Matches 201 - 250 out of 394 < 1 2 3 4 5 6 7 8 >
Match Document Document Title
5446625 Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface  
A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second...
5444189 Printed wiring board and production thereof  
A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said...
5438478 Electronic component carriers and method of producing the same as well as electronic devices  
An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and...
5434365 Supporting structure for a vibrator  
In a mounting board, two through-holes are formed which are used for inserting both ends of a supporting member for a vibrator. On a surface of the mounting board, a ground conductor pattern is...
5420378 Printed circuit board/chassis grounding apparatus and methods  
To facilitate a grounding connection between a circuit board and a chassis upon which it is to be mounted, a spaced series of unlined mounting holes are formed through the substrate portion of the...
5420377 Circuit assembly with vented solder pads  
A circuit assembly (100) includes a circuit carrier (102) and a solder pad (104). Circuit carrier (102) further includes at least one vent (108) formed in the circuit carrier (102) for venting...
5418691 Two printed circuit boards superiposed on one another both having position registry marks  
A printed circuit board device comprising at least two printed circuit boards in superposition to connect their interconnection patterns, and a positioning member for putting the two boards into...
5418688 Cardlike electronic device  
An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132,...
5416278 Feedthrough via connection  
A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact...
5414222 Multilayer IC semiconductor package  
An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a...
5404637 Method of manufacturing multilayer printed wiring board  
A method of manufacturing a printed wiring board. A printed wiring board having a substrate and a circuit pattern formed thereon is provided. At least one through-hole is formed in the substrate. A...
5406458 Printed circuit board having tapered contact pads for surface mounted electrical components  
A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10 1 ) thereon. Each pad (24, 26) has a rectangular portion...
5400504 Method of manufacturing metallized connector block  
A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic...
5402314 Printed circuit board having through-hole stopped with photo-curable solder resist  
A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the...
5401913 Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board  
A multi-layer circuit board includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole...
5400221 Printed circuit board mounted with electric elements thereon  
Electric elements such as a resistance chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from the...
5389743 Rivet design for enhanced copper thick-film I/O pad adhesion  
A ceramic circuit card (10) for a missile utilizing a "rivet" design and a method for making the same wherein thick-film copper I/O pads (15) are fabricated on a first dielectric layer (13) and on...
5379189 Electrical assemblies  
An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad...
5369880 Method for forming solder deposit on a substrate  
An electronic circuit assembly (100) includes a circuit carrying substrate (150) on which electrical components (130) are mounted using solder deposits (125) having an essentially planar surface. A...
5368220 Sealed conductive active alloy feedthroughs  
A method of manufacturing a hermetically sealed conductive feedthrough, particularly for use in ceramic substrates or housing, comprises the steps of inserting an active alloy containing preform...
5367435 Electronic package structure and method of making same  
An electronic package and method of making same wherein a flexible circuitized substrate is used to interconnect contact sites on a semiconductor device (chip) to respective conductors on a...
5360948 Via programming for multichip modules  
A programmable multichip module (MCM) base substrate includes a first patterned signal layer comprising a plurality of electrical conductors formed in a first direction and a second patterned...
5349500 Direct application of unpackaged integrated circuit to flexible printed circuit  
An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads...
5329423 Compressive bump-and-socket interconnection scheme for integrated circuits  
A electrically interconnected assembly includes an electronic component, such as an integrated circuit chip, having a first pattern of contact sites and includes a substrate having a second pattern...
5326936 Mounting device for mounting an electronic device on a substrate by the surface mounting technology  
A mounting device for mounting an electronic device on a substrate is described. The electronic device has a plurality of interconnection pins for engagement with corresponding through-holes on the...
5326937 Grounding structure of a printed wiring board  
At least one grounding through hole filled with solder is provided in a printed wiring board near by a fixing hole through which a screw fixes the board to a frame, penetrating a ground layer...
5311405 Method and apparatus for aligning and attaching a surface mount component  
A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702)...
5303122 Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted  
The present invention provides a printed circuit board having a unique commonized pad upon which different sized surface mounted devices can be mounted. The preferred form of the commonized pad...
5281770 Printed circuit board apparatus  
A printed circuit board apparatus comprises a printed circuit board. The printed circuit board includes a first and a second surface and a hole portion. A printed pattern is formed on the first...
5279711 Chip attach and sealing method  
A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By...
5270903 Printed circuit board manufacturing method accommodates wave soldering and press fitting of components  
A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed....
5263243 Method for producing multilayer printed wiring boards  
In a method for producing a multilayer printed wiring board, first and second copper foils for surface layer are disposed on both sides of an inner wiring substrate so that each of first and second...
5260518 Multilayer circuit board for mounting ICs and method of manufacturing the same  
A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the...
5243143 Solder snap bar  
Improved printed circuit boards and methods of soldering them are provided in which a snap bar is provided on the conductor side of a printed circuit board for reducing defects, such as bridging,...
5225969 Multilayer hybrid circuit  
A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said...
5191709 Method of forming through-holes in printed wiring board  
In the method for forming through-holes of the present invention, by injecting a conductive material into the through-holes by means of a filling nozzle while removing the excessive conductive...
5189261 Electrical and/or thermal interconnections and methods for obtaining such  
Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in...
5182851 Method for holding a strip of conductive lead frames  
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier...
5180440 Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes  
A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic...
5155904 Reflow and wave soldering techniques for bottom side components  
A soldering method is provided which includes applying a solder paste onto a pad for a surface-mount component on a bottom side of a printed circuit board, applying an adhesive to a surface-mount...
5147084 Interconnection structure and test method  
Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at...
5140745 Method for forming traces on side edges of printed circuit boards and devices formed thereby  
During the manufacture of a printed circuit board, holes are drilled not only in accordance with a particular circuit board pattern, but also along the lines which will define edges of the board at...
5133120 Method of filling conductive material into through holes of printed wiring board  
To achieve the above object, the invention provides a novel method of filling through holes of a printed wiring board with conductive filler material by initially feeding compressed air to the...
5127570 Flexible automated bonding method and apparatus  
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the...
5056216 Method of forming a plurality of solder connections  
A solder interconnection for forming vias between first and second substrates comprises a plurality of solder containing wells extending into a flat surface of the first substrate, the solder in...
5006673 Fabrication of pad array carriers from a universal interconnect structure  
A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled...
4946563 Process for manufacturing a selective plated board for surface mount components  
A printed circuit board manufacturing process is disclosed which provides good solderability, a non-reflowable coating under the solder mask, and provides a completely uniform flat surface for...
4940181 Pad grid array for receiving a solder bumped chip carrier  
A pad grid array comprises an array of cavities (12) formed in a circuit carrying substrate (10) that are metallized (18, 20, and 22) to provide electrical conductivity. The metallized cavities are...
4935584 Method of fabricating a printed circuit board and the PCB produced  
A circuit board is fabricated from first and second composite sheets, each composed of a substrate of dielectric material and at least one conductor run adhered to the substrate. The substrate of...
4928387 Temporary soldering aid for manufacture of printed wiring assemblies  
Printed wiring boards using surface mount and other components are manufactured using a double-sided tape assembly. The tape assembly is composed of a soluble base layer coated on each side with an...
Matches 201 - 250 out of 394 < 1 2 3 4 5 6 7 8 >