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7358438 |
Sandwich housing for an antenna amplifier
An antenna amplifier has its printed circuit board clamped between upper and lower housing parts which have peripheral edges raised to engage the periphery of the circuit board between them. A...
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7211742 |
Fire resistant, forced air cooled enclosure for computer digital data storage device
A fire resistant, forced air cooled enclosure for one or more computer digital data storage devices is provided. An operable digital data storage device is mounted in a fire resistant enclosure....
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7161094 |
Modifying the electro-mechanical behavior of devices
A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational...
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7122748 |
Semiconductor device having packaging structure
There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and...
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7012191 |
Lead wire sealing device, recording disk drive, and method for sealing housing member
According to a lead wire sealing device of an example of the present invention, a bush 116 is inserted in a housing through hole 113 formed in a bottom plate member 1110 and a lead wire 1343...
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6956167 |
Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame
A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the...
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6874295 |
Insulating unit for an electrical box
An insulating unit for an electrical box for insulating an electrical box. The insulating unit for an electrical box includes a rear portion, a lower portion extending from the rear portion, an...
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6797881 |
Cross substrate, method of mounting semiconductor element, and semiconductor device
A cross substrate and a method of mounting a semiconductor element are provided in which semiconductor elements can be mounted at a high density. Element side electrodes of a circuit forming...
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6777613 |
Multifunctional crystal unit and method of manufacturing the same
A multifunctional crystal unit in which in the same container constituted by a container body having a recess therein and a cover, a plurality of crystal blanks are hermetically encapsulated. In...
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6777612 |
Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on...
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6756540 |
Self-adhering chip
An integrated circuit (chip) with attachment elements for attaching of the chip on a carrier, the attachment elements being designed in a way such that they can enter into a releasable connection...
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6727431 |
Optical module, circuit board and electronic device
An optical chip having an optical section and an electrode is formed above a substrate. The optical chip is surrounded by a body. The optical section is sealed by a first seal section. An...
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6706967 |
Lead-less semiconductor device with improved electrode pattern structure
A semiconductor device includes an insulating substrate having a first main face which is sealed with a sealing material and at least a set of input and output electrode patterns provided on the...
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6572004 |
Hermetically sealed component assembly package
A hermetically sealed electrical package having wires entering at the base and being embedded vertically in its walls for connecting to the leads of a component assembly within the package. The...
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6570259 |
Apparatus to reduce thermal fatigue stress on flip chip solder connections
The present invention provides a package for a semiconductor chip that minimizes stresses and strains that arise from differential thermal expansion on chip-to-substrate or chip-to-card...
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6545583 |
Sealing a lead from a confined cavity of an apparatus such as a solenoid
The sealing mechanism comprises a cap and a grommet for sealing an electrical lead extended from a coil overmold or a closed cavity. The grommet provides a first seal against the electrical lead...
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6486398 |
Sealing arrangement for an electronic circuit module
A sealing arrangement is provided for sealing an orifice between an interior and an exterior surface of an electronic module. An air-permeable, water-impermeable membrane is disposed in the...
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6392159 |
Embedded structure for engineering change and repair of circuit boards
A circuit board structure is described for facilitating engineering changes for a multichip module mounted on the circuit board. The structure includes a first layer of a conductive material...
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6392143 |
Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same
There is provided a flexible package which includes a flexible substrate on a principal surface of which a plurality of metal wirings are formed, a flexible semiconductor chip attached over the...
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6357818 |
Trailer wiring retention and protection system
This invention relates to a trailer body including a wiring protection system wherein a trailer body is supported at least in part on a plurality of wheels and has at least a floor associated...
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6353182 |
Proper choice of the encapsulant volumetric CTE for different PGBA substrates
The present invention describes a method and apparatus for packaging a flip chip by matching the z-direction CTE of the IC solder joint with the z-direction CTE of the encapsulant. Consideration of...
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6340792 |
Mold cap for semiconductor device mold package
In a semiconductor device mold package composed of a mold cap and a mold case both of which are formed of a resin compound and which are joined to each other to form a hollow inner space defined...
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6333460 |
Structural support for direct lid attach
An electronic chip assembly having the following components: a substrate having electrical conductors therein; an electronic circuit chip affixed face down to the substrate so as to make...
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6281435 |
Chip-type electronic devices
A chip-type electronic device has a substrate with a vertically extending groove formed on each of its mutually opposite edges. A solder material fills these grooves partially to a height which is...
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6268562 |
Sealed container and method for assembling it
Sheaths accommodate a high-voltage conductor in their insides, and annular grooves are respectively provided in flanges of the sheaths outwardly of inserting holes for bolts which are disposed in...
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6264778 |
Reinforced sealing technique for an integrated circuit package
One or more reinforcement pins are inserted between the lid and base of a sealed integrated-circuit package. The reinforcement pins reinforce a sealing layer between the lid and the base,...
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6191360 |
Thermally enhanced BGA package
A BGA package includes a substrate, a chip, and a heat spreader. The spreader covers the chip, a bottom part of the spreader is mounted on an upper surface of the substrate by an adhesive. The...
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6140579 |
Electric appliance housing, especially for a consumption meter
An electric appliance housing, especially for a consumption meter, includes a base part and a closure part which are each molded in one piece from synthetic material and which can be secured by a...
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6127629 |
Hermetically sealed microelectronic device and method of forming same
A microelectronic device is hermetically sealed at the wafer level. A substrate is provided having associated electronics and at least one metal bonding pad. A dielectric layer, such as pyrex glass...
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6101099 |
Method and device for connecting electrical components to printed circuit boards
The present invention relates to a device and a method for electrical and mechanical connection of an electric high-power component (111) which transmits high-frequency electrical signals to...
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6049971 |
Casing for integrated circuit chips and method of fabrication
A method for fabricating a lead frame that includes a platform attached thereto for mounting a chip. A base frame is provided for mounting chips of various sizes. The base frame includes connection...
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6049038 |
Flip-chip resin sealing structure and resin sealing method
A sealing resin mixed with filler is used to seal a space between a flip-chip mounted semiconductor device and a printed circuit board. An integrated circuit chip joined to the printed circuit...
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6014318 |
Resin-sealed type ball grid array IC package and manufacturing method thereof
An IC package suitable for high density mounting and high speed is provided, by improving the humidity resistance and mounting stress resistance at a resin-sealed type BGA package and improving the...
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5999413 |
Resin sealing type semiconductor device
A resin sealing type semiconductor device capable of making a resin burr hard to occur when formed by molds and of restraining cracks in solder, is actualized by providing a stepped portion on a...
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5998733 |
Graphite aluminum metal matrix composite microelectronic package
An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass...
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5901046 |
Surface mount type package unit and method for manufacturing the same
A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes...
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5875102 |
Eclipse via in pad structure
A ball grid array (BGA) integrated circuit package which has a plurality of vias connected to a plurality of solder pads located on a bottom surface of a package substrate. Each via has a portion...
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5851337 |
Method of connecting TEHS on PBGA and modified connecting structure
A method for connecting TEHS to PBGA and a modified connecting structure for TEHS and PBGA are disclosed. The structure improves both heat dissipation efficiency of PBGA by TEHS with high heat...
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5850690 |
Method of manufacturing and assembling an integrated circuit card
In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at...
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5844781 |
Electrical device such as a network protector relay with printed circuit board seal
An electrical device such as a network protector relay is protected from ambient conditions by a housing having a printed circuit board (PCB) providing a seal for the housing and air and water...
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5828000 |
Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor
A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating...
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5827999 |
Homogeneous chip carrier package
A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is...
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5791654 |
Corrosion resistant gasket in combination with aircraft antenna
A corrosion resistant gasket combined with an aircraft antenna, and more particularly to encapsulation of a conductive mesh in a pliable fluorosilicone compound that will not become bonded to...
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5731629 |
Personal memory devices carried by an individual which can be read and written to
A personal data storage device for storing information and a system for storing and reading such information from the storage device. A programmable memory is encapsulated in a potting compound...
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5689089 |
Electronic control module having fluid-tight seals of a polymer material which expands when wet
An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable...
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5545850 |
Guard ring for integrated circuit package
There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic...
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5545465 |
Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits
A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity...
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5536907 |
Semiconductor package
A semiconductor package includes a package body, a semiconductor chip disposed on the surface of the package body, external lead terminals disposed on two opposite side surfaces of the package...
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5532431 |
Sealing construction for electrical connection box and method for forming packing used therefor
A sealing construction for an electrical connection box, in which a waterproof cover is mounted on a main body, including a packing which is fitted into a packing groove of the waterproof cover so...
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5477009 |
Resealable multichip module and method therefore
A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The...
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