Matches 351 - 400 out of 1706 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6767616 Metal core substrate and process for manufacturing same  
A metal core substrate comprises a core layer ( 10 ) consisting of first and second metal plates ( 11, 12 ) layered with a third insulating layer ( 13 ) interposed therebetween; first and second...
6768062 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof  
A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof...
6764747 Circuit board and method of producing the same  
A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn...
6763575 Printed circuit boards having integrated inductor cores  
A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated...
6765152 Multichip module having chips on two sides  
A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of...
6762369 Multilayer ceramic substrate and method for manufacturing the same  
A multilayer ceramic substrate includes a glass ceramic body, a conductive pattern, and a via conductor. The conductive pattern is formed in the glass ceramic body and on at least one principal...
6759600 Multilayer wiring board and method of fabrication thereof  
A multilayer wiring board comprising a plurality of conductor patterns stacked with an insulating layer composed of a thermosetting resin interposed between adjacent conductor patterns, wherein the...
6759596 Sequential build circuit board  
The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to...
6759598 Power distribution backplane  
A power distribution backplane includes a pair of metal panels bonded to opposite sides of a dielectric spacer. One panel is for power and the other for ground, and each is painted a different...
6759599 Circuit board, method for manufacturing same, and high-output module  
A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering...
6759597 Wire bonding to dual metal covered pad surfaces  
Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of...
6753482 Semiconductor component with adjustment circuitry  
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration...
6753595 Substrates for semiconductor devices with shielding for NC contacts  
A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of...
6750404 High density printed wiring board having in-via surface mounting, pads  
A multilayer printed wiring board in which surface contact pads are formed by depositing electrically conductive metallic layers directly over blind holes/vias. This allows ball grid array devices...
6747216 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery  
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least...
6743985 Method and apparatus for increased routing density on printed circuit boards with differential pairs  
A method and apparatus for decreasing crosstalk between conductors, particularly differential pairs, that are routed in high-density patterns on printed circuit boards system. In one embodiment of...
6742248 Method of forming a soldered electrical connection  
A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film...
6740823 Solder bonding method, and electronic device and process for fabricating the same  
A solder bonding method comprises the step of solder bonding a first electrode 30 to a second electrode 16 having a solder bump 18 of mainly Sn formed on the upper surface thereof. The first...
6740811 Electric terminal for an electronic device  
An electric terminal of an electronic device includes an external electrode, a flexible lead member for connecting the external electrode to a pad of the electronic device, and a support member for...
6740820 Heat distributor for electrical connector  
An electrical system includes a printed circuit board with conductive traces formed thereon. An electrical connector includes an insulative base with an array of cells defined therein. Each cell...
6740824 Ground connector assembly with substrate strain relief and method of making same  
A ground connector assembly ( 20 ) having a substrate ( 22 ) and a ground member ( 24 ). The substrate ( 22 ) is used to retain an electrical circuit and has a ground region ( 34 ), a ground hole (...
6737589 Flexible printed wiring board  
A flexible printed wiring board is provided, including a flexible electrically insulating polyimide substrate, first and second electrically conductive patterns each including conductive strips...
6734374 Micro-coaxial cable assembly and method for making the same  
A method for soldering braiding layers of wires of a micro-coaxial cable to a substrate, wherein each wire includes a core conductor, an inner insulator, a braiding layer, and an outer insulator,...
6731511 Wiring board, method of manufacturing the same, electronic component, and electronic instrument  
A wiring board includes a wiring pattern having a lands and a line connected to the land, a substrate supporting the wiring pattern, and a protective film provided over the substrate and having an...
6730858 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding  
A circuit board for mounting a part having a plurality of bumps by ultrasonic bonding. The circuit board includes a main body and a conductive layer provided on the main body. The conductive layer...
6727436 Interconnect bus crossover for MEMS  
A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are...
6720501 PC board having clustered blind vias  
A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are...
6717255 Chip carrier for a high-frequency electronic package  
An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact...
6717068 Circuit board capable of preventing electrostatic breakdown and magnetic head using the same  
The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board...
6717421 Electric contact probe assembly  
In an electric contact probe assembly, an electroconductive patch is attached to a part of the support sheet so as to cover a through hole formed in the support sheet from a front side thereof, and...
6717067 Circuit board and a method for making the same  
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge ...
6717069 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate  
A surface-mounting substrate, for mounting thereon a part such as a semiconductor device, which comprises a core substrate, a plurality of layers of patterned wiring lines, which are separated from...
6717071 Coaxial via hole and process of fabricating the same  
A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer...
6717070 Printed wiring board having via and method of manufacturing the same  
A printed wiring board comprises an insulating layer having first and second surfaces and the wiring layers. The insulating layer has a via electrically connected between the wiring layers. The via...
6713686 Apparatus and method for repairing electronic packages  
A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the...
6713684 Hole grid array package and socket technology  
A chip interface assembly and method of assembling a chip interface provide enhanced performance. The chip interface assembly includes a semiconductor package and a socket. The semiconductor...
6713688 Circuit board and its manufacture method  
A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2 . Then, each dimension of interface regions 7 ...
6713683 Wiring board with terminals and method for manufacturing the same  
In a wiring board having a terminal for connection of circuits in a variety of electronic devices, a joining section of the terminal is placed on a connecting section of a wiring pattern on the top...
6711027 Modules having paths of different impedances  
In some embodiments, the invention includes a module including a circuit board and first and second groups of conductors supported by the circuit board. A first group of chips each include on die...
6710266 Add-in card edge-finger design/stackup to optimize connector performance  
A technique to simultaneously reduce high-frequency insertion loss and cross-talk for a multi-layered add-in card is disclosed. The technique is based on selective removal of ground and power...
6710261 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board  
A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates,...
6710256 Apparatus for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member  
An apparatus and a method for connecting high-frequency circuit boards, and for providing an electrical connection between respective electrodes of two high-frequency circuit boards includes an...
6706974 Plane splits filled with lossy materials  
A method of reducing electromagnetic interference and improving signal quality in printed circuit boards with plane splits is described. The use of a lossy slot filling is described. The lossy...
6707683 Circuit board having improved soldering characteristics  
A circuit board having improved soldering characteristics having raised structure consisting of spacer pads arranged to provide for vertical distancing of electrical or electronic components from...
6707677 Chip-packaging substrate and test method therefor  
A chip-packaging substrate and test method therefor. The chip-packaging substrate includes at least one package area and a connection area enclosed by and connected to the package areas. A test...
6703564 Printing wiring board  
A printed wiring board is formed by a printed wiring substrate having a plurality of a wiring layer, and a thermal expansion buffering sheet having lower coefficient of thermal expansion than that...
6703567 Conductor track layer structure and prestage thereof  
The invention relates to a conductor track layer structure precursor stage with conductor tracks, which are disposed on an electrically insulating substrate with an inner region and a lateral...
6700075 Reduced crosstalk ultrasonic piezo film array on a printed circuit board  
A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four...
6700457 Impedance compensation for circuit board breakout region  
In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the...
6700077 Packaging substrate with electrostatic discharge protection  
The present invention relates to a packaging substrate with electrostatic discharge protection. Each of the mold gates on the substrate is electrically connected to the first copper-mesh layer on...
Matches 351 - 400 out of 1706 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >