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6333471 |
Sheet metal component for double pattern conduction and printed circuit board
A sheet metal component (8) for pattern conduction comprises a lead portion (8a) that is connected to an end portion of a first portion (8c1) of a ceiling portion (8c) by a coupling portion (8d)...
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6333857 |
Printing wiring board, core substrate, and method for fabricating the core substrate
A printed wiring board includes a core substrate including a laminated capacitor. The laminated capacitor includes a plurality of composite dielectric layers and a plurality of metal layers stacked...
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6333472 |
Reduction of crosstalk in data transmission system
A circuit board (1) for use in a connector between cables of a data transmission system has at least one array of input terminals (T1-T8) for incoming signals, at least one array of output...
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6331679 |
Multi-layer circuit board using anisotropic electro-conductive adhesive layer
An anisotropic electro-conductive adhesive layer 14 including an adhesive 15 made of a thermosetting or thermoplastic resin containing electro-conductive particles 16 dispersed therein is formed on...
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6329603 |
Low CTE power and ground planes
Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz,...
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6329609 |
Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology
An electronic component structure assembly comprising a thin film structure bonded to a multilayer ceramic substrate (MLC) using solder connections and wherein a non-conductive, compliant spacer...
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6329604 |
Multilayer printed circuit board
A multilayer printed wiring board prevents unnecessary emission of electromagnetic waves. The board includes at least two signal wiring layers, at least one ground layer, at least one power source...
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6326555 |
Method and structure of z-connected laminated substrate for high density electronic packaging
Structures, methods and materials for making multilayer circuit substrates are disclosed. The structures include bumped structures or microencapsulated conductive particles suitable for use in a...
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6323440 |
Part holder, substrate having same, and method of manufacturing same
A part holder comprising holding members (8, 9) extending upward on a base (10) to hold a part (11), insertion holes (12) penetrating the base (10) and passing lead wires (12) of the part (11)...
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6324067 |
Printed wiring board and assembly of the same
A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed...
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6323439 |
Metal core multilayer resin wiring board with thin portion and method for manufacturing the same
A multilayer resin wiring board includes a metal core substrate having a first main surface and a second main surface; a plurality of wiring layers located on the first and second main surfaces of...
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6324068 |
Electronic component device, and main board for circuit boards
The contours of openings of a solder resist defining exposed portions of electrode pads and the contours of openings of the solder resist defining the contours of register or patterns are...
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6320140 |
One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production
A single-sided circuit substrate for a multilayer printed writing board has an insulating hard substrate, a conductor circuit formed on a surface of the substrate, an adhesive layer formed on the...
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6316737 |
Making a connection between a component and a circuit board
In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression....
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6316731 |
Method of forming a printed wiring board with compensation scales
The present invention provides a printed wiring board formed with a film thereon, wherein the printed wiring board has at least a first reference mark and at least a first scale mark separated from...
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6313411 |
Wafer level contact sheet and method of assembly
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses...
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6312791 |
Multilayer ceramic substrate with anchored pad
Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to a middle pad of the multilayer ceramic substrate by a plurality of vias which in turn...
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6312269 |
Card connector circuit board
The present invention provides a card connector circuit board, which is easy to manufacture and which can provide good electrical characteristics with respect to the signal and ground lines. The...
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6313413 |
Wire structure of substrate for layout detection
The substrate of the present invention mainly includes a plurality of bonding pads, a plurality of ball pads, a plurality of traces, a plurality of holes, a first wire and a second wire. The...
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6310300 |
Fluorine-free barrier layer between conductor and insulator for degradation prevention
Integrated circuit structure having improved resistance in metal against degradation from exposure to fluorine released from a fluorine-containing material by forming a fluorine barrier layer...
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6310301 |
Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same
An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit...
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6307162 |
Integrated circuit wiring
An integrated distribution wiring system for a semiconductor substrate having a number of devices. The distribution system includes additional stripes which are arranged parallel to existing rails...
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6303873 |
Electronic part module and process for manufacturing the same
An inexpensive electronic part module and a process for manufacturing the same, wherein an inexpensive thermoplastic resin is used as the substrate of the circuit board. In order to electrically...
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6303871 |
Degassing hole design for olga trace impedance
An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern...
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6303879 |
Laminated ceramic with multilayer electrodes and method of fabrication
An apparatus which includes a laminated ceramic body with multilayer electrodes and a method of fabricating this apparatus are disclosed. The laminated ceramic body is formed by layers of ceramic...
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6297458 |
Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process
A printed circuit board includes a plurality of dielectric substrates. Each of the dielectric substrates includes a first and a second surface and has a first conductive layer formed on the first...
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6297460 |
Multichip module and method of forming same
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
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6294745 |
Solder anchor decal
A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes...
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6294744 |
Multilayer print circuit board and the production method of the multilayer print circuit board
The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an...
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6291776 |
Thermal deformation management for chip carriers
A chip carrier constituted of an organic laminate which incorporates structure compensating for thermal deformation of the carrier. Moreover, disclosed is a method of counteracting the thermal...
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6291777 |
Conductive feed-through for creating a surface electrode connection within a dielectric body and method of fabricating same
A conductive feed-through providing a conductive path through a dielectric body while maintaining differences in pressure between volumes separated by the dielectric body. A conductive feed-through...
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6292372 |
Solder thieving pad for wave soldered through-hole components
An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit...
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6288905 |
Contact module, as for a smart card, and method for making same
A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a...
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6281448 |
Printed circuit board and electronic components
A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material...
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6281451 |
Electrical cable device
An improved flexible cable construction is provided which includes two layers of conductor traces arranged alternately with three layers of dielectric material in a flattened configuration between...
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6281436 |
Encapsulated surface mounting electronic part
An electronic element is mounted on a resin wiring substrate and a cover member is bonded to the wiring substrate so as to cover the electronic element and constitute an encapsulation region. The...
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6281452 |
Multi-level thin-film electronic packaging structure and related method
A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of...
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6274824 |
Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
An electronic circuit assembly having an arrangement of signal and destination pads for two or more signals which provides multiple signal/destination connection combinations. One embodiment of the...
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6274820 |
Electrical connections with deformable contacts
An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to...
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6274819 |
Method and article for the connection and repair of flex and other circuits
An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article 10 includes: a flexible dielectric substrate 12 having first and...
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6272745 |
Methods for the production of printed circuit boards with through-platings
Methods for the production of printed circuit boards (1) with at least one electrically conductive through-plating which runs in a hole (5) in an insulating base material (2) from a first to a...
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6271478 |
Multi-layer circuit board
A multi-layer circuit board having a decreased number of circuit boards for mounting an electronic part that has connection electrodes arranged in the form of an area array, featuring a high yield...
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6271482 |
Conductive elastomer interconnect
An electrical interconnect comprising a non-conductive substrate having respective opposite surfaces and a plurality of apertures formed therein extending between the respective opposite surfaces,...
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6271483 |
Wiring board having vias
A wiring board has vias which penetrate the wiring board from one side to the other side. The vias are radially arranged in the direction from one side to the other side so that the interval...
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6271479 |
Method and apparatus for connecting an electric component to a printed circuit board
A device for electrical and mechanical connection of an electric high-power component which transmits high-frequency electrical signals to conductors on a circuit board. The component includes...
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6265673 |
Semiconductor element-mounting board and semiconductor device
Conductive members formed of metallic wires constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member are integrally...
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6263565 |
Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same
A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape...
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6262376 |
Chip carrier substrate
A chip carrier substrate including a lower layer and at least one upper layer of copper conductors on a base, a plurality of aluminum studs formed by anodization to be of substantially identical...
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6256880 |
Method for preparing side attach pad traces through buried conductive material
A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and...
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6256874 |
Conductor interconnect with dendrites through film and method for producing same
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming...
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