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8169792 |
Multilayer printed wiring board
A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed...
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8164005 |
Multilayer high-frequency circuit board
A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The...
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8164004 |
Embedded circuit structure and fabricating process of the same
A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two...
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8158892 |
High-speed router with backplane using muli-diameter drilled thru-holes and vias
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are...
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8153909 |
Multilayer wiring board and method of manufacturing the same
A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating...
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8148647 |
Printed circuit board and method of manufacturing the same
An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit...
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8134085 |
Printed interconnection board having a core including carbon fiber reinforced plastic
A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary...
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8115114 |
Ceramic substrate manufacturing method and ceramic substrate
A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic...
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8116088 |
Semiconductor package and method of forming the same, and printed circuit board
Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts...
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8116089 |
Method and apparatus for securing a magnetic component to a printed circuit board for soldering
A magnetic device surface mounting assembly includes a specially designed printed circuit board and magnetic device. The circuit board has first and second sets of channels, the first channels...
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8107254 |
Integrating capacitors into vias of printed circuit boards
A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hol...
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8097335 |
Lightweight circuit board with conductive constraining cores
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal...
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8097815 |
Printed circuit board and its designing method, and designing method of IC package terminal and its connecting method
The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of...
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8093506 |
Multilayer wiring board and power supply structure to be embedded in multilayer wiring board
A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised...
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8089007 |
Printed circuit board
A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at...
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8077472 |
Printed circuit board with tin pads
A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component....
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8067700 |
Via structure of printed circuit board
A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of...
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8068348 |
Electrical power distribution unit and electrical punched grid therefor
An electrical power distribution unit (1) for an electrical system has a printed circuit board (200) with a punched grid (100) arranged thereon. An electrical component (300, 310) is arranged on...
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8063316 |
Split wave compensation for open stubs
In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a...
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8058567 |
High density package substrate and method for fabricating the same
The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is...
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8044306 |
Wiring board and method of manufacturing the same
A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated...
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8035038 |
Method for fabricating a printed circuit board having a coaxial via
A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a...
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8031473 |
Control device and method for producing a control device
A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting...
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8028407 |
Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads
A method of producing substrate 3 having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate 1 in the same pitch as that of the inkjet head; a step of...
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7999193 |
Wiring substrate and method of manufacturing the same
There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and...
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7992297 |
Method for forming a circuit board via structure for high speed signaling
One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to...
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7992296 |
PCB and manufacturing method thereof
A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first...
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7973248 |
Printed circuit board using paste bump and manufacturing method thereof
A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core...
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7963776 |
Electrical connector assembly having direct connection terminals
An electrical connector assembly includes a circuit board having vias extending at least partially through the circuit board along via axes. The circuit board has traces and mounting pads that are...
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7956713 |
Forming a helical inductor
In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a...
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7956292 |
Printed circuit board manufacturing method, printed circuit board, and electronic apparatus
A printed circuit board manufacturing method includes: a hole-forming step of forming a through hole in a substrate that will become an element of a printed circuit board after manufacturing; and a...
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7943862 |
Method and apparatus for optically transparent via filling
A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable...
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7939377 |
Method of manufacturing semiconductor element mounted wiring board
A semiconductor element sealed substrate including a semiconductor element covered by an insulating layer is fabricated while a wiring substrate formed by stacking wiring layers is fabricated by a...
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7919717 |
Three-dimensional printed circuit board
A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated...
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7906733 |
Electronic circuit device
Provided is an electronic circuit device in which the bonding state of electrodes can be detected easily with high precision. The electronic circuit device has a stack structure in which a...
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7888606 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect...
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7888605 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically...
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7884286 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect...
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7839649 |
Circuit board structure having embedded semiconductor element and fabrication method thereof
A circuit board structure with an embedded semiconductor element and a fabrication method thereof are disclosed according to the present invention. The circuit board structure comprises: a carrier...
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7834277 |
Printed circuit board manufacturing method and printed circuit board
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board...
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7825340 |
Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board
In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a...
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7804030 |
Printed circuit board
A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide...
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7794820 |
Printed circuit board and fabricating method of the same
Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by...
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7781889 |
Shielded via
A system may include a first conductive ground pad, a second conductive ground pad, a first conductive via coupling the first ground pad to the second ground pad, a first conductive signal trace, a...
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7760512 |
Electronic board, method of manufacturing the same, and electronic device
An electronic board includes a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; a rearrangement wiring for the...
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7759583 |
Circuit board
A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer,...
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7757395 |
Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads
A method of producing substrate 3 having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate 1 in the same pitch as that of the inkjet head; a step of...
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7754980 |
Substrate with multilayer plated through hole and method for forming the multilayer plated through hole
A structure with a multilayer plated through hole is disclosed. At least one dielectric layer formed by deposition and a conductive layer are formed in an original plated through hole (PTH). The...
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7750250 |
Blind via capture pad structure
A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture...
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7737368 |
Circuit board and method of manufacturing circuit board
A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a...
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