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7622183 |
Multilayer printed wiring board with filled viahole structure
The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent...
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RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
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7595454 |
Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus...
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7583513 |
Apparatus for providing an integrated printed circuit board registration coupon
A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of...
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7581312 |
Method for manufacturing multilayer flexible printed circuit board
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder...
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7579553 |
Front-and-back electrically conductive substrate
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at...
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7572500 |
Method of manufacturing circuit-forming board and material of circuit-forming board
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and...
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7570493 |
Printed circuit board with embedded circuit component
In one embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through some of the layers. A resistive plug at least partially fills the...
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7557304 |
Printed circuit board having closed vias
Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated...
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7540082 |
Method for manufacturing printed wiring board
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board 1 in...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7500306 |
Coupling of conductive vias to complex power-signal substructures
A method of forming an electrical structure that includes a complex power-signal (CPS) substructure. The CPS substructure is formed and tested to determine whether the CPS substructure satisfies...
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7491896 |
Information handling system utilizing circuitized substrate with split conductive layer
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a...
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7491895 |
Wiring substrate and method of fabricating the same
A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring...
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7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
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7476814 |
Multilayer interconnection board
A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7470461 |
Printed circuit board and method of manufacturing the same
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit...
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7459202 |
Printed circuit board
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the...
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7438969 |
Filling material, multilayer wiring board, and process of producing multilayer wiring board
A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a...
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7423222 |
Circuit board and method of manufacturing the same
A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming...
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7420131 |
Wiring substrate
A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7417872 |
Circuit board with trace configuration for high-speed digital differential signaling
Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7400511 |
Electronic component mounting structure
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and...
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7390974 |
Multilayer printed wiring board with filled viahole structure
The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent...
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7378602 |
Multilayer core board and manufacturing method thereof
A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42 a of a power source layer ...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7374811 |
Probe pad structure in a ceramic space transformer
A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a...
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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7365272 |
Circuit board with identifiable information and method for fabricating the same
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7303639 |
Method for producing Z-axis interconnection assembly of printed wiring board elements
A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one...
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7297878 |
High frequency laminated component and its manufacturing method
The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object...
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7292448 |
Circuit substrate
A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second...
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7287323 |
Materials and structure for a high reliability BGA connection between LTCC and PB boards
A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers...
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7226654 |
Laminated wiring board and its mounting structure
A laminated wiring board comprising:
a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring...
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7221050 |
Substrate having a functionally gradient coefficient of thermal expansion
A substrate and a method of making a substrate having a functionally gradient coefficient of thermal expansion are described herein. A system having a silicon die, an organic package substrate, and...
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7217890 |
Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate
A blind hole ( 3 ) is formed on a substrate ( 1 ) from a first side of the substrate toward a second side of the substrate ( 1 ). A conductor ( 11 ) is filled in the blind hole ( 3 ). The substrate...
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7214419 |
Conductive paste multilayered board including the conductive paste and process for producing the same
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of...
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7183497 |
Multilayer wiring board
A multilayer wiring board ( 11 ) is provided which includes a core substrate ( 12 ) including a plurality of through-holes ( 15 ). The through-holes ( 15 ) include through-hole conductors ( 17 ) on...
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7174632 |
Method of manufacturing a double-sided circuit board
A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring...
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7165321 |
Method for manufacturing printed wiring board with embedded electric device
A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality...
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