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6653575 |
Electronic package with stacked connections and method for making same
An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and...
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6646337 |
Wiring circuit substrate and manufacturing method therefor
The present invention prepares a member having a potrusion-forming copper foil 21 formed on a conductor-circuit-forming copper layer 23 via an etching-barrier layer 22 formed of a different...
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6640332 |
Wiring pattern decision method considering electrical length and multi-layer wiring board
A method for determining a wiring pattern of a signal line for connection of a circuit on a multi-layer printed wiring board includes the steps of providing a constraint of an electrical length...
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6639154 |
Apparatus for forming a connection between a circuit board and a connector, having a signal launch
A circuit board includes (i) a section of circuit board material having a signal conductor, a ground conductor, and dielectric material that separates the signal conductor and the ground conductor,...
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6635829 |
Circuit board having side attach pad traces through buried conductive material
A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and...
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6633005 |
Multilayer RF amplifier module
An RF amplifier module includes PC boards laminated atop a bottom conductor plate. The boards include an RF semi-conductor amplifier chip mounted in a well extending to the bottom plate disposed in...
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6630628 |
High-performance laminate for integrated circuit interconnection
A high-performance, integrated circuit interconnection laminate. Power/ground layers in laminates fabricated with open areas to permit out gassing of gases generated during high temperature...
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6630631 |
Apparatus and method for interconnection between a component and a printed circuit board
A first signal routing layer may be formed on a first surface of a printed circuit board (PCB). An array of interconnections may formed on the first surface of the PCB, the array of...
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6630630 |
Multilayer printed wiring board and its manufacturing method
A multilayer printed wiring board includes (a) an inner layer material that includes an insulating substrate, an inner conductive pattern formed of a metal foil and disposed on both sides of the...
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6629367 |
Electrically isolated via in a multilayer ceramic package
A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a...
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6627824 |
Support circuit with a tapered through-hole for a semiconductor chip assembly
A support circuit is adapted to be mechanically and electrically coupled to a semiconductor chip such that the support circuit and the chip in combination form a semiconductor chip assembly. The...
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6627823 |
Multilayered connection plate
A multilayered switching structure is disclosed for the development and the production of an apparatus based on microelectronic components and semiconductor devices. The structure may widely be...
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6627822 |
Electronic assembly with separate power and signal connections
A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate...
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6617520 |
Circuit board
A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An...
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6617529 |
Circuit board and electronic equipment using the same
In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by...
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6617518 |
Enhanced flex cable
A flex cable has a number of conductive wirings for electrically coupling electrical leads of an electrical component to a wiring board. The flex cable has a conductive tab for electrically...
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6617525 |
Molded stiffener for flexible circuit molding
A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A...
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6617522 |
Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of...
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6617526 |
UHF ground interconnects
A via on a printed circuit board having a circuit has a first interconnect and a second interconnect located about at least a portion of the first interconnect. The second interconnect connects to...
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6613979 |
Electrical circuit suspension system
A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a...
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6612025 |
Method for creating a connection within a multilayer circuit board assembly
A method for forming connections within a multi-layer electronic circuit board 10 . The method includes forming an aperture within the circuit board and selectively coating the interior surface of...
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6608757 |
Method for making a printed wiring board
Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with...
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6606252 |
Fastener detection for encased electrical assembly
An encased electrical assembly includes a housing, a printed circuit board (PCB) and a cover. The housing includes a plurality of receiving apertures and the PCB includes a plurality of securing...
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6601292 |
Method for the connection and repair of flex and other circuits
A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges ...
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6603080 |
Circuit board having ferrite powder containing layer
A circuit board of the present invention is adapted to suppress electromagnetic interference. Such a circuit board comprises an electrically conductive transmission layer defining a circuit...
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6603201 |
Electronic substrate
A package substrate having sides, which is formed of multiple non electrically conductive layers laminated together. Each of the multiple non electrically conductive layers is formed of a first...
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6595784 |
Interposer member having apertures for relieving stress and increasing contact compliancy
An interposer member having strategically positioned apertures for electrically connecting an electronic device to a circuitized substrate. The member includes a homogeneous elastomer core having...
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6594891 |
Process for forming multi-layer electronic structures
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material...
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6591491 |
Method for producing multilayer circuit board
A producing method of a multilayer circuit board for ensuring that a circuit board, such as an interposer, is provided on the multilayer circuit board. The method includes the steps forming the...
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6593534 |
Printed wiring board structure with z-axis interconnections
A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a...
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6593535 |
Direct inner layer interconnect for a high speed printed circuit board
A multi-layer printed circuit board includes a non-conductive via which intersects a conductive trace on an inner layer of the board and is adapted to receive a conductive element configured to...
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6590479 |
Integrated microcontact pin and method for manufacturing the same
The invention allows for testing by high velocity signals of high density LSIs prior to being packaged having an electrode spacing on the odder of 150 μm, for example. Coaxial transmission lines ...
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6590165 |
Printed wiring board having throughole and annular lands
In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101˜103 and blind via-holes 141, 142 formed from an outermost...
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6586687 |
Printed wiring board with high density inner layer structure
A printed wiring board (PWB) comprises an inner high density circuit routing component laminated within the wiring board, and plated through holes electrically coupling the inner high density...
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6586686 |
Multilayer printed wiring board and method for manufacturing the same
Holes ( 40 a ) are formed with a laser beam through an insulating substrate ( 40 ) on which a metallic layer ( 42 ) if formed. After the holes ( 40 A) are formed, via holes ( 36 a ) are formed by...
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6581279 |
Method of collectively packaging electronic components
Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated...
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6581280 |
Method for filling high aspect ratio via holes in electronic substrates
High aspect ratio (5:1-30:1) and small (5 μm-125 μm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling...
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6576848 |
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
A wiring structure with crossover capability is disclosed. The wiring utilizes a connection stud in a contact layer, beneath the plane of the otherwise-intersecting lines as a crossover. Thus, a...
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6573461 |
Retaining ring interconnect used for 3-D stacking
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two...
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6573460 |
Post in ring interconnect using for 3-D stacking
A post in ring interconnect used for 3-D stacking. A retaining ring is formed on a pad on a bottom surface of a top PCB substrate to be stacked with a bottom PCB substrate. A post is formed on a...
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6574116 |
Inverter capacitor module and inverter
An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having...
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6571467 |
Method for producing a doublesided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6574114 |
Low contact force, dual fraction particulate interconnect
A compliant interconnect assembly to electrically connect a first electronic device to a second electronic device comprises a contact set including an electrically insulating flexible film having...
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6568073 |
Process for the fabrication of wiring board for electrical tests
The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier...
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6570102 |
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple...
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6570098 |
Printed wiring board and method for producing the same
A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2 , comprised of a core material...
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6566612 |
Method for direct chip attach by solder bumps and an underfill layer
A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is...
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6561410 |
Low cost and high speed 3 load printed wiring board bus topology
A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of...
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6563057 |
Printed circuit board and method for manufacturing same
In a multilayer printed circuit board having a conductor pattern, covered with an insulation layer having via holes, these via holes are filled with a conductor by means of electroless nickel...
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6563058 |
Multilayered circuit board and method for producing the same
A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled...
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