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7518882 |
Circuit module
In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As...
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7518066 |
Conformable interface device for improved electrical joint
An interface device for coupling an electrical device to a metal junction includes a conformable conductor plate having a first side and a second side. The interface device also includes a...
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7517730 |
Coreless substrate and manufacturing method thereof
The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via...
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7515430 |
Conductive hook and loop shockmount system
An electrically conductive shock mount system for electrical subassemblies is provided. The shock mount system includes a first assembly having a housing containing a hook member for a hook and...
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7514637 |
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7513037 |
Method of embedding components in multi-layer circuit boards
A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface,...
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7514770 |
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
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7511359 |
Dual die package with high-speed interconnect
Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a...
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7508062 |
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The...
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7507915 |
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having...
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7508681 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal...
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7507914 |
Micro-castellated interposer
A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount...
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7507658 |
Semiconductor apparatus and method of fabricating the apparatus
A via hole is formed by a first step of forming an opening in a resin insulating film by laser radiation, a second step of forming an opening in said resin insulating film by dry etching and a...
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7501586 |
Apparatus and method for improving printed circuit board signal layer transitions
A method and apparatus for improving printed circuit board signal layer transitions are described. In one embodiment, the method includes the formation of a first via within a printed circuit board...
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7495929 |
Reference layer openings
A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.
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7491896 |
Information handling system utilizing circuitized substrate with split conductive layer
An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a...
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7491895 |
Wiring substrate and method of fabricating the same
A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring...
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7488895 |
Method for manufacturing component built-in module, and component built-in module
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating...
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7485812 |
Single or multi-layer printed circuit board with improved via design
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an...
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7479604 |
Flexible appliance and related method for orthogonal, non-planar interconnections
At least one flexible appliance ( 120 ) and related method ( 300 ) for orthogonal, non-planar interconnections of at least a first electronic interface ( 115 ) disposed on a substrate ( 110 ) to an...
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7477523 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist...
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7476813 |
Multilayer flip-chip substrate interconnect layout
The multilayer substrate includes a plurality of layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various...
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7476814 |
Multilayer interconnection board
A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts...
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7473853 |
Circuit device
The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7470865 |
Multilayer printed wiring board and a process of producing same
A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal...
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7470863 |
Microelectronic device with mixed dielectric
A microelectronic device and method of making the microelectronic device is provided. A dielectric substrate having first and second surfaces is provided. A first component, located in the...
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7468894 |
Printed circuit board and method of reducing crosstalk in a printed circuit board
The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7465488 |
Bow control in an electronic package
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one...
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7462939 |
Interposer for compliant interfacial coupling
In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance...
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7462941 |
Power grid layout techniques on integrated circuits
Techniques are provided for reducing the power supply voltage drop introduced by routing conductive traces on an integrated circuit. Techniques for reducing variations in the power supply voltages...
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7462784 |
Heat resistant substrate incorporated circuit wiring board
This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin...
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7462783 |
Semiconductor package having a grid array of pin-attached balls
Semiconductor chip ( 1101 ) of a ball grid array device ( 1100 ) is mounted onto tape substrate ( 1102 ) using attach adhesive ( 1103 ). The metal layer on the top surface of substrate ( 1102 )...
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7459638 |
Absorbing boundary for a multi-layer circuit board structure
The invention comprises an improved PCB board design having particular utility for high frequency application, and especially useful to alleviate the problem of electromagnetic disturbance of...
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7456364 |
Using a thru-hole via to improve circuit density in a PCB
A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one...
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7450396 |
Skew compensation by changing ground parasitic for traces
According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity...
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7449641 |
High-speed signal transmission structure having parallel disposed and serially connected vias
A high-speed signal transmission structure having parallel disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed...
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7446263 |
Multilayer printed circuit board
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
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7442879 |
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component...
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7438969 |
Filling material, multilayer wiring board, and process of producing multilayer wiring board
A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a...
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7438593 |
Component for a printed circuit board and method for fitting a printed circuit board with this component
A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer...
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7440291 |
Method of reducing noise induced from reference plane currents
A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path...
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7434311 |
Printed wiring board manufacturing method
This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both...
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7436681 |
Wiring board with built-in capacitor
The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors...
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7435910 |
Multilayer printed circuit board
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
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7435912 |
Tailoring via impedance on a circuit board
A circuit board includes multiple signal layers, in which signal lines are routed, and reference plane layers, in which power reference planes are provided. To connect signal lines at different...
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7435914 |
Tape substrate, tape package and flat panel display using same
A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be...
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7435913 |
Slanted vias for electrical circuits on circuit boards and other substrates
Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a...
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