Matches 1 - 42 out of 42
Match Document Document Title
7394029 Module, method of manufacturing module, and electronic apparatus using module  
A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal...
7002249 Microelectronic component with reduced parasitic inductance and method of fabricating  
A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing...
6723585 Leadless package  
A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages are disclosed. The described lead frames are generally arranged such that each device...
6612890 Method and system for manufacturing electronic packaging units  
A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by...
6610923 Multi-chip module utilizing leadframe  
A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in...
6534711 Encapsulation package and method of packaging an electronic circuit module  
A package ( 104 ) for encapsulating electronic components ( 102, 122, 550, 660 ) has at least two chambers ( 112, 212 ). Electronic components and modules within the chambers are interconnected by...
6239366 Face-to-face multi-chip package  
A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of...
6080931 Semiconductor package  
A semiconductor package is disclosed, including: (a) two semiconductor chips having a plurality of bonding pads; (b) an insulating circuit film having (i) an insulating base film with a plurality...
6072122 Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates  
In a method for manufacturing an electronic apparatus, an electronic component is mounted on an organic substrate within its cavity. The electronic component is sealed by a concave molded resin...
6043430 Bottom lead semiconductor chip package  
A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper...
6008532 Integrated circuit package having bond fingers with alternate bonding areas  
A leadframe having individual bond fingers incorporating two or more alternate bonding areas. In one embodiment, conventional bond fingers having bonding areas in an outer row are augmented to...
5790378 High density integrated circuit package including interposer  
An integrated circuit package includes a first lead frame attached to the top surface of a substrate or interposer on which the die is mounted, and a second lead frame attached to the bottom...
5777265 Multilayer molded plastic package design  
A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates...
5637828 High density semiconductor package  
The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are...
5579208 Semiconductor device having a plurality of semiconductor chips  
A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At...
5559305 Semiconductor package having adjacently arranged semiconductor chips  
A single stacked semiconductor package has at least two semiconductor chips densely mounted via a lead on chip method for attaching leads of a lead frame by alternately arranging the leads over or...
5535509 Method of making a lead on chip (LOC) semiconductor device  
A semiconductor device including a lead on chip structure employs two frames. One of the frames includes a die pad and an outer frame portion and the other frame includes a plurality of leads and...
5483740 Method of making homogeneous thermoplastic semi-conductor chip carrier package  
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid...
5468910 Semiconductor device package and method of making  
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the...
5410450 Internal wiring structure of a semiconductor device  
External lead-through terminals of a semiconductor device, such as a power transistor module, are internally wired to a circuit assembly by a wiring block consisting of one or more conductive lead...
5402321 Composite device having inductor and coupling member  
A method of producing a composite component and a composite device which are small in size, high in the mass-production aptitude, and stable in the electrical characteristics. The composite...
5263242 Method of making semiconductor package with segmented lead frame  
An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which...
5146662 Lead frame cutting apparatus for various sized integrated circuit packages and method therefor  
A lead frame cutting apparatus for various sized integrated circuit packages and method therefor is disclosed. This apparatus employs punches in conjunction with a thin L-shaped cutting plate,...
5121053 Tab frame and process of testing same  
A tape automated bonding (TAB) frame and a process for testing the same. The frame is designed to receive a die, an integrated chip or other similar components having output leads. The frame...
5034591 Tape automated bonding leads having a stiffener and a method of bonding with same  
An improved lead structure for tape automated bonding includes a stiffener which is an integral part of the leads. The stiffener maintains the alignment and spacing of the leads during fabrication...
4855869 Chip carrier  
A chip carrier including a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect the pads. The chip carrier also includes an integrated circuit...
4820658 Method of making a packaged IC chip  
A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area...
4797787 Lead frame and electronic device  
A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the...
4796078 Peripheral/area wire bonding technique  
An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted...
4761518 Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs  
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock...
4682207 Semiconductor device including leadless packages and a base plate for mounting the leadless packages  
A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a...
4680617 Encapsulated electronic circuit device, and method and apparatus for making same  
Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames)...
4677526 Plastic pin grid array chip carrier  
A low cost injection-molded plastic pin grid array chip carrier is provided as an alternative to a ceramic pin grid array chip carrier, in which an electrically superior package is fabricated by...
4380042 Printed circuit lead carrier tape  
A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers...
4252864 Lead frame having integral terminal tabs  
A continuous strip of stamped and formed lead frames for a semi-conductor chip comprises spaced apart parallel carrier strips with the lead frames connected to one of the carrier strips at...
4195193 Lead frame and chip carrier housing  
A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead...
3838984 FLEXIBLE CARRIER AND INTERCONNECT FOR UNCASED IC CHIPS  
A printed circuit lead frame that functions as a carrier of an integrated circuit (IC) uncased chip for initial handling and testing and later as a means for bonding the chip's contacts to printed...
3698074 CONTACT BONDING AND PACKAGING OF INTEGRATED CIRCUITS  
Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a...
3698073 CONTACT BONDING AND PACKAGING OF INTEGRATED CIRCUITS  
Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to a metallic sheet-frame member having a plurality of...
3629668 SEMICONDUCTOR DEVICE PACKAGE HAVING IMPROVED COMPATIBILITY PROPERTIES  
A semiconductor device package is provided including a lead frame formed of a first preselected conductive material which is thermally and/or chemically compatible with a support carrier material....
3621114 LEAD FRAME CONFIGURATION  
A lead frame configuration for the concurrent fabrication of a plurality of semiconductor devices. Two lead frame structures, each having an elongated metallic member with a plurality of leads...
3404319 Semiconductor device  
Matches 1 - 42 out of 42