board housing with molded in heat tab  
The present invention provides a housing for an auxiliary circuit to be connected to a main circuit. The housing includes a heat tab for conducting the heat away from the auxiliary circuit...
5767447 Electronic device package enclosed by pliant medium laterally confined by a plastic rim member  
The bottom and side surfaces of an electronic device, such as an integrated circuit chip or a multichip assembly, are surrounded by a soft gel medium. The gel medium is laterally confined by a...
5764484 Ground ring for a metal electronic package  
There is provided a component for an electronic package and a method for the manufacture of that component. The component has a metallic substrate with a surface coated by a dielectric. A centrally...
5677511 Overmolded PC board with ESD protection and EMI suppression  
An apparatus directed to portable peripheral cards is disclosed which provides protection against electro-static discharge and electro-magnetic interference. Furthermore, this apparatus provides a...
5650593 Thermally enhanced chip carrier package  
A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a...
5639990 Solid printed substrate and electronic circuit package using the same  
The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil...
5596171 Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit  
A package for a semiconductor die, particularly field effect transistors, operating at very high frequencies includes a base having integrally formed conductor supports. The base and the supports...
5593721 Method for manufacturing a piezoelectric resonant component  
An organic silicon compound 10 is applied around vibrating electrodes 3a and 3b of a piezoelectric resonant element 1. A compound such as silane, chlorosilane, silazane, silthiane, siloxane,...
5585600 Encapsulated semiconductor chip module and method of forming the same  
The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip...
5557142 Shielded semiconductor device package  
A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor...
5550323 Mounting of electronic devices  
In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12, 14) of insulating material by means of a plurality of...
5537739 Method for electoconductively connecting contacts  
A method for electroconductively connecting two electronic circuits to one another. A contact is coated with a liquefied, electrically conductive, flux-free solder, and the coated contact is...
5536907 Semiconductor package  
A semiconductor package includes a package body, a semiconductor chip disposed on the surface of the package body, external lead terminals disposed on two opposite side surfaces of the package...
5532910 Hybrid integrated circuit and process for producing same  
A hybrid integrated circuit having a lead frame electrically connected to electronic components by means of a silver (Ag) paste, the hybrid integrated circuit comprising: an electroless-plated...
5475379 Solid phase conformal coating suitable for use with electronic devices  
An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically...
5473512 Electronic device package having electronic device boonded, at a localized region thereof, to circuit board  
An electronic device, such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board, with which it is thermal expansion mismatched, by three or more localized...
5466888 Packaged semiconductor device having stress absorbing film  
A packaged semiconductor device has a semiconductor chip and leads formed over the chip with an electrically insulating film interposed therebetween and a packaging material for sealing the chip...
5462624 Embedded inter-connect frame  
Method and apparatus for connecting an I/O pad of an integrated circuit die to an electrical lead or contact on a lead frame that uses interposers formed directly on the die attach pad of the lead...
5455745 Coated bonding wires in high lead count packages  
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To...
5455386 Chamfered electronic package component  
There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package...
5438480 Printed circuit board and electronic parts to be mounted thereon  
Disclosed are a printed circuit board which buries the leads of electronic parts mounted on a printed board into a coating material to prevent the occurrence of a leak between the leads, and an...
5422788 Technique for enhancing adhesion capability of heat spreaders in molded packages  
Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The...
5406027 Mounting structure and electronic device employing the same  
The present invention relates to a mounting structure adapted to be mainly used commercially and to an electronic device employing such mounting structure. A board carrying a plurality of chips is...
5403975 Anodized aluminum electronic package components  
A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and...
5399804 Semiconductor device and method of producing the same  
A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is...
5390082 Chip carrier with protective coating for circuitized surface  
A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip...
5374786 Ceramic wall hybrid package with washer and solid metal through wall leads  
A package for electrical circuitry and method of making same wherein the package is provided with apertured ceramic side walls. Ceramic layers, which have been previously co-fired together and have...
5352852 Charge coupled device package with glass lid  
A charge coupled device package with a glass lid is provided. The package includes a charge coupled device having a plurality of conductive bumps on its bond pads, an insulating tape bonded to the...
Matches 1 - 50 out of 155 1 2 3 4 >