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8157415 Light emitting diode lighting module and method for making the same  
A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal...
8116102 Integrated circuit device and method of producing  
An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and...
7993092 Moving carrier for lead frame and method of moving lead frame using the moving carrier  
Provided are a moving carrier for a lead frame, and a method of moving a lead frame using the moving carrier. The moving carrier includes a base which supports the lead frame including a body and a...
7968807 Package having a plurality of mounting orientations  
A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and...
7935899 Circuit device and method of manufacturing the same  
Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on...
7739791 Method of producing an overmolded electronic module with a flexible circuit pigtail  
A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible...
7497011 Hoop molding method  
A hoop molding method comprises forming, in the frame portions, connection portions that link, to the frame portions, at least one molded portion of the at least one bent molded portion or at least...
7439452 Multi-chip module packaging with thermal expansion coefficiencies  
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress...
7205574 Optical semiconductor device  
An integral-detem-type optical semiconductor device employing lead frame(s) 11, shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being disposed...
6995315 Current sensor  
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or...
6974909 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module  
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and...
6949816 Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same  
A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located...
6784366 Thermal dissipation package for an electrical surface mount component  
An electronic component (202), such as a power transistor, is formed of a molded plastic package having top (206), bottom (204) and side (208) surfaces and electrical contacts. A lead frame (210)...
6748650 Method for making a circuit assembly having an integral frame  
A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions...
6677746 Wheel speed sensor for a vehicle which has a function of preventing a coil open circuit  
Disclosed is a wheel speed sensor for a vehicle which has a function of detecting revolution of the wheel in order to provide a uniform braking power when a vehicle brakes. The wheel speed sensor...
6534711 Encapsulation package and method of packaging an electronic circuit module  
A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). Electronic components and modules within the chambers are interconnected by a...
6483180 Lead frame design for burr-free singulation of molded array packages  
A semiconductor device exhibiting a lower incidence of burrs forming on its contacts during the singulation process. The semiconductor device includes a die which is electrically connected to a set...
6307755 Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die  
A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and...
6265761 Semiconductor devices with improved lead frame structures  
A lead frame to support a semiconductor die within an encapsulating package. The lead frame includes a first rail and a second rail in a first plane, with the second rail parallel to and spaced...
6262368 Data carrier comprising an implanted module based on a metal lead frame with a double-sided chip cover  
A data carrier has a chip with chip contacts, a transmission coil for contactless communication with a write/read station, a metal lead frame with a chip carrying part and contact forming parts,...
6239366 Face-to-face multi-chip package  
A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of...
6236567 Electronic device package with enhanced heat dissipation effect  
An electronic device package with enhanced heat dissipation effect comprises a lead frame and an outer frame with electrically insulating surface. The outer frame encloses the electronic device...
6211462 Low inductance power package for integrated circuits  
The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die...
6201186 Electronic component assembly and method of making the same  
An electronic component assembly (10) is formed by mounting an electronic component (15) to the leads (12) of a leadframe (18). The portions of the leadframe (18) that come in physical contact with...
6140581 Grounded packaged semiconductor structure and manufacturing method therefor  
An electrically grounded semiconductor structure is embedded in a non-conductive packaging material, without employing any electrical leads of the semiconductor structure as an electrical path and...
6122822 Method for balancing mold flow in encapsulating devices  
A method for forming a plastic package of an electronic device that is substantially without void formation is disclosed. In the method, a lead finger which is to be encapsulated in a plastic...
6111220 Circuit and method for heating an adhesive to package or rework a semiconductor die  
An inventive system for attaching a die to the die pad of a lead frame incorporates a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad...
6101101 Universal leadframe for semiconductor devices  
A leadframe for semiconductor devices is characterized in that the edge of the paddle has the shape of inclined plane which facilitate the silver epoxy to fill up the gap near the edge of the...
6093957 Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof  
A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The...
5969293 Method and apparatus for doubling back single gauge lead frame  
A single gauge lead frame having a second support pad which is substantially a mirror image of a first support pad is disclosed. The second support pad is capable of being placed upon the first...
5939214 Thermal performance package for integrated circuit chip  
Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and...
5900582 Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame  
A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer...
5896651 Method of mounting microelectronic circuit package  
A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and...
5894108 Plastic package with exposed die  
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically...
5892417 Saw device package and method  
A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area...
5864174 Semiconductor device having a die pad structure for preventing cracks in a molding resin  
According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having...
5834691 Lead frame, its use in the fabrication of resin-encapsulated semiconductor device  
A lead frame for use in the fabrication of a resin-encapsulated semiconductor device of an LOC structure includes a die pad for receiving a semiconductor chip thereon; a plurality of leads having...
5780772 Solution to mold wire sweep in fine pitch devices  
A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting...
5777265 Multilayer molded plastic package design  
A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates...
5763829 Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe  
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as...
5761054 Integrated circuit assembly preventing intrusions into electronic circuitry  
An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated...
5717163 Plastic material pouring device for forming electronic components  
Disclosed is a plastic material pouring device for forming electronic components consisting of a cover and a leadframe corresponding to the cover in configuration, such that the cover is firmly...
5682673 Method for forming encapsulated IC packages  
A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for...
5661900 Method of fabricating an ultrasonically welded plastic support ring  
A method of fabricating a semiconductor device comprising the steps of providing an encapsulated semiconductor device bonded to a lead frame, providing a support ring formed of a material which...
5640746 Method of hermetically encapsulating a crystal oscillator using a thermoplastic shell  
A method of hermetically encapsulating a crystal oscillator using a thermoplastic shell. A first step (102) includes molding a thermoplastic shell defining a cavity around a periphery of oscillator...
5637828 High density semiconductor package  
The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are...
5635671 Mold runner removal from a substrate-based packaged electronic device  
According to the invention, an electronic device mounted on a substrate is encapsulated using a standard two-piece mold. A novel degating region is formed on a surface of the substrate to allow...
RE35496 Semiconductor device and method of producing the same  
A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively...
5623123 Semiconductor device package with small die pad and method of making same  
Semiconductor device package 53 having a lead frame with a mounting pad 31 smaller than the IC chip 10 mounted thereon, and a method of making a semiconductor device package based on wire bonding...
5587883 Lead frame assembly for surface mount integrated circuit power package  
A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a...
Matches 1 - 50 out of 199 1 2 3 4 >