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Match Document Document Title
7408120 Printed circuit board having axially parallel via holes  
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
7404250 Method for fabricating a printed circuit board having a coaxial via  
A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top...
7378601 Signal transmission structure and circuit substrate thereof  
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
7375290 Printed circuit board via with radio frequency absorber  
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
7375288 Apparatuses and methods for improving ball-grid-array solder joint reliability  
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
7359693 Enclosure and substrate structure for a tuner module  
A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter...
7350296 Method of fabricating a printed circuit board including an embedded passive component  
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
7342802 Multilayer wiring board for an electronic device  
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films...
7336499 Flexible printed wiring board  
An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing...
7301103 Printed-wiring board, printed-circuit board and electronic apparatus  
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
7297877 Substrate with micro-via structures by laser technique  
A substrate to which a laser technique is applied includes a signal layer, a micro via structure, and a differential signal pair. The micro via structure is divided into a first conductive column...
7282648 Capacitor-embedded PCB having blind via hole and method of manufacturing the same  
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the...
7271349 Via shielding for power/ground layers on printed circuit board  
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole...
7269029 Rapid fire test board  
A test board for testing a packaged integrated circuit has a set of contacts matching counterpart contacts on a socket. The contacts are each connected to a first voltage plane containing power, a...
7262368 Connection structures for microelectronic devices and methods for forming such structures  
Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through...
7251885 Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board  
In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the...
7242592 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics  
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
7211738 Bonding pad structure for a display device and fabrication method thereof  
A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a...
7205486 Thermally isolated via structure  
This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An...
7204018 Technique for reducing via capacitance  
A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise...
7190592 Integrated library core for embedded passive components and method for forming electronic device thereon  
An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of...
7185427 Method for making electrical connections to an element on printed circuit board  
The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The...
7180009 Transmission line with stripped semi-rigid cable  
A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a...
7162794 Manufacturing method for multilayer ceramic elements  
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
7154047 Via structure of packages for high frequency semiconductor devices  
A substrate ( 300 ) for a package of high frequency semiconductor devices comprising a planar insulating substrate having a plurality of parallel, planar metal layers ( 301 a, 301 b , etc.)...
7109426 Printed board and electronic apparatus  
A printed board includes an electrically insulating board, a conductor layer made of an electrically conducting pattern, and at least one of a resist layer and an ink layer, each made of an...
7088003 Structures and methods for integration of ultralow-k dielectrics with improved reliability  
An improved back end of the line (BEOL) interconnect structure comprising an ultralow k (ULK) dielectric is provided. The structure may be of the single or dual damascene type and comprises a dense...
7081672 Substrate via layout to improve bias humidity testing reliability  
A substrate is provided, which has a pattern of voltage supply vias extending through at least a portion of the substrate. Each of a plurality of the voltage supply vias is surrounded by four of...
7064279 Circuit board having an overlapping via  
A printed circuit board ( 100 ) includes a first BGA landing pad ( 102 ) having a first clearance zone ( 106 ) and a second BGA landing pad ( 104 ) having a second clearance zone ( 108 ). A via (...
7059049 Electronic package with optimized lamination process  
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
7052288 Two piece mid-plane  
A mid-plane is disclosed. The mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector and having a plurality of...
7036712 Methods to couple integrated circuit packages to bonding pads having vias  
The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an...
7015869 High frequency antenna disposed on the surface of a three dimensional substrate  
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
7015571 Multi-chips module assembly package  
A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a...
7009530 Modular wireless fixed network for wide-area metering data collection and meter module apparatus  
A one-way direct sequence spread spectrum (DSSS) communications wide-area network is used as the data collection channel (uplink) of an automatic meter reading (AMR) application and a paging...
6998540 Electrical circuit board and a method for making the same  
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.
6996903 Formation of multisegmented plated through holes  
A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole...
6979896 Power gridding scheme  
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically...
6976849 Pinless solder joint for coupling circuit boards  
A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In...
6972382 Inverted microvia structure and method of manufacture  
A multilayer circuit board ( 50 ) includes a plurality of substrate cores ( 34 and 44 ), an adhesive/bonding layer ( 55 ) between at least two among the plurality of substrate cores, and a...
6940168 Enhanced pad design for substrate  
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
6937120 Conductor-within-a-via microwave launch  
A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within...
6931722 Method of fabricating printed circuit board with mixed metallurgy pads  
A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is...
6930258 Multilayer printed wiring board and method of producing multilayer printed wiring board  
Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50 , and via holes 66 are formed right on the through holes 36 , respectively. Due...
6896526 Flanged terminal pins for DC/DC converters  
A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal...
6893576 Method of manufacturing multi-layer printed wiring board  
This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming...
6855625 Manufacturing method of multilayer substrate  
Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor...
6848178 Enhancement of current-carrying capacity of a multilayer circuit board  
A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating...
6846993 Multilayer printed wiring board and its manufacturing method  
A conductive film has a plurality of clearances (openings) and a plurality of auxiliary clearances. The plurality of clearances and the plurality of auxiliary clearances are formed to have such...
6845492 Signal via impedance adjustment tool  
A computer-implemented method for adjusting signal via impedance includes identifying a signal via in a circuit design database. The signal via is flagged as having an impedance error. A window is...
Matches 1 - 50 out of 460 1 2 3 4 5 6 7 8 9 10 >