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7617600 Process of making an electronic circuit device having flexibility and a reduced footprint  
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
7601562 Microelectronic component assemblies having lead frames adapted to reduce package bow  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
7598601 Current sensor  
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one...
7511232 Substrate for mounting electronic part and electronic part  
The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed....
7488904 Resin molded component fitted with a metal plate and molding method therefor  
A sensor unit ( 1 ) has a metal plate ( 10 ), a resin molded portion ( 20 ) and an oil temperature sensor ( 2 ). Busbars ( 4 ) made of a metal are arranged in the resin molded portion ( 20 ). Since...
7439452 Multi-chip module packaging with thermal expansion coefficiencies  
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress...
7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it  
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame...
7266888 Method for fabricating a warpage-preventive circuit board  
A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a...
7205574 Optical semiconductor device  
An integral-detem-type optical semiconductor device employing lead frame(s) 11 , shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being...
7183485 Microelectronic component assemblies having lead frames adapted to reduce package bow  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
7166807 Current sensor  
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or...
7148430 Electronic component mounting structure onto board  
A rotary electronic component is secured to a board by snap-in engagement of engagement portions provided on mounting portions of the electronic component with respective board engagement portions...
6995315 Current sensor  
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or...
6974909 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module  
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and...
6895664 Method of making an optical coupling device  
A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the...
6864423 Bump chip lead frame and package  
A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in...
6858800 Electronic part with a lead frame  
An electronic component comprises an upper half housing segment and a lower half housing segment. A lead frame to be bent downward toward the lower housing segment projects laterally from an upper...
6734419 Method for forming an image sensor package with vision die in lens housing  
A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully...
6713677 Housing assembly for an electronic device and method of packaging an electronic device  
A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into...
6713676 System and method for converting a DC input voltage to a DC output voltage  
A system for converting a DC input voltage to a DC output voltage includes at least one integrated circuit die electrically coupled to a leadframe. An inductor is also coupled to the leadframe and...
6696669 Circuit and method for heating an adhesive to package or rework a semiconductor die  
System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby...
6667547 High current capacity semiconductor device package and lead frame with large area connection posts and modified outline  
A lead frame for a high power semiconductor device die has three external lead conductors, the outer two of which are reentrantly bent outwardly from the center of the lead frame. When the lead...
6603072 Making leadframe semiconductor packages with stacked dies and interconnecting interposer  
In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is...
6545861 High voltage distribution box with pre-molded lead frame  
A vehicle high voltage electrical distribution box including a housing and a lead frame assembly. The lead frame assembly is located in the housing. The lead frame assembly includes bus bars and an...
6541702 Semiconductor device  
In order to suppress defective lead forming and defective mounting, a semiconductor device includes a sealing body which has a square planar shape, a semiconductor chip which lies within the...
6538304 Corner bonding to lead frame  
A lead frame for an integrated circuit includes a ground for the integrated circuit to ground the integrated circuit, the lead frame having at least one corner connected to the ground; and a...
6518501 Electronic part and method of assembling the same  
An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a...
6483180 Lead frame design for burr-free singulation of molded array packages  
A semiconductor device exhibiting a lower incidence of burrs forming on its contacts during the singulation process. The semiconductor device includes a die which is electrically connected to a set...
6469907 Packaging for power and other circuitry  
Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is...
6362426 Radiused leadframe  
A leadframe with a plurality of leads. The leads of the leadframe extend radially from a first end to a second end such that a portion of each lead has a generally arcuate shape. The first end is...
6316727 Multi-chip semiconductor package  
A multi-chip semiconductor package is described. By changing the design for a lead frame, two or more chips are packaged together. A die pad whose surface area is smaller than that of a chip is...
6307755 Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die  
A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and...
RE37413 Semiconductor package for a semiconductor chip having centrally located bottom bond pads  
A semiconductor package having outer leads which are not protruded from the package but only exposed to outside. The semiconductor package comprises a semiconductor chip which is formed with a...
6268646 Lead frame for lead on chip  
A lead frame for LOC to which a semiconductor chip is fixed within a semiconductor chip-mounting region. In addition to applying insulative adhesives to the conventional portions or spots which are...
6265761 Semiconductor devices with improved lead frame structures  
A lead frame to support a semiconductor die within an encapsulating package. The lead frame includes a first rail and a second rail in a first plane, with the second rail parallel to and spaced...
6265660 Package stack via bottom leaded plastic (BLP) packaging  
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads,...
6262368 Data carrier comprising an implanted module based on a metal lead frame with a double-sided chip cover  
A data carrier has a chip with chip contacts, a transmission coil for contactless communication with a write/read station, a metal lead frame with a chip carrying part and contact forming parts,...
6236567 Electronic device package with enhanced heat dissipation effect  
An electronic device package with enhanced heat dissipation effect comprises a lead frame and an outer frame with electrically insulating surface. The outer frame encloses the electronic device...
6211462 Low inductance power package for integrated circuits  
The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die...
6201186 Electronic component assembly and method of making the same  
An electronic component assembly (10) is formed by mounting an electronic component (15) to the leads (12) of a leadframe (18). The portions of the leadframe (18) that come in physical contact with...
6198044 Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained  
A method of manufacturing a microcircuit board with a mechanical cut-out piece between the microcircuit and the board to limit stresses transmitted to the microcircuit. A blank of a network of...
6150615 Economical package with built-in end resistor used for semiconductor device and process of fabrication  
A lead frame used for a semiconductor chip has built-in end resistors accurately patterned through lithographic techniques and an etching from a conductive bonding layer between an insulating film...
6124546 Integrated circuit chip package and method of making the same  
A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52...
6122822 Method for balancing mold flow in encapsulating devices  
A method for forming a plastic package of an electronic device that is substantially without void formation is disclosed. In the method, a lead finger which is to be encapsulated in a plastic...
6101101 Universal leadframe for semiconductor devices  
A leadframe for semiconductor devices is characterized in that the edge of the paddle has the shape of inclined plane which facilitate the silver epoxy to fill up the gap near the edge of the...
6093957 Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof  
A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The...
6061251 Lead-frame based vertical interconnect package  
A vertical interconnect package for electronic components and a method to manufacture same. The invention provides a tripartite lead frame-based Vertical Interconnect Package (VIP) which provides...
6058020 Component housing for surface mounting of a semiconductor component  
A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an...
5963028 Package for a magnetic field sensing device  
A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die...
5959842 Surface mount power supply package and method of manufacture thereof  
A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package...
Matches 1 - 50 out of 266 1 2 3 4 5 6 >