Matches 151 - 200 out of 394 < 1 2 3 4 5 6 7 8 >
Match Document Document Title
6080936 Connecting board with oval-shaped protrusions  
A connecting board is provided for disposition between a base plate such as a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a...
6074728 Multi-layered circuit substrate  
A multi-layered circuit substrate and a manufacturing method thereof comprising the steps of coating the upper surface of a substrate with a photosensitive insulating layer; exposing and developing...
6046410 Interface structures for electronic devices  
An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and...
6040524 Printed circuit board having two holes connecting first and second ground areas  
A printed circuit board and video switcher board containing the circuit board including a first dielectric lamina having opposed surfaces and a first layer deposited on one of the surfaces which...
6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof  
A printed circuit substrate having solder bumps formed on pad-on-via contacts and pad-off-via contacts. The printed circuit substrate has at least one pad-on-via contact and at least one...
6013876 Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board  
A device and method provide an easy and inexpensive electrical connection between circuits on both sides of a printed circuit board. A through-hole is formed in the board with conductive copper...
5978229 Circuit board  
An apparatus and a process for precisely mounting integrated circuit packages on circuit boards. The package has guide pins on its bottom surface that mate with non standard holes on the circuit...
5962922 Cavity grid array integrated circuit package  
A flat package for integrated circuit chip has a substrate with plated through holes. The top flange of a plated through hole is interconnected to a terminal of the IC chip. The bottom flange of...
5958562 Printed circuit boards  
On a surface of an insulating board, a front wiring pattern is formed. On the rear surface of the insulating board, opposing the front wiring pattern, a rear wiring pattern is formed in a shape...
5936848 Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias  
An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first...
5926379 Electronic card assembly by means of solder connections  
A unitary assembly of electronic cards has a base printed card carrying electronic microcomponents having outputs distributed at a first pitch and at least one core printed card having a size...
5910354 Metallurgical interconnect composite  
A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of...
5896276 Electronic assembly package including connecting member between first and second substrates  
An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The...
5890284 Method for modifying circuit having ball grid array interconnections  
In aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the...
5883219 Integrated circuit device and process for its manufacture  
The invention relates to an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a porous dielectric material positioned on the...
5875102 Eclipse via in pad structure  
A ball grid array (BGA) integrated circuit package which has a plurality of vias connected to a plurality of solder pads located on a bottom surface of a package substrate. Each via has a portion...
5867898 Method of manufacture multilayer circuit package  
A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured...
5842275 Reflow soldering to mounting pads with vent channels to avoid skewing  
Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more...
5822856 Manufacturing circuit board assemblies having filled vias  
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the...
5811736 Electronic circuit cards with solder-filled blind vias  
A printed circuit board has a plurality of layers. A first surface land is formed on an inner layer. A dielectric material is laminated on the inner layer. A second surface land is formed on the...
5808875 Integrated circuit solder-rack interconnect module  
An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact...
5808877 Multichip package having exposed common pads  
A multichip package having individual chips which can be tested at the package level. A first pattern of conductive wires is formed on an upper surface of the circuit board for electrically...
5796589 Ball grid array integrated circuit package that has vias located within the solder pads of a package  
A ball grid array (BGA) integrated circuit package which has a plurality of vias located within the solder pads of a package substrate. The substrate supports an integrated circuit which is...
5777276 Mother board with auxiliary conductors in parallel with power connectors  
Motherboard 10M receives a voltage at post 14P from an off-board power source. Buried conductive layer 10B selectively distributes this electrical power to component sites 10S. Post bore 14...
5764485 Multi-layer PCB blockade-via pad-connection  
A special so called BLOCKADE-Via™ apparatus and technique for more efficient circuiting and assembly of electronic components on a multilayer parallel-conductivity "printed-circuit board"...
5744758 Multilayer circuit board and process of production thereof  
A multilayer circuit board includes a plurality of substrates. Each of the substrates includes a thermosetting resin film having respective surfaces, a metal layer formed on the one of the surfaces...
5731066 Electronic circuit device  
In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to...
5699612 Method of checking connected state between IC socket and printed wiring board  
An IC socket for mounting an IC package on a printed wiring board includes a socket body and pin terminals. The socket body has a mount portion for the IC package. The mount portion has a flat...
5687476 Method of making printed circuit arrangement  
A printed circuit board arrangement and method of making the same are provided, the printed circuit board arrangement comprising a first printed circuit board having a component carrying side and...
5683788 Apparatus for multi-component PCB mounting  
A printed circuit board includes a multi-component mounting footprint for mounting one of several possible differently sized discrete component packages on the circuit board. The multi-component...
5656798 Terminal-carrying circuit board  
A circuit board has holes extending therethrough, and a solder layer disposed on a first side of the board. Terminals have been pushed through respective holes and into contact with the solder...
5637835 Automatic test detection of unsoldered thru-hole connector leads  
A method and apparatus providing an automated means for detecting unsoldered thru-hole connector leads is herein disclosed. This means consists of a thru-hole connection pad and a test pad...
5536907 Semiconductor package  
A semiconductor package includes a package body, a semiconductor chip disposed on the surface of the package body, external lead terminals disposed on two opposite side surfaces of the package...
5528461 Printed circuit assembly having component locating features  
A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit...
5525763 Printed circuit board arrangement  
A printed circuit board arrangement and method of making the same are provided, the printed circuit board arrangement comprising a first printed circuit board having a component carrying side and...
5504277 Solder ball array  
An array of closely spaced uniform solder balls located on a substrate of an electronic module and electrically connected with terminals of circuitry, to connect the module to a complementary array...
5497545 Method of making electrical connections in the manufacture of wiring sheet assemblies  
A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring...
5487218 Method for making printed circuit boards with selectivity filled plated through holes  
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes...
5482047 Intraoperative ultrasound probe  
An intraoperative ultrasonic transducer probe is described comprising a handle section and a transducer section which resemble a tiny leg and foot. The two sections are obtusely angled relative to...
5479703 Method of making a printed circuit board or card  
A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of...
5478972 Multilayer circuit board and a method for fabricating the same  
An interlayer connection wiring penetrating each of resin films constituting a multilayer circuit board and a surface wiring connected to the interlayer connection wiring are formed in...
5477419 Method and apparatus for electrically connecting an electronic part to a circuit board  
A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the...
5471368 Module having vertical peripheral edge connection  
A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic...
5463191 Circuit board having an improved fine pitch ball grid array and method of assembly therefor  
A circuit board design featuring a fine pitch ball grid array ("BGA") having a simplified construction. The circuit board comprises: (1) an insulating substrate, the substrate having a via...
5455742 Direct circuit board connection  
A direct connection for printed circuit boards where a primary board has a slot therethrough with slight edge projections which control the width of the slot to close tolerances. Spaced parallel...
5455741 Wire-lead through hole interconnect device  
An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with...
5451720 Circuit board thermal relief pattern having improved electrical and EMI characteristics  
A circuit board having a thermal relief pattern for isolating heat generated during soldering of components thereon. The circuit board comprises (1) a substantially planar insulating substrate, the...
5450290 Printed circuit board with aligned connections and method of making same  
The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the...
5448452 Circuit board for mounting a band-pass filter  
A circuit board for mounting a band-pass filter. An elongate through hole is formed through the ground surface of the circuit board for shielding the input and output terminals of a band-pass...
5446247 Electrical contact and method for making an electrical contact  
An electrical contact and method for making an electrical contact allows a flat contact (404) to be formed early in the process of making an electronic device. The flat contact (404) is level with...
Matches 151 - 200 out of 394 < 1 2 3 4 5 6 7 8 >