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7529095 |
Integrated electrical shield in a heat sink
A system having a heat exchanger with a bottom side, a first nonconductive layer coupled to the bottom side of the heat exchanger, a heat shield made of an electrically conductive material and...
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7369399 |
Modular electronic control unit housing
A housing module 10 for a circuit board comprises a first chamber 20 for accommodating a main part of the circuit board and a second chamber 22 bordering the first chamber 20 and having a...
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7009108 |
Device bracket for metal raceway and cover plates for use therewith
In a two piece metal raceway having snap-in cover segments that engage marginal edges of the base, a gap between adjacent cover segments is fitted with a stamped device bracket including rearwardly...
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6723585 |
Leadless package
A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages are disclosed. The described lead frames are generally arranged such that each device...
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6612890 |
Method and system for manufacturing electronic packaging units
A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by...
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6534711 |
Encapsulation package and method of packaging an electronic circuit module
A package ( 104 ) for encapsulating electronic components ( 102, 122, 550, 660 ) has at least two chambers ( 112, 212 ). Electronic components and modules within the chambers are interconnected by...
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6239367 |
Multi-chip chip scale package
A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip...
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6043430 |
Bottom lead semiconductor chip package
A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper...
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6011220 |
Semiconductor packaged device and lead frame used therein
In a semiconductor packaged device of an LOC structure, a lead frame is formed having leads which extend in two directions from a semiconductor chip. The lead frame further includes dummy frames...
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5982623 |
Module for packaged IC
A module is provided for a packaged IC designed to radiate heat by sealing the packaged IC. At least outer lead parts the packaged IC which are mounted on an electronic circuit board are sealed by...
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5625166 |
Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect
An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board...
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5468910 |
Semiconductor device package and method of making
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the...
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5451715 |
Molded package integrated circuit with electrochemical cell
A packaged integrated circuit and method of manufacturing the same is disclosed. The semiconductor integrated circuit chip is mounted and bonded to a lead frame in the conventional fashion, and an...
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5399804 |
Semiconductor device and method of producing the same
A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is...
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5255430 |
Method of assembling a module for a smart card
A card-independent method of forming a module for subsequent attachment to a card body includes increasing both the area and the height of contact pads on an integrated circuit die and includes...
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5025114 |
Multi-layer lead frames for integrated circuit packages
A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the...
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4835120 |
Method of making a multilayer molded plastic IC package
A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive...
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4801997 |
High packing density lead frame and integrated circuit
Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip...
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4801765 |
Electronic component package using multi-level lead frames
Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame...
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4680617 |
Encapsulated electronic circuit device, and method and apparatus for making same
Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames)...
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4141029 |
Integrated circuit device
An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a...
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4125740 |
Resin-encased microelectronic module
A metal plate carrying a semiconductive chip with a five-terminal power amplifier is encased in a prismatic resinous body having five tongues projecting from one side thereof, the central tongue...
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3838984 |
FLEXIBLE CARRIER AND INTERCONNECT FOR UNCASED IC CHIPS
A printed circuit lead frame that functions as a carrier of an integrated circuit (IC) uncased chip for initial handling and testing and later as a means for bonding the chip's contacts to printed...
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3694902 |
ELECTROLUMINESCENT DISPLAY APPARATUS
A method of fabricating electroluminescent display apparatus by forming a lead-frame from a laminate comprising two metal layers and an intervening insulating layer, is disclosed. The lead-frame...
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