Matches 1 - 50 out of 68 1 2 >
Match Document Document Title
7265991 Housing cage for holding built-in modules  
A housing cage ( 1 ) comprising walls ( 2 ) defining sides of the housing cage and having wall sections ( 3 ). A plurality of contact surfaces ( 4 ), each of which is connected to one of said wall...
6559379 Pressure sensor with transducer mounted on a metal base  
A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical...
6541702 Semiconductor device  
In order to suppress defective lead forming and defective mounting, a semiconductor device includes a sealing body which has a square planar shape, a semiconductor chip which lies within the...
6239366 Face-to-face multi-chip package  
A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of...
6239367 Multi-chip chip scale package  
A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip...
6225558 Chip size semiconductor package and fabrication method thereof  
A chip size semiconductor package (CSP) and method of manufacturing same is provided that increases solder joint reliability and increases an amount of radiated heat. The chip size semiconductor...
6140581 Grounded packaged semiconductor structure and manufacturing method therefor  
An electrically grounded semiconductor structure is embedded in a non-conductive packaging material, without employing any electrical leads of the semiconductor structure as an electrical path and...
6087586 Chip scale package  
A chip scale package for packaging an IC chip includes a package frame displaced from the side and bottom surfaces of the IC chip by a predetermined gap and a pair of leads symmetrically extending...
6043430 Bottom lead semiconductor chip package  
A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper...
6011220 Semiconductor packaged device and lead frame used therein  
In a semiconductor packaged device of an LOC structure, a lead frame is formed having leads which extend in two directions from a semiconductor chip. The lead frame further includes dummy frames...
5834691 Lead frame, its use in the fabrication of resin-encapsulated semiconductor device  
A lead frame for use in the fabrication of a resin-encapsulated semiconductor device of an LOC structure includes a die pad for receiving a semiconductor chip thereon; a plurality of leads having...
5777265 Multilayer molded plastic package design  
A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates...
5763829 Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe  
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as...
5637828 High density semiconductor package  
The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are...
5623123 Semiconductor device package with small die pad and method of making same  
Semiconductor device package 53 having a lead frame with a mounting pad 31 smaller than the IC chip 10 mounted thereon, and a method of making a semiconductor device package based on wire bonding...
5559305 Semiconductor package having adjacently arranged semiconductor chips  
A single stacked semiconductor package has at least two semiconductor chips densely mounted via a lead on chip method for attaching leads of a lead frame by alternately arranging the leads over or...
5554823 Packaging device and its manufacturing method  
A tantalum capacitor chip and lead terminals respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side...
5548087 Molded plastic packaging of electronic devices  
Described is a plastic encapsulated electronic device having an integrated circuit unit, a lead frame and a plastic material encapsulating the IC unit and portions of the leads into a sealed...
5496967 Package for holding IC chip  
A package for holding at least one integrated circuit (IC) chip includes an IC chip, a lead frame, and a ceramic relay substrate with a wiring pattern. Respective portions of the wiring pattern are...
5477611 Method of forming interface between die and chip carrier  
A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and...
5468910 Semiconductor device package and method of making  
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the...
5466887 Resin-packaged electronic component  
A resin-packaged electronic component is provided which comprises an electronic element enclosed in a thermosetting resin package having a mounting face. The resin package is provided with at least...
5466888 Packaged semiconductor device having stress absorbing film  
A packaged semiconductor device has a semiconductor chip and leads formed over the chip with an electrically insulating film interposed therebetween and a packaging material for sealing the chip...
5459641 Polar electronic component and mounting structure therefor  
A polar electronic component is provided which comprises a polar element, a first lead electrically connected to a first pole of the polar element, a second lead electrically connected to a second...
5451715 Molded package integrated circuit with electrochemical cell  
A packaged integrated circuit and method of manufacturing the same is disclosed. The semiconductor integrated circuit chip is mounted and bonded to a lead frame in the conventional fashion, and an...
5437095 Method of making plastic encapsulated integrated circuit package  
A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the...
5420752 GPT system for encapsulating an integrated circuit package  
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold...
5412157 Semiconductor device  
A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the...
5410450 Internal wiring structure of a semiconductor device  
External lead-through terminals of a semiconductor device, such as a power transistor module, are internally wired to a circuit assembly by a wiring block consisting of one or more conductive lead...
5352852 Charge coupled device package with glass lid  
A charge coupled device package with a glass lid is provided. The package includes a charge coupled device having a plurality of conductive bumps on its bond pads, an insulating tape bonded to the...
5352851 Edge-mounted, surface-mount integrated circuit device  
An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads...
5260601 Edge-mounted, surface-mount package for semiconductor integrated circuit devices  
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one...
5155902 Method of packaging a semiconductor device  
A semiconductor device comprising a semiconductor unit with leads extending therefrom is placed on a bottom packaging tray having a die-shaped upper surface. A top lubricating type film is used...
5151559 Planarized thin film surface covered wire bonded semiconductor package  
This is a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between...
5028741 High frequency, power semiconductor device  
A high frequency, low cost power semiconductor device (60) is provided by combining a semiconductor die (46) with a leadframe (10,12) having a coplanar upper surface (36) with thin external leads...
4905434 Aligning and coupling means for trenchduct  
A trench duct side rail having an upper section and a lower section, the upper section including a pair of spaced-apart downwardly extending legs and with the lower section being disposed between...
4906802 Molded chip carrier  
A molded chip carrier includes an integral carrier body made from a first molded section having a predetermined shape and a second molded section having a second predetermined shape. One of the...
4870224 Integrated circuit package for surface mount technology  
The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the...
4864079 Electrical components and assemblies  
A surface-mounted electrical component has rectangular section leads that project outwardly from the edges of the component body. The leads are bent down towards the surface of the substrate and...
4829669 Method of manufacturing a chip carrier  
A method of manufacturing a chip carrier having the J-shaped leads extending from the lateral sides of the enclosure of the chip carrier with the end facing the bottom of the enclosure is...
4821151 Hermetically sealed package  
A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive...
4801765 Electronic component package using multi-level lead frames  
Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame...
4724280 Package for integrated circuit  
PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each...
4698660 Resin-molded semiconductor device  
A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side...
4611092 Surface mount package for toroids  
A surface mount package for toroids or the like inductive elements has the element sandwiched between two non-conductive plates. Spring clips hold the sandwich together, and the element leads are...
4549247 Carrier element for IC-modules  
A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the...
4331831 Package for semiconductor integrated circuits  
A plastic encapsulation of the chip carrier type for a semiconductor integrated circuit is described. The package includes a lead frame member formed from a continuous metal tape which permits...
4195193 Lead frame and chip carrier housing  
A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead...
4141029 Integrated circuit device  
An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a...
4139726 Packaged microcircuit and method for assembly thereof  
A packaged microcircuit includes a housing of insulating material having a plurality of apertures which extend from the interior of the housing to the outside. A metallized lead connection surface...
Matches 1 - 50 out of 68 1 2 >