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7622684 |
Electronic component package
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the...
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7616448 |
Wrap-around overmold for electronic assembly
An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit...
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7615712 |
Integrated circuit packages including damming and change protection cover for harsh environments
An electronic assembly for use in a downhole tool includes a damming boot deployed about at least one integrated circuit component on a circuit board. The boot is disposed to house the integrated...
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7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
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7593233 |
Modules for a measuring device and measuring device
The invention relates to a module for a measuring device and to a measuring device. The inventive module for a measuring device is provided with a plug-in contact element for the electrical contact...
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7586048 |
Electronic component
The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in...
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7566836 |
Potting shell
A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular...
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7563990 |
Electronic product, a body and a method of manufacturing
The electronic product comprises a body with a three-dimensional shape that is derived from the product. The body is provided with a pattern of conductors including contact pads and at least one...
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7560153 |
Insert-molded article and a production method for insert-molded article
A casing ( 10 ) is formed by insert molding using an inner portion ( 30 ) holding busbars ( 20 ) as an insert. The inner portion 30 includes an interlocking portion ( 33 ) to be hooked in a mold...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7531757 |
IC card and semiconductor integrated circuit device package
An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a...
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7488904 |
Resin molded component fitted with a metal plate and molding method therefor
A sensor unit ( 1 ) has a metal plate ( 10 ), a resin molded portion ( 20 ) and an oil temperature sensor ( 2 ). Busbars ( 4 ) made of a metal are arranged in the resin molded portion ( 20 ). Since...
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7488903 |
Method for manufacturing circuit modules and circuit module
A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top...
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7473845 |
Structural unit and method for the production of a structural unit
A structural unit having a frame, a connecting face that surrounds an opening and a cover that is attached to the connecting face to cover the opening. The frame and the cover are formed of...
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7467457 |
Method of coupling a device to a mating part
A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the...
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7459642 |
RIM slot filler module and method of manufacturing the same
A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate...
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7443693 |
Electromagnetic interference shielding for a printed circuit board
The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable...
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7439452 |
Multi-chip module packaging with thermal expansion coefficiencies
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress...
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7421781 |
Method of forming a module component having a plurality of penetration holes
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
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7397001 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
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7390978 |
Overmolded electronic assembly and overmoldable interface component
An overmolded electronic assembly ( 900, 1000, 1200 ) is fabricated from one or more overmoldable interface components ( 300, 400, 500, 1220, 1750 ) that may be electrical contacts or electronic...
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7355547 |
Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof
An object of the present invention is to provide a millimeter wave radar device and module that provides a hollow structure while assuring adequate moisture resistance. A multilayer substrate on...
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7349227 |
Electronic control device
An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is...
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7336500 |
Method and apparatus for encapsulating a printed circuit board
A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined...
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7320817 |
Holding structure and a molding with the same
A holding structure includes a held member located in a case, and a guiding space defined between the held member and a predetermined inner surface of the case. A primary molding resin is guided...
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7320738 |
Method for encapsulation of a chip card and module obtained thus
Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the...
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7319191 |
Signal adapter
A signal adapter comprising an explosion proof housing, a circuit member disposed on an inside of the explosion proof housing, a signal input connector electrically connected to the circuit member,...
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7312406 |
Sensor having metallic housing and resin connector, and method of manufacturing the same
A sensor includes a metallic housing having a hollow portion, a metallic terminal pin, a part of which is inserted into the hollow portion of the housing, a sensing element connected to the...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7296299 |
Tamper-evident and/or tamper-resistant electronic components
A tamper-evident and/or tamper-resistant electronic module comprising an electronic component embedded in an encapsulant material and at least one thin sheet of frangible material contacting and...
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7288728 |
Electronic package and packaging method
A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second...
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7266882 |
Method of manufacturing a miniaturized three- dimensional electric component
Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at...
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7231712 |
Method of manufacturing a module
A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes,...
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7214874 |
Venting device for tamper resistant electronic modules
A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the...
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7209361 |
Electronic device
An electronic device includes a first module, which is protected against electromagnetic interference, and a second module. At least the first module has multilayer printed circuit boards with at...
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7209360 |
Leak-tight system for boxes containing electrical and electronic components
The system consists of fixing the printed circuit board ( 3 ) to the bottom ( 1 ) of the body of the box with the cooperation of a perimetral and spacing flap ( 6 ) which creates a chamber ( 7 )...
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7208943 |
Electrical device enclosure
A robust, low cost, compact and highly accurate rotary position sensor is disclosed for measuring the relative angular position (within a range ≦180°) of a housing or stator and a rotor. The...
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7199306 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board ( 11 ) having a plurality of BGA substrates ( 12 ) arranged in N rows ( 14 ) and...
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7193161 |
SiP module with a single sided lid
A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped...
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7189929 |
Flexible circuit with cover layer
Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more...
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7189919 |
Housing for antenna amplifier
A housing for an electronic device in automotive technology has two molded-plastic housing parts fittable together to form a cavity and a membrane hinge unitarily formed with the parts and...
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7186912 |
Hermetic lid seal by metal pressing for fiber optic module
The invention describes a fiber optic module package which uses a metal-to-metal contact seal between a lid and a module housing. The metal-to-metal contact seal provides a sealing mechanism...
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7183485 |
Microelectronic component assemblies having lead frames adapted to reduce package bow
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
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7180012 |
Module part
A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body...
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7179991 |
Case of electronic device and method for fabricating the same
A case of an electronic device includes a chassis ( 10 ) and a top plate ( 30 ). The top plate has a lip ( 32 ) extending therefrom. The chassis includes a side plate ( 14 ). A cutout ( 142 ) is...
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7177143 |
Molded electronic components
Techniques for making robust but precise electrical components, such as molded equalizers designed for interface with amplifiers in CATV or other communications equipment, are disclosed. An...
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7151674 |
Mold-type electronic control unit
A mold-type electronic control unit comprising: a unit body which includes a printed circuit board, a component case which includes an opening opened toward the circuit board and a hole opened...
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7146721 |
Method of manufacturing a sealed electronic module
A circuit board is inserted into an open-ended housing and potting material is dispensed onto the exposed face of the circuit board in a single step to seal the circuit board to the housing. One or...
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7134198 |
Method for manufacturing electric element built-in module with sealed electric element
A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring...
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7126063 |
Encapsulated electronic sensor package
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a...
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