Matches 151 - 200 out of 1317 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7368667 Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)  
A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the...
7368666 Surface-mounting type electronic circuit unit without detachment of solder  
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
7365272 Circuit board with identifiable information and method for fabricating the same  
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit...
7361848 Wiring board, magnetic disc apparatus, and manufacturing method of wiring board  
Disclosed is a wiring board including: a first insulating layer made of a flexible material; a second insulating layer stacked on a partial region of the first insulating layer; a first wiring...
7361847 Capacitance laminate and printed circuit board apparatus and method  
A method is for fabricating an embedded capacitance printed circuit board assembly ( 400, 1100 ). The embedded capacitance printed circuit board assembly includes two embedded capacitance...
7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers  
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central...
7356916 Circuit-formed substrate and method of manufacturing circuit-formed substrate  
A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness...
7359213 Circuit board  
A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first...
7358445 Circuit substrate and apparatus including the circuit substrate  
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are...
7358607 Substrates and systems to minimize signal path discontinuities  
Arrangements are used for minimizing signal path discontinuities.
7353590 Method of forming printed circuit card  
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
7353600 Circuit board fabrication method and circuit board  
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for...
7350296 Method of fabricating a printed circuit board including an embedded passive component  
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
7350292 Method for affecting impedance of an electrical apparatus  
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
7348496 Circuit board with organic dielectric layer  
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an...
7348498 Partially voided anti-pads  
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in...
7345246 Wiring board and capacitor to be built into wiring board  
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the...
7342183 Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same  
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least...
7342470 Circuit board microwave filters  
A microwave filter has resonator comprised of a cylindrical structure having conductive walls filled with a dielectric material where the cylindrical structure is recessed inside a multi-layered...
7339118 Printed wiring board and method for manufacturing the same  
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon each other. The first conductive layer ( 11 ) is a...
7335414 Printed circuit board and camera module  
A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera...
7332816 Method of fabricating crossing wiring pattern on a printed circuit board  
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b , 58 c and 58 d , and a wiring pattern 58 is...
7329817 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet  
The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are...
7329816 Electronic package with optimized lamination process  
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
7326886 Wafer support member and semiconductor manufacturing system using the same  
A simple and practical wafer support member which holds vacuum tight comprises a plate-shaped ceramic body having one main surface of a mount surface on which a wafer is mounted and a penetrating...
7327583 Routing power and ground vias in a substrate  
A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of...
7326858 Printed circuit board with embedded capacitors and manufacturing method thereof  
Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner...
7326860 Routing vias in a substrate from bypass capacitor pads  
A multilayer substrate having a bonding surface is disclosed. One embodiment of the substrate may comprise a bypass capacitor connection pad disposed on the bonding surface. The bypass capacitor...
7326856 Multi-layer wiring board  
In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two...
7326859 Printed circuit boards having pads for solder balls and methods for the implementation thereof  
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a...
7321097 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same  
The invention provides in a preferred embodiment an electronic component comprising a first conductive layer, a non-conductive layer and a second conductive layer. A hole is etched through the...
7321099 Component mounting substrate and structure  
To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and...
7321098 Laminate ceramic circuit board and process therefor  
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
7319197 Structure of stacked vias in multiple layer electrode device carriers  
A stacked via structure ( 200 ) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via...
7317166 Wiring base board, method of producing thereof, and electronic device  
A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as...
7312400 Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method  
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating...
7312401 Flexible printed wiring board  
A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part...
7312405 Module structure having embedded chips  
A module structure having embedded chips mainly comprises a dielectric layer, at least a semiconductor chip embedded in the dielectric layer, and at least a circuit structure formed on the surface...
7309838 Multi-layered circuit board assembly with improved thermal dissipation  
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature...
7307220 Circuit board for cable termination  
Various embodiments of an apparatus, circuit board, and method are disclosed for cable termination. In one embodiment, a surface pad is disposed on a surface of the circuit board. A ground...
7304860 Printed circuit board with thin film switches for a keyboard  
A printed circuit board with thin film switches for a keyboard including an upper board having multiple circuit lines, an insulating separation defining multiple through holes, a lower board having...
7304247 Circuit board with at least one electronic component  
A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at...
7301228 Semiconductor device, method for manufacturing same and thin plate interconnect line member  
The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is...
7301107 Semiconductor device having reduced intra-level and inter-level capacitance  
An interconnect structure of a semiconductor device designed for reduced intralevel and interlevel capacitance, and includes a lower metal layer and an upper metal layer and an insulating layer...
7301103 Printed-wiring board, printed-circuit board and electronic apparatus  
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
7301097 Printed-circuit board and electronic device  
A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width...
7301108 Multi-layered interconnect structure using liquid crystalline polymer dielectric  
A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first...
7297877 Substrate with micro-via structures by laser technique  
A substrate to which a laser technique is applied includes a signal layer, a micro via structure, and a differential signal pair. The micro via structure is divided into a first conductive column...
7297875 Fusion bonded assembly with attached leads  
A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the...
7297878 High frequency laminated component and its manufacturing method  
The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object...
Matches 151 - 200 out of 1317 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >