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7432450 |
Printed circuit board
A printed circuit board on which a connector is mounted includes a conductive layer, insulating layers, and a supporting member. A part of the conductive layer is exposed on a top surface of the...
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7427718 |
Ground plane having opening and conductive bridge traversing the opening
Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings...
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7427716 |
Microvia structure and fabrication
A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first...
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7425684 |
Universal systems printed circuit board for interconnections
In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This...
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7420130 |
Wiring board and method for fabricating the same
The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and...
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7420126 |
Circuit board and circuit apparatus using the same
A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a...
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7420129 |
Semiconductor package including a semiconductor device, and method of manufacturing the same
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having...
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7417195 |
Circuit board and circuit board connection structure
A printed circuit board 2 and an FPC board 3 to be connected together are each given a multilayer structure wherein insulating films 23, 33 and interconnection patterns 22, 32 are stacked...
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7410837 |
Method of manufacturing mounting substrate
A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which...
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7411134 |
Hybrid ground grid for printed circuit board
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
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7408120 |
Printed circuit board having axially parallel via holes
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing...
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7405365 |
Wiring substrate and method for manufacturing the same
A wiring substrate of the present invention includes a short ring (SR) formed along a periphery of the substrate, an independent line pattern (e.g., a gate terminal) that is coplanar with and...
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7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing
Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that...
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7405366 |
Interposer and electronic device fabrication method
An interposer 2 including a base 10 formed of a plurality of resin layers 26, 34, 42, 52, 56 ; a thin-film capacitor 12 buried in the base 10 , including a lower electrode 20 , a capacitor...
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7404251 |
Manufacture of printed circuit boards with stubless plated through-holes
A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least...
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7402759 |
Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board
An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third...
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7402760 |
Multi-layer printed wiring board and manufacturing method thereof
A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core...
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7402758 |
Telescoping blind via in three-layer core
A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer,...
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7399661 |
Method for making an integrated circuit substrate having embedded back-side access conductors and vias
A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is...
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7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
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7399930 |
Method and device for repair of a contact pad of a printed circuit board
Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board....
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7400515 |
Circuit board electrode connection structure
An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit...
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7400511 |
Electronic component mounting structure
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and...
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7394028 |
Flexible circuit substrate for flip-chip-on-flex applications
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
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7394027 |
Multi-layer printed circuit board comprising a through connection for high frequency applications
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7388159 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and...
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7388157 |
Printed wiring board
A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers....
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7385144 |
Method and apparatus for electrically connecting printed circuit boards or other panels
A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and...
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7385792 |
Electronic control apparatus
An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is...
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7385143 |
Thermal bonding structure and manufacture process of flexible printed circuit board
A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first...
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7385472 |
Multi-level printed circuit board interstitial vias
A printed circuit board having interstitial vias. The printed circuit board has a plurality of overlying electrical conductors disposed within an inner region of the printed circuit board. The...
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7382629 |
Circuit substrate and method of manufacturing plated through slot thereon
A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple...
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7381905 |
Structure for fixing an electronic device to a substrate
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the...
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7378600 |
Electronic circuit prototyping composite support
A composite support for fabricating a prototype electrical circuit has a rectangular planar board with a plurality of rows and columns of double sided annular toroidal connection eyelets. The...
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7378596 |
Rigid-flex wiring board
A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid...
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7378602 |
Multilayer core board and manufacturing method thereof
A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42 a of a power source layer ...
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7379306 |
Multilayer substrate including components therein
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a...
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7378601 |
Signal transmission structure and circuit substrate thereof
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the...
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7378599 |
Printed circuit board, radio wave receiving converter, and antenna device
A printed circuit board has a substrate formed of an insulator, a strip line provided on a front surface of the substrate, and a ground metal layer provided on a rear surface of the substrate. An...
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7375432 |
Via attached to a bond pad utilizing a tapered interconnect
An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed...
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7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened...
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7375290 |
Printed circuit board via with radio frequency absorber
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers...
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7374811 |
Probe pad structure in a ceramic space transformer
A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a...
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7375289 |
Multi-layer printed wiring board including an alignment mark as an index for a position of via holes
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via...
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7371975 |
Electronic packages and components thereof formed by substrate-imprinting
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7371973 |
Contact node
The contact node comprises at least two metallized contacts coupled with conductive paths arranged on surfaces of connection layers made on the base of a dielectric material and mutually aligned...
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7371976 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7372143 |
Printed circuit board including via contributing to superior characteristic impedance
A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating...
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