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7019223 |
Solder resist opening to define a combination pin one indicator and fiducial
The present invention features a novel design for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions...
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7016200 |
Module support for electrical/electronic components
In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the...
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7012196 |
Apparatus, method and system for interfacing electronic circuits
A breadboard comprising a plate made of an insulating material and having a connection strip portion including a grouping of at least three rows of sets of at least three spaced apart holes in each...
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7005585 |
Mounting board and electronic device using same
Wiring electrodes are formed on a first principal surface of a base substrate. An insulation film partially covers the first principal surface of the base substrate and the wiring electrodes. The...
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7005586 |
Supplying power/ground to a component having side power/ground pads
In various embodiments, one or more connectors are configured to make electrical contact with side power and ground pads on a component. The connectors may include, in some embodiments, a...
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6995320 |
Wiring board and a packaging assembly using the same
A wiring board includes an insulating board defined by a first surface and a second surface opposing to the first surface; first signal strips disposed on the first surface; a first power...
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6992899 |
Power delivery apparatus, systems, and methods
An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board.
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6992397 |
Electroless nickel immersion gold semiconductor flip chip package
A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex...
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6991470 |
Circuit carrier and production thereof
The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip...
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6989969 |
Integrated lead suspension and method of construction
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal...
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6989493 |
Electrical feedthrough assembly for a sealed housing
An electrical feedthrough assembly for establishing an electrical connection path through an aperture in a side wall of a housing, and a method of fabrication thereof. The feedthrough assembly...
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6984792 |
Dielectric interposer for chip to substrate soldering
A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside...
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6979784 |
Component power interface board
A component may comprise one or more integrated circuits and a component package to which the one or more integrated circuits are coupled. The component package has a bottom comprising a plurality...
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6977349 |
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a...
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6972152 |
Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish...
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6972379 |
Circuit board and a method for making the same
A method 10 for making a multi-layer electronic circuit board 110 having electroplated apertures 18, 20 which may be selectively and electrically isolated from electrically grounded member ...
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6963033 |
Ball grid array attaching means having improved reliability and method of manufacturing same
An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at...
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6961990 |
Method of manufacturing multilayer microwave couplers using vertically-connected transmission line structures
A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure....
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6938336 |
Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top...
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6940024 |
Printed wiring board having wiring patterns and connection terminals
Wiring patterns are made of a conductive material containing Ag particles that exhibit high conductivity. Connection terminals that are connected to the ends of part of the wiring patterns,...
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6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
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6940150 |
Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method
A method of manufacturing a semiconductor wafer device, includes the steps of: (a) forming lower wiring patterns over a semiconductor wafer, the lower wiring patterns being connected to...
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6936775 |
Selectively configurable circuit board
Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate...
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6937477 |
Structure of gold fingers
The present invention provides an improved structure of gold fingers, which is to redesign a conventional gold finger on a packaging substrate into a gold finger set that contains a plurality of...
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6936773 |
Board impedance management
A system and method are disclosed in which separate impedance compensation circuitry is allocated for an interface according to the space occupied on a printed circuit board (PCB) by the interface....
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6930257 |
Integrated circuit substrate having laminated laser-embedded circuit layers
An integrated circuit substrate having laminated laser-embedded circuit layers provides a multi-layer high-density mounting and interconnect structure for integrated circuits. A prepared substrate,...
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6927345 |
Guard ring having electrically isolated lightening bars
A guard ring for protecting against electrostatic discharge (ESD) that has electrically isolated lightning bars has a substrate, a first ring, and a second ring. The first ring is on the substrate...
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6927344 |
Flexible circuit board assembly
A flexible circuit board assembly and method includes a rigid circuit board having a first portion and a second portion separated by a bending region. A plurality of grooves are cut into the...
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6925701 |
Method of making a series of resonant frequency tags
A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a...
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6924440 |
Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at...
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6921867 |
Stress release feature for PWBs
An element, such as a PWB or PCB is provided with elongated lower-stiffness areas, which provide the element with areas of a lower deformation during deformation of the element, such as during a...
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6918178 |
Method of attaching a heat sink to an IC package
An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual...
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6916996 |
Symmetric electrical connection system
A symmetric electrical connection system for balancing impedance between a first node and a third node and impedance between a second node and a fourth node. The system includes a first conducting...
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6914326 |
Solder ball landpad design to improve laminate performance
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary...
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6914200 |
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs...
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6911604 |
Bonding pads of printed circuit board capable of holding solder balls securely
A printed circuit board, which comprises a substrate, a conductive pattern disposed on a surface of said substrate and a solder mask coated on the surface of said substrate and covered over the...
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6909053 |
Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device
In connecting a connecting substrate 4 to a flexible substrate 5 connected to a terminal portion of one of substrates constituting a liquid crystal display panel through an anisotropic...
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6909051 |
Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the...
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6907658 |
Manufacturing methods for an electronic assembly with vertically connected capacitors
An electronic assembly includes one or more discrete capacitors ( 506, 804, 1204 ), which are vertically connected to a housing, such as an integrated circuit package ( 1704 ). Surface mounted...
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6904674 |
Process for manufacturing a printed wiring board
A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner...
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6894228 |
High performance dense wire for printed circuit board
A method and structure for implementing dense wiring, in printed circuit board or chip carrier applications, which provides superior electrical characteristics while preserving the system...
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6888071 |
Layout structure and method for supporting two different package techniques of CPU
A layout structure of a central processing unit (CPU) that supports two different package techniques, comprising a motherboard that comprises the layout structure and a layout method. The layout...
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6885561 |
Multiple chip module with integrated RF capabilities
A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted...
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6881906 |
Printed circuit board comprising a contact sleeve that is mounted thereon
A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a...
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6879494 |
Circuit package for electronic systems
A circuit package has been described for routing long traces between an electronic circuit, such as a phase locked loop, and external circuit components. The traces are routed through two...
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6874959 |
Keyboard assembly
A keyboard assembly having a keyboard membrane and a set of electrical connections. The keyboard membrane includes conductors arranged on the membrane to convey electrical signals generated by...
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6876085 |
Signal layer interconnect using tapered traces
An interconnection device has a substrate that includes a conductive trace having an exposed portion at an edge of the substrate. The exposed portion is tapered toward the edge of the substrate....
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6875930 |
Optimized conductor routing for multiple components on a printed circuit board
A multilayered substrate includes a plurality of connection point groups, each including connection points. At least two inside conductors are each electrically coupled to inside connection points...
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6872893 |
Wiring board provided with passive element and cone shaped bumps
A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one...
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6869664 |
Lightweight circuit board with conductive constraining cores
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal...
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