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7615708 |
Arrangement of non-signal through vias and wiring board applying the same
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact...
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7615707 |
Printed circuit board and forming method thereof
A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a...
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7615705 |
Enhanced-reliability printed circuit board for tight-pitch components
A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent...
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7609526 |
Circuit board
A circuit board including a capacitor structure formed on a surface of an insulating substrate, wherein the capacitor structure includes paired linear conductive layers arranged on the surface of...
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7608788 |
Plating buss and a method of use thereof
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine...
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7603645 |
Calibration method of insulating washer in circuit board
A calibration method of insulating washer in a circuit board is provided, which includes steps of (a) establishing an equivalent circuit model corresponding to a metal via; (b) depicting an...
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7602615 |
In-grid decoupling for ball grid array (BGA) devices
A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein...
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7601919 |
Printed circuit boards for high-speed communication
Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between...
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7599192 |
Layered structure with printed elements
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7596864 |
Stacked module connector
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire...
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7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
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7586198 |
Innerlayer panels and printed wiring boards with embedded fiducials
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the...
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7576996 |
Telecommunications components having reduced alien crosstalk
A telecommunications system comprising: a first printed circuit board associated with a first port, the first printed circuit board having first plated through holes for receiving first insulation...
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7572984 |
Electronic module with dual connectivity
An electronic module includes electronic circuitry and first and second connection mechanisms, both operationally connected to the electronic circuitry, for mounting the module in a larger...
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7572500 |
Method of manufacturing circuit-forming board and material of circuit-forming board
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and...
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7566833 |
Wired circuit board and production method thereof
A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic...
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7564695 |
Circuit connection structure and printed circuit board
While gradually increasing the widths of signal lines ( 104 a, 104 b, 105 a, 105 b ) of first and second groups of differential signal lines ( 104, 105 ) to suppress attenuation in the lines,...
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7563988 |
Circuit device
Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit,...
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7557302 |
Printed circuit board with electrostatic discharge damage prevention
A printed circuit board for preventing electrostatic discharge damage includes several electronic components thereon. The printed circuit board defines a number of through holes therein. The...
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7554040 |
Printed circuit board and soldering method and apparatus
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each...
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7538440 |
Method for improved high current component interconnections
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is...
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7535729 |
Optoelectronic system and method for its manufacture
An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond...
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7534966 |
Edge connection structure for printed circuit boards
A printed circuit board (PCB) edge connection structure formed by a first PCB having one or more electronic components and printed circuitry provided thereon and a second PCB, having one or more...
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7531387 |
Flip chip mounting method and bump forming method
A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a...
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7529101 |
Assembly retention latch having concave release structure
In one non-limiting aspect thereof this invention provides a structure having a generally planar quadrilateral shape that includes a bottom portion defining a mounting section; a vertical wall...
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7529093 |
Circuit device
A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7514770 |
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a...
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7511965 |
Circuit board device and manufacturing method thereof
In a circuit board device having an electronic component mounted on an electrode land on a board by reflow soldering, voids that adversely affect the solder joint in various ways are prevented from...
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7507914 |
Micro-castellated interposer
A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount...
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7505281 |
Multilayer wiring board for an electronic device
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned...
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7501583 |
Low noise multilayer printed circuit board
A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first...
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7501338 |
Semiconductor package substrate fabrication method
An integrated circuit substrate having embedded lands with etching and plating control features provides improved manufacture of a high-density and low cost mounting and interconnect structure for...
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7498523 |
Direct wire attach
An assembly has a conductive trace on a substrate and at least one conductor electrically coupled to the trace. First and second gaps arranged such that one gap is on either side the trace,...
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7491893 |
Mounting substrate and mounting method of electronic part
A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow...
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7488898 |
Land structure, printed wiring board, and electronic device
A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side....
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7486525 |
Temporary chip attach carrier
A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second...
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7482541 |
Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus
A panel for an electro-optical apparatus, includes a substrate, a plurality of wires formed on the substrate, convex portions formed from resin and provided either on the plurality of wires or on...
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7473854 |
Printed circuit board
A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of...
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7473852 |
Printed-circuit board and circuit unit incorporating the circuit board
A printed-circuit board and a circuit unit incorporating the circuit board. The printed-circuit board capable of achieving a suitable contact area of sealing resin includes a metal circuit pattern...
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7473851 |
Cross-connecting by permutations using configurable printed circuits
The invention relates to wiring in a junction box using a printed circuit panel having on one of its edges N input terminals and on the opposite edge N output terminals, and between said two edges,...
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7473459 |
Method of manufacturing a film printed circuit board
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic...
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7470864 |
Multi-conducting through hole structure
A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a...
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7465882 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias...
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7459637 |
Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
The semiconductor device includes the following: a semiconductor chip, in which an integrated circuit is formed, having a polygon surface, and a plurality of electrodes thereon, that is...
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7459202 |
Printed circuit board
A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the...
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7459055 |
Bonding structure with buffer layer and method of forming the same
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the...
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7458149 |
Printed circuit board and method of manufacturing the same
A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a...
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7457132 |
Via stub termination structures and methods for making same
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub...
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