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7615709 |
Circuit board through-hole impedance tuning using clearance size variations
A circuit board comprises signaling through-holes that pass through a plurality of layers, including signal trace and digital ground plane layers, and power reference plane layers. Clearances are...
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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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7615707 |
Printed circuit board and forming method thereof
A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a...
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7614142 |
Method for fabricating an interposer
A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric...
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7612298 |
Connecting unit for wick of cold cathode fluorescent lamp
A connecting unit for accommodating a wick of a cold cathode fluorescent lamp is disclosed. The connecting unit includes a substrate having a conductive layer disposed thereon, a v-shaped opening,...
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7612296 |
Visually inspectable surface mount device pad
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is...
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7612295 |
Printed wiring board and method for manufacturing the same
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon another. The first conductive layer ( 11 ) is...
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7609526 |
Circuit board
A circuit board including a capacitor structure formed on a surface of an insulating substrate, wherein the capacitor structure includes paired linear conductive layers arranged on the surface of...
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RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
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7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7596842 |
Method of making multilayered construction for use in resistors and capacitors
The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic...
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7595454 |
Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus...
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7594318 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7593235 |
Thermal conduit
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit...
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7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
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7589283 |
Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced...
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7586755 |
Electronic circuit component
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small...
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7582833 |
Transparent substrate provided with electroconductive strips
The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the...
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7581312 |
Method for manufacturing multilayer flexible printed circuit board
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder...
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7579553 |
Front-and-back electrically conductive substrate
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at...
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7576995 |
Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex...
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7576288 |
Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting...
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7566835 |
Multilayer printed wiring board and component mounting method thereof
A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof,...
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7565739 |
Method of making zinc-aluminum alloy connection
A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn—Al alloy. Heat is then applied to the...
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7565738 |
Method for manufacturing circuit device
A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for...
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7564694 |
Apparatus and method for impedance matching in a backplane signal channel
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal...
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7557304 |
Printed circuit board having closed vias
Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated...
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7548430 |
Buildup dielectric and metallization process and semiconductor package
A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form...
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7546682 |
Methods for repairing circuit board having defective pre-soldering bump
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided,...
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7546106 |
Electronic circuit
An electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. Although the amplification factor of the amplifier 10 a is 1,...
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7544899 |
Printed circuit board
In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a...
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7544897 |
Connecting substrate, connecting structure. connection method and electronic apparatus
A connecting substrate includes a first conductive member; an insulating layer; and a second conductive member, the first conductive member and the second conductive member facing each other via...
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7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
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7542302 |
Minimizing thickness of deadfronted display assemblies
An apparatus is provided and includes a label layer, disposed in a user visible interface of a front bezel, in which an icon is etched, a multi-layer printed circuit board (PCB), abutting a rear...
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7538413 |
Semiconductor components having through interconnects
A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect...
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7531754 |
Flexible substrate having interlaminar junctions, and process for producing the same
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded...
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7528325 |
Key sheet module
A key sheet module comprising a single-sided printed wiring board including a front surface on which a plurality of wiring patterns are provided and a plurality of holes provided at predetermined...
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7521637 |
Multilayer printed circuit board having via arrangements for reducing crosstalk among vias
A printed circuit board having via arrangements for reducing crosstalk is disclosed. The printed circuit board includes a first layer and a second layer. The printed circuit board also includes a...
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7518882 |
Circuit module
In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As...
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7518066 |
Conformable interface device for improved electrical joint
An interface device for coupling an electrical device to a metal junction includes a conformable conductor plate having a first side and a second side. The interface device also includes a...
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7517730 |
Coreless substrate and manufacturing method thereof
The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7514770 |
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
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7514637 |
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7513037 |
Method of embedding components in multi-layer circuit boards
A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface,...
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7511359 |
Dual die package with high-speed interconnect
Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7508062 |
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The...
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