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7622684 Electronic component package  
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the...
7439452 Multi-chip module packaging with thermal expansion coefficiencies  
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress...
7421781 Method of forming a module component having a plurality of penetration holes  
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
6798638 Pot-shaped housing and cover for capacitors  
A pot-shaped housing with a cover for capacitors has the pot-shaped housing and cover both being extruded as single workpieces and having different spatial dimensions along two principal axes so...
6711354 Auxiliary module use relaying component and auxiliary module  
An auxiliary module comprises: a baseplate having terminals and equipped with an auxiliary; a relaying component formed by integrally resin-molding a first electrically connecting portion having...
6657137 Connection structure and connection method of for connecting two circuit boards  
In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are...
6653564 Conductor strip arrangement for a molded electronic component and process for molding  
At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding...
6632997 Personalized circuit module package and method for packaging circuit modules  
A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a...
6601293 Method of making an electromagnetic interference shield device  
A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An...
6437239 Protection device and method of determining exposure temperature  
A protection device and a method of protecting an electrical component. The protection device has a protective housing and a terminal cap. The protective housing has a base with a contact hole...
6340792 Mold cap for semiconductor device mold package  
In a semiconductor device mold package composed of a mold cap and a mold case both of which are formed of a resin compound and which are joined to each other to form a hollow inner space defined...
6239366 Face-to-face multi-chip package  
A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of...
6232551 Substrate board for semiconductor package  
A substrate board structure formed by stacking a plurality of circuit layers and insulation layers on top of each other. Each circuit layer has a plurality of circuit lines and every circuit layer...
6124546 Integrated circuit chip package and method of making the same  
A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52...
6111199 Integrated circuit package using a gas to insulate electrical conductors  
An integrated circuit package includes a number of electrical conductors that are completely or at least partially surrounded by a gas instead of a solid material (having no cavities) used in the...
6078501 Power semiconductor module  
An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a...
6049463 Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same  
A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12)...
5981873 Printed circuit board for ball grid array semiconductor package  
A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to...
5962810 Integrated circuit package employing a transparent encapsulant  
An integrated circuit package for EPROM, CCD, and other optical integrated circuit devices has a substrate base having metallized vias extending there through. An integrated circuit die is affixed...
5952611 Flexible pin location integrated circuit package  
An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92,...
5925934 Low cost and highly reliable chip-sized package  
The invention is directed to a chip-sized package (CSP) and method for making a CSP which is simple to manufacture, less costly and more compact, thus being truly a chip-sized package. The...
5894107 Chip-size package (CSP) using a multi-layer laminated lead frame  
A method for manufacturing a chip-size package and the chip-size package produced by the method uses first and second lead frames which are prepared by a stamping process. The first lead frame has...
5847930 Edge terminals for electronic circuit modules  
Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals...
5844168 Multi-layer interconnect sutructure for ball grid arrays  
A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape...
5767446 Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package  
A printed circuit board (PCB) having an epoxy barrier disposed around its throughout slot in a semiconductor chip mounting region, and a BGA semiconductor package using such a PCB, thereby...
5760337 Thermally reworkable binders for flip-chip devices  
A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the...
5742006 Electric cell of the type comprising two parallel plates or substrates in particular made of plastic material separated from each other by a sealing frame  
An electric cell comprises first and second parallel flexible substrates, set apart from each other at a determined spacing, carrying electrodes on their opposing faces, the substrates enclosing...
5677511 Overmolded PC board with ESD protection and EMI suppression  
An apparatus directed to portable peripheral cards is disclosed which provides protection against electro-static discharge and electro-magnetic interference. Furthermore, this apparatus provides a...
5639990 Solid printed substrate and electronic circuit package using the same  
The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil...
5635671 Mold runner removal from a substrate-based packaged electronic device  
According to the invention, an electronic device mounted on a substrate is encapsulated using a standard two-piece mold. A novel degating region is formed on a surface of the substrate to allow...
5569880 Surface mountable electronic component and method of making same  
A miniaturized surface mountable tombstoning resistant electronic component is disclosed. The terminals of the component are respectively L and J shaped conductive metal portions. The portions of...
5455384 High frequency module and method of producing the same  
A method of producing a high frequency module comprises the steps of connecting leads to a circuit board, covering the circuit board with an insulating member such that the leads protrude from the...
5451716 Resin-packaged electronic component having bent lead terminals  
An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead...
5440451 Memory Assembly  
A memory assembly, comprises a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes, each of the wiring patterns having a connecting terminal formed on a single...
5434357 Reduced semiconductor size package  
A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the...
5428188 Low-cost package for electronic components  
A low cost package uses non-ceramic materials to environmentally seal an air chamber for an electronic component. The package includes a base formed by a plurality of essentially flat terminals...
5311405 Method and apparatus for aligning and attaching a surface mount component  
A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702)...
5285012 Low noise integrated circuit package  
The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing...
5247134 Heat-resistant hermetic packages for electronic components  
A heat-resistant package for electrical components comprises a housing composed of a plurality of independent side walls made of heat resistant ceramic material. Sealed-in leads are provided in one...
5059746 Housing assembly for electronic components  
Housing assembly for components, such as Hall effect sensors, comprises an inner housing of premolded relatively firm plastic material and an outer housing which is overmolded on the inner housing....
5019673 Flip-chip package for integrated circuits  
A flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an...
5015801 Electrical circuit module  
An electrical circuit module in which structural elements of the circuit module are foamed or cast over with synthetic resin. At least one component is located in the interior of the resin and has...
4985597 Optical semiconductor device  
Holes are formed in a major surface of a hybrid IC insulating substrate mounting an optical semiconductor element, and terminal pins of a package are connected and fixed to the substrate while head...
4935581 Pin grid array package  
In a method of forming a protective cover of a pin grid array in which a semiconductor chip is mounted on an upper surface of a resin board having a plurality of contact pins on a lower surface...
4916523 Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond  
A PGA integrated circuit package includes a package substrate (12), a unidirectional electrically conductive elastomeric layer (14), a plastic tape layer (16) having a centrally disposed chip (18),...
4890152 Plastic molded chip carrier package and method of fabricating the same  
A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor...
4859631 Fitting process for packaging a semiconductor component in a plastic box  
The invention relates to the encapsulation of a seminconductor component in a plastic box. The fitting assembly comprises a radiator plate, a ceramic plate, a copper counter-electrode, a...
4791608 Memory card having shutter protected terminals  
A memory card adapted to be removably loaded into electronic equipment comprises a printed circuit board having a memory element mounted thereon and a contact pattern for making an electrical...
4674820 Reusable junction box electrical terminal cap  
A reusable cap encapsulates an electrical terminal in a junction box which routes communication lines such as phone wires. The cap includes a tubular body having a self tearing slot which receives...
4629824 IC package sealing technique  
An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a...
Matches 1 - 50 out of 101 1 2 3 >