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6747216 |
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least...
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6743985 |
Method and apparatus for increased routing density on printed circuit boards with differential pairs
A method and apparatus for decreasing crosstalk between conductors, particularly differential pairs, that are routed in high-density patterns on printed circuit boards system. In one embodiment of...
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6742247 |
Process for manufacturing laminated high layer count printed circuit boards
The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder...
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6739048 |
Process of fabricating a circuitized structure
A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic...
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6739044 |
Electrical terminal tinning process
A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an...
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6740824 |
Ground connector assembly with substrate strain relief and method of making same
A ground connector assembly ( 20 ) having a substrate ( 22 ) and a ground member ( 24 ). The substrate ( 22 ) is used to retain an electrical circuit and has a ground region ( 34 ), a ground hole (...
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6737588 |
Processes for manufacturing flexible wiring boards and the resulting flexible wiring board
Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the...
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6735857 |
Method of mounting a BGA
Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of...
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6734373 |
Through hole insertion type electronic component and method of packaging same
When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade. Another electrode component including a chip...
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6730859 |
Substrate for mounting electronic parts thereon and method of manufacturing same
A substrate for mounting an electronic part or parts thereon, which comprises a core substrate and at least a set of insulation layer and patterned wiring line layer, which is formed on the...
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6723915 |
Emi-shielding riser card for a computer chassis
An EMI-shielding riser card for reducing electromagnetic radiation from a computer enclosure is disclosed. The EMI-shielding riser card is a six-layer riser card having a connector adjacent its...
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6722031 |
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz,...
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6723927 |
High-reliability interposer for low cost and high reliability applications
An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the...
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6723926 |
Mounting configuration of electric and/or electronic components on a printed circuit board
A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least...
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6720501 |
PC board having clustered blind vias
A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are...
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6717068 |
Circuit board capable of preventing electrostatic breakdown and magnetic head using the same
The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board...
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6717067 |
Circuit board and a method for making the same
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge ...
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6717069 |
Surface-mounting substrate and structure comprising substrate and part mounted on the substrate
A surface-mounting substrate, for mounting thereon a part such as a semiconductor device, which comprises a core substrate, a plurality of layers of patterned wiring lines, which are separated from...
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6717825 |
Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
Two connector printed circuit boards with electrical connections are mounted on opposite sides of a mid-plane printed circuit board at angles to each other. Via holes are positioned on the faces of...
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6717070 |
Printed wiring board having via and method of manufacturing the same
A printed wiring board comprises an insulating layer having first and second surfaces and the wiring layers. The insulating layer has a via electrically connected between the wiring layers. The via...
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6713685 |
Non-circular micro-via
Non-circular vias and methods of cutting away material in a printed circuit board (PCB) so as to form non-circular vias. Laser ablation or plasma ablation is used to remove PCB material about a...
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6713686 |
Apparatus and method for repairing electronic packages
A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the...
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6711812 |
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided....
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6713688 |
Circuit board and its manufacture method
A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2 . Then, each dimension of interface regions 7 ...
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6711814 |
Method of making printed circuit board having inductive vias
A method for increasing the impedance of a via for providing a conductive path through a printed circuit board is disclosed. The method comprises the steps of forming a conductive pad on the...
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6714421 |
Flip chip package substrate
A flip chip package substrate is disclosed. The substrate is correspondingly flip chip bonded to a first chip, a second chip, and so on, wherein these chips are of similar type of pad arrangement...
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6711030 |
Interconnecting method of wiring in printed circuit boards and printed circuit board unit
A printed circuit board unit has smaller number of pins in connectors for connection of wiring (signal lines and power source lines) between a plurality of printed circuit boards for increasing...
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6706972 |
Electronic assembly comprising a sole plate forming a heat sink
The invention concerns an assembly supported on a base plate forming a radiator or capable of being directly mounted on the base plate, comprising a printed circuit card ( 1 ) having its thickness...
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6706564 |
Method for fabricating semiconductor package and semiconductor package
A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a...
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6703564 |
Printing wiring board
A printed wiring board is formed by a printed wiring substrate having a plurality of a wiring layer, and a thermal expansion buffering sheet having lower coefficient of thermal expansion than that...
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6700079 |
Discrete solder ball contact and circuit board assembly utilizing same
Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends...
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6698091 |
Method and apparatus for coupling circuit boards
A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a...
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6700077 |
Packaging substrate with electrostatic discharge protection
The present invention relates to a packaging substrate with electrostatic discharge protection. Each of the mold gates on the substrate is electrically connected to the first copper-mesh layer on...
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6700076 |
Multi-layer interconnect module and method of interconnection
An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on...
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6694612 |
Mask film having a non-parting portion
A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be...
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6678949 |
Process for forming a multi-level thin-film electronic packaging structure
A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern...
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6680440 |
Circuitized structures produced by the methods of electroless plating
The present invention provides new methods for electroless plating of metal particularly gold and copper onto substrates, such as circuitized substrates, which reduces processing steps, reduces...
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6678169 |
Printed circuit board and electronic equipment using the board
An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is...
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6675471 |
Method of producing high-frequency modules
A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub...
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6674017 |
Multilayer-wiring substrate and method for fabricating same
A multilayer-wiring substrate having a via hole structure and method for fabricating the same. Referring to FIGS. 1 ( a ) and 1 ( b ), after a via-hole 5 is formed by exposure and development...
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6670816 |
Test coupon for measuring a dielectric constant of a memory module board and method of use
A test coupon for measuring a dielectric constant of a memory module substrate has a plurality of test pattern layers each having a long trace and a short trace formed thereon. A first test pattern...
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6670556 |
Printed circuit board unit with detachment mechanism for electronic component
A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole for receiving the solder bump. The...
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6668448 |
Method of aligning features in a multi-layer electrical connective device
A method of constructing an electric apparatus, comprising the following steps. First, a set of dielectric layers is provided. Next, a set of conductive features and at least one fiducial marking...
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6662442 |
Process for manufacturing printed wiring board using metal plating techniques
A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24...
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6660945 |
Interconnect structure and method of making same
An interconnect structure having an increased chip connector pad and plated through hole density is provided. In particular, the interconnect structure includes a substrate having at least one...
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6657134 |
Stacked ball grid array
A ball grid array mounted circuit includes a stress relief substrate having spaced conductive vias extending between its surfaces and connection pads at the surfaces. Solder connections formed from...
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6657135 |
Connection structure and electronic circuit board
A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component...
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6657133 |
Ball grid array chip capacitor structure
A BGA-type capacitor structure including a conventional chip capacitor mounted on the upper surface of an inexpensive substrate, and having solder balls mounted on a lower surface of the substrate....
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6651322 |
Method of reworking a multilayer printed circuit board assembly
An improved rework method and rework wiring structure for repairing and reworking multilayer printed circuit boards utilizing ball grid array (BGA) solder pads are described. The repair method...
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6653574 |
Multi-layered substrate with a built-in capacitor design and a method of making the same
A multi-layered substrate having built-in capacitors is disclosed. The substrate comprises at least one high permittivity of dielectric material filled in the through holes between the power plane...
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