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7586754 |
Printed wiring board and process for manufacturing the same
The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by...
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7566835 |
Multilayer printed wiring board and component mounting method thereof
A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof,...
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7535729 |
Optoelectronic system and method for its manufacture
An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond...
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7534967 |
Conductor structures including penetrable materials
Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a...
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7518882 |
Circuit module
In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7491896 |
Information handling system utilizing circuitized substrate with split conductive layer
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a...
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7489517 |
Die down semiconductor package
A semiconductor package is disclosed for an integrated circuit die ( 52 ). The integrated circuit die is electrically connected to the package substrate by either die solder balls ( 53 a ), or...
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7480151 |
Wiring board and method of manufacturing the same
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7435910 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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7433201 |
Oriented connections for leadless and leaded packages
The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating...
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7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on...
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7390974 |
Multilayer printed wiring board with filled viahole structure
The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent...
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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7309838 |
Multi-layered circuit board assembly with improved thermal dissipation
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
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7297875 |
Fusion bonded assembly with attached leads
A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the...
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7278207 |
Method of making an electronic package
An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of...
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7268303 |
Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board...
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7247939 |
Metal filled semiconductor features with improved structural stability
A method for forming a metal filled semiconductor feature with improved structural stability including a semiconductor wafer having an anisotropically etched opening formed through a plurality of...
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7240425 |
Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board
What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending...
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7190592 |
Integrated library core for embedded passive components and method for forming electronic device thereon
An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of...
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7189083 |
Method of retaining a solder mass on an article
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of...
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7148426 |
Lead-free solder, and connection lead and electrical component using said lead-free solder
In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a...
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7112880 |
Depopulation of a ball grid array to allow via placement
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid...
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7081672 |
Substrate via layout to improve bias humidity testing reliability
A substrate is provided, which has a pattern of voltage supply vias extending through at least a portion of the substrate. Each of a plurality of the voltage supply vias is surrounded by four of...
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7071424 |
Multilayer printed wiring board having filled-via structure
The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent...
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7070088 |
Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a...
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7043830 |
Method of forming conductive bumps
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed...
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7024764 |
Method of making an electronic package
A method of making an electronic package. The method includes forming a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact...
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6998540 |
Electrical circuit board and a method for making the same
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.
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6995321 |
Etched hole-fill stand-off
An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device...
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6989493 |
Electrical feedthrough assembly for a sealed housing
An electrical feedthrough assembly for establishing an electrical connection path through an aperture in a side wall of a housing, and a method of fabrication thereof. The feedthrough assembly...
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6984792 |
Dielectric interposer for chip to substrate soldering
A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside...
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6982387 |
Method and apparatus to establish circuit layers interconnections
A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the...
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6974916 |
Laminated ceramic electronic component having via-hole conductors with different sectional sizes
In a laminated ceramic electronic component, the sectional size of via-hole conductors extending through thicker ceramic layers is larger than that of via-hole conductors extending through thinner...
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6974615 |
Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
To easily connect a coaxial cable to electric connecting devices or a printed circuit board, to prevent the conductors of the cable from being disturbed, to secure the shielding performance of the...
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6944945 |
Sequential build circuit board
A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and...
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6940023 |
Printed-wiring board and electronic device
The present invention provides a board ensuring no peel-off of a wall and a land, even if a part is soldered to the board with lead-free solder. The board 10 is comprised of N (N≧3) layer...
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6909054 |
Multilayer printed wiring board and method for producing multilayer printed wiring board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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6902097 |
Electrically conductive wire
A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls...
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6893576 |
Method of manufacturing multi-layer printed wiring board
This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming...
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6872893 |
Wiring board provided with passive element and cone shaped bumps
A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one...
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6862190 |
Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
An adapter for a surface mount device, the adapter including an insulating body having offset first and second surfaces; a pattern of surface mount solder pads formed on the first surface; a...
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6849805 |
Printed wiring board and electronic apparatus
A printed wiring board is provided in which lift-off and land peeling do not occur during soldering of an inserted component onto the printed wiring board, and hence pattern breakage does not...
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6845557 |
Method for producing an electronic package possessing controlled impedance characteristics
A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance...
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