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6867504 |
Method and apparatus for printed circuit board pads with registering feature for component leads
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component...
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6858807 |
Substrate for receiving a circuit configuration and method for producing the substrate
A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening...
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6858806 |
Process for producing printed circuits and printed circuits thus obtained
There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to...
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6855625 |
Manufacturing method of multilayer substrate
Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor...
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6853557 |
Multi-channel memory architecture
A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second...
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6852931 |
Configuration having an electronic device electrically connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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6852932 |
Circuit board with air-bridge
A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover...
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6853558 |
Surface mount power supply device and associated method
A surface mount power supply device and a method for mounting a lead frame to a circuit board, which has a first and second side, and assembling such a device. The lead frame has leads with a lead...
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6846991 |
Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting
An interconnect for an electrical component. Generally, interconnects of the invention include a substrate, a pair of leads supported on the substrate, and a shunt extending between the leads. In...
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6844505 |
Reducing noise effects in circuit boards
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling...
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6835897 |
Warpage preventing substrate
A warpage preventing substrate is provided. A plurality of first and second conductive traces are respectively formed on a first surface and a second surface of a core layer of the substrate, each...
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6835894 |
Back plane structure for SCSI
A back plane structure for SCSI used in server or array storing machine comprises a plate member including two stacked layers of PCB and an opening therethrough for fluid communication with the...
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6834426 |
Method of fabricating a laminate circuit structure
A method for fabricating a laminate circuit structure is provided. The method comprises: providing at least two modularized circuitized voltage plane subassemblies wherein each of the subassemblies...
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6832436 |
Method for forming a substructure of a multilayered laminate
A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed...
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6833513 |
Crosstalk reduction in a PWB connector footprint
A modified connector footprint on a PWB includes a row of ground vias disposed outside a standard connector footprint that do not mate to pins in the connector. The extra ground vias provide...
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6831235 |
Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof
Each via hole of a printed wiring board is filled with a metal conductor. A distal end of each metal conductor is covered with a diffusing metal layer. The distal end of the metal conductor is...
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6831371 |
Integrated circuit substrate having embedded wire conductors and method therefor
An integrated circuit substrate having embedded wire conductors provides high-density interconnect structure for integrated circuits. Wires are shaped to form a conductive pattern and placed atop a...
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6831234 |
Multilayer printed circuit board
Multilayer printed circuit board includes a core substrate and multilayer wiring layers formed on the core substrate by alternately laminating interlaminar insulating layer and conductor circuit....
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6828513 |
Electrical connector pad assembly for printed circuit board
A connector pad includes projections extending radially outwardly from an inner portion of the pad to help stabilize and reinforce the pad. The added stability allows the radial thickness of an...
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6828512 |
Apparatus and methods for interconnecting components to via-in-pad interconnects
A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material...
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6825679 |
Electrically conductive structure and method for implementing circuit changes on printed circuit boards
An electrically conductive structure and method for making circuit changes on a printed circuit board involves the use of electrically conductive tape to connect two previously unconnected points...
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6818838 |
PCB component placement and trace routing therebetween
An apparatus and method for positioning components on a circuit board and routing traces therebetween is disclosed. The circuit board has two pairs of electrical component-receiving footprint and a...
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6818837 |
Wiring connection structure and transmitter using the same
A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a...
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6818836 |
Printed circuit board and its manufacturing method
A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed...
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6818835 |
Processor and power supply circuit
A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise...
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6815620 |
Flexible circuit with electrostatic damage limiting feature
A flexible circuit incorporating an electrostatic discharge limiting feature, comprising a dielectric substrate selected from polyimide or liquid crystal polymer film having at least one conductive...
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6812412 |
Multi-layer wiring board and method of producing same
A multi-layer wiring board is produced by laminating a plurality of insulating layers having conductor circuits, wherein the conductor circuits of the insulating layers are electrically connected...
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6812411 |
Printed circuit board configuration with a multipole plug-in connector
A printed circuit board configuration with a multipole plug-in connector has plug pins fixed parallel to the board layer on respective signal conductor tracks. The signal conductor tracks are...
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6809268 |
Printed wiring substrate and method for fabricating the same
A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13...
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6807065 |
Multilayer printed circuit board
A multilayer PCB has first and second signal transmission lines and first and second ground layers. A signal via is connected between the first and second transmission lines. Ground vias extending...
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6802120 |
Method of manufacturing a printed wiring board having a non-through mounting hole
A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated...
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6800939 |
Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems
An interconnected mesh plane system includes at least a pair of adjacent metal layers separated by dielectric, each layer having a plurality of spaced power, ground, and signal conductors extending...
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6800813 |
Switch for power tools with integrated switch contacts
A hybrid printed circuit carrier including a ceramic carrier, traces applied on the carrier, circuit components located on said carrier and a plurality of switch contacts. The switch contacts form...
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6801438 |
Electrical circuit and method of formation
A process for forming a circuit pattern on a substrate includes steps of forming a number of electrical circuits on a substrate, which circuits include an electrically conductive bus that...
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6800816 |
Wiring circuit board having bumps and method of producing same
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps...
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6797889 |
Assembly of power circuits and numerical data printed on a multilayer board
A multilayer circuit assembly includes a power circuit and a numerical data circuit. The power circuit includes a power layer and power components. The numerical data circuit includes a numerical...
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6794581 |
Method and apparatus for distributing power to integrated circuits
A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is...
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6794584 |
Conductor strip formed with slit, cutout or grooves
A conductor strip includes a first end portion soldered to a printed circuit board, and a second end portion welded to a rechargeable battery. The conductor strip also includes a connecting portion...
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6794585 |
Printed circuit board having filled throughole with corner rounded portion and manufacturing method
A method includes the steps of forming a first metal foil ( 82 ) on a surface of an insulator substrate ( 1 a ), drilling, with a thermosetting resin film ( 84 ) temporarily fixed to an opposite...
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6794580 |
Solder interconnections for flat circuits
A system and method are provided for facilitating the interconnection of the conductors of a flat circuit. A flat circuit substrate is provided with a plurality of conductors thereon. A dielectric...
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6787711 |
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board...
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6787984 |
Wiring substrate, manufacturing method therefor, and image display device
A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the surface...
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6787708 |
Printed circuit board debug technique
A computer-aided design (CAD) tool is used to create a preliminary design of a mulit-layered printed circuit board, comprising a layout of electrical components on a main region of a printed...
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6787709 |
Compliant electrical contact
A compliant electrical contact having a closed coil with opposed, paraxial leads extending therefrom at an angle from the axis of the coil. The electrically shorted loops of the coil slide on the...
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6787710 |
Wiring board and a method for manufacturing the wiring board
In holes formed in a multi-layer wiring board for transmitting differential signals, a first hole is formed, an insulating portion is formed by filling the first hole with an insulating resin, a...
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6784378 |
Compliant off-chip interconnects
Electronic packages having compliant off-chip interconnects and methods of fabricating compliant off-chip interconnects are disclosed. A representative electronic package includes a substrate and a...
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6784375 |
Interconnection structure for interconnecting printed circuit boards
An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed...
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6779262 |
Method for manufacturing a multilayer printed circuit board
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting...
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6774315 |
Floating interposer
A flexible, compliant layer of a single low modulus material for connecting a chip die directly to a circuit card without encapsulation. The flexible compliant layer provides stress relief caused...
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6774314 |
Electronic device and coupler
An electronic device assembled using a coupler which has an electroconductive region and a resin region on the surface. Flexibility of the resin region absorbs stress caused by difference in...
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