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7624501 |
Method of manufacturing multilayer wiring board
First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer...
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7617598 |
Method of making a thermally isolated via structure
This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second...
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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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7586047 |
Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It...
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7564694 |
Apparatus and method for impedance matching in a backplane signal channel
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal...
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7557302 |
Printed circuit board with electrostatic discharge damage prevention
A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The...
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7557304 |
Printed circuit board having closed vias
Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated...
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7540082 |
Method for manufacturing printed wiring board
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board 1 in...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7491896 |
Information handling system utilizing circuitized substrate with split conductive layer
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a...
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7491897 |
Electronic equipment provided with wiring board into which press-fit terminals are press-fitted
In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7420131 |
Wiring substrate
A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7404250 |
Method for fabricating a printed circuit board having a coaxial via
A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7359693 |
Enclosure and substrate structure for a tuner module
A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7336499 |
Flexible printed wiring board
An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing...
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7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
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7297877 |
Substrate with micro-via structures by laser technique
A substrate to which a laser technique is applied includes a signal layer, a micro via structure, and a differential signal pair. The micro via structure is divided into a first conductive column...
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7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the...
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7271349 |
Via shielding for power/ground layers on printed circuit board
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole...
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7269029 |
Rapid fire test board
A test board for testing a packaged integrated circuit has a set of contacts matching counterpart contacts on a socket. The contacts are each connected to a first voltage plane containing power, a...
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7262368 |
Connection structures for microelectronic devices and methods for forming such structures
Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through...
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7205486 |
Thermally isolated via structure
This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An...
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7204018 |
Technique for reducing via capacitance
A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise...
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7190592 |
Integrated library core for embedded passive components and method for forming electronic device thereon
An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of...
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7185427 |
Method for making electrical connections to an element on printed circuit board
The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The...
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7180009 |
Transmission line with stripped semi-rigid cable
A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a...
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7162794 |
Manufacturing method for multilayer ceramic elements
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
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7154047 |
Via structure of packages for high frequency semiconductor devices
A substrate ( 300 ) for a package of high frequency semiconductor devices comprising a planar insulating substrate having a plurality of parallel, planar metal layers ( 301 a, 301 b , etc.)...
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7109426 |
Printed board and electronic apparatus
A printed board includes an electrically insulating board, a conductor layer made of an electrically conducting pattern, and at least one of a resist layer and an ink layer, each made of an...
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7088003 |
Structures and methods for integration of ultralow-k dielectrics with improved reliability
An improved back end of the line (BEOL) interconnect structure comprising an ultralow k (ULK) dielectric is provided. The structure may be of the single or dual damascene type and comprises a dense...
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7081672 |
Substrate via layout to improve bias humidity testing reliability
A substrate is provided, which has a pattern of voltage supply vias extending through at least a portion of the substrate. Each of a plurality of the voltage supply vias is surrounded by four of...
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7064279 |
Circuit board having an overlapping via
A printed circuit board ( 100 ) includes a first BGA landing pad ( 102 ) having a first clearance zone ( 106 ) and a second BGA landing pad ( 104 ) having a second clearance zone ( 108 ). A via (...
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7059049 |
Electronic package with optimized lamination process
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
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7052288 |
Two piece mid-plane
A mid-plane is disclosed. The mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector and having a plurality of...
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7036712 |
Methods to couple integrated circuit packages to bonding pads having vias
The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an...
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7015869 |
High frequency antenna disposed on the surface of a three dimensional substrate
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
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7015571 |
Multi-chips module assembly package
A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a...
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6996903 |
Formation of multisegmented plated through holes
A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole...
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6998540 |
Electrical circuit board and a method for making the same
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.
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6976849 |
Pinless solder joint for coupling circuit boards
A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In...
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6972382 |
Inverted microvia structure and method of manufacture
A multilayer circuit board ( 50 ) includes a plurality of substrate cores ( 34 and 44 ), an adhesive/bonding layer ( 55 ) between at least two among the plurality of substrate cores, and a...
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6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
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